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公开(公告)号:US3593677A
公开(公告)日:1971-07-20
申请号:US3593677D
申请日:1967-11-09
申请人: BROWN ENGINEERING CO
发明人: MCLAIN JOHN H
CPC分类号: H05K3/3468 , B23K3/0653 , B23K3/0692 , B23K2201/42 , H05K2203/0257 , H05K2203/1572 , Y10S118/04
摘要: Apparatus for applying solder to solderable substrates such as circuit boards includes a brushlike applicator. Molten solder is supplied to the brush and flows onto an article which is to be soldered. A bath of molten solder may be provided adjacent the end of the applicator so that both sides of a substrate may be soldered simultaneously.