Abstract:
In a method for buffering, a buffer buffers data responsive to read and write clock signals. A flag signal from the buffer is for a fill level thereof. The flag signal is toggled responsive to the data buffered being either above or below a set point for the fill level. A phase of the write clock signal is adjusted to a phase of the read clock signal responsive to the toggling of the flag signal. The write clock signal is used to control latency of the buffer. The adjusting of the phase of the write clock signal includes: generating an override signal responsive to the toggling of the flag signal; and inputting the read clock signal and the override signal to a phase adjuster to controllably adjust the phase of the write clock signal to the phase of the read clock signal during operation.
Abstract:
In the disclosed methods, integrated circuit (IC) dice are manufactured from a common specification, and the IC dice are tested for defective circuitry. Respective defect sets are generated to indicate defective circuitry in the IC die. The dice are assigned to bins based on the respective defect sets. For each bin, all IC dice assigned to the bin have equivalent respective defect sets. Product definitions are provided, and each product definition indicates a respective set of circuitry required for a corresponding product. Respective sets of packages are manufactured for each product. In the manufacturing of each package of a respective set of packages for each product, one or more IC dice are selected from a subset of the plurality of bins such that the IC dice have respective defect sets allowed by the product definition of the product. The selected IC dice are then manufactured into the package.
Abstract:
A semiconductor package includes an interposer and a plurality of integrated circuit (IC) dice disposed on and intercoupled via the interposer. A first IC die has a clock speed rating that is greater than a clock speed rating of another of the IC dice. A plurality of programmable voltage tuners are coupled to the plurality of IC dice, respectively. A first voltage tuner is coupled to the first IC die, and the first voltage tuner is programmed to reduce a voltage level of voltage input to the first voltage tuner and output the reduced voltage to the first IC die.
Abstract:
A method for determining a critical junction temperature for a user-design implemented in a field programmable gate array (programmable device), includes: obtaining a static power vs. temperature curve for the user-design implemented in the programmable device; obtaining a system thermal curve for the user-design implemented in the programmable device; and using the static power vs. temperature curve for the user-design implemented in the programmable device and the system thermal curve for the user-design implemented in the programmable device to determine the critical junction temperature.
Abstract:
Some examples described herein provide for a multi-chip structure including one or more memory dies stacked on a die having a programmable integrated circuit (IC). In an example, a multi-chip structure includes a package substrate, a first die, and a second die. The first die includes a programmable IC, and the programmable IC includes a memory controller. The first die is on and attached to the package substrate. The second die includes memory. The second die is stacked on the first die. The memory is communicatively coupled to the memory controller.
Abstract:
Embodiments described herein include techniques for providing information regarding a hardware part using a scannable code so that a customer can make an informed decision when placing the hardware part in a larger computing system. A customer may purchase hardware parts that are categorized into a certain bin which has guaranteed range of power consumption or performance. The customer may over design the computing system to accommodate the worst parameter in the range (e.g., the minimum performance or the maximum power consumption) to ensure the timing or power specifications are not violated. Instead, the embodiments herein provide a scannable code on the hardware part which the customer can use to access a database which stores more granular information about the part. The customer can use the performance parameters to make better informed decisions to determine where to place the part in the computing system.
Abstract:
An example pulse generation circuit includes a parallel-to-serial circuit configured to convert parallel data to serial data according to parallel clock signal and a serial clock signal, the serial data comprises a sequence of pulses; a clock generator configured to generate a clock signal; and a phase controller configured to generate the serial clock signal from the clock signal based on a phase control signal.
Abstract:
Estimating power consumption of a circuit design includes associating, using a processor, each partition of a plurality of partitions of a circuit design with a probability distribution (315). For each partition, the associated probability distribution specifies a distribution for a probability distribution parameter correlated with power consumption for the partition. Using the processor, an output probability distribution specifying power consumption of the circuit design can be calculated according to the probability distribution of each partition of the circuit design (320).
Abstract:
A method, non-transitory computer readable medium, and apparatus for performing single event upset detection and correction are disclosed. For example, the method comprises: setting, by a processor, at least one starting address for each of a plurality of rows of a design for an integrated circuit, setting, by the processor, at least one ending address for each of the plurality of rows of the design, and performing, by the processor, the single event upset detection and correction scan in parallel, from the at least one starting address for each of the plurality of rows to the at least one ending address for each of the plurality of rows.
Abstract:
Some examples described herein provide for a multi-chip structure including one or more memory dies stacked on a die having a programmable integrated circuit (IC). In an example, a multi-chip structure includes a package substrate, a first die, and a second die. The first die includes a programmable IC, and the programmable IC includes a memory controller. The first die is on and attached to the package substrate. The second die includes memory. The second die is stacked on the first die. The memory is communicatively coupled to the memory controller.