公开(公告)号：US20200327851A1

公开(公告)日：2020-10-15

申请号：US16834514

申请日：2020-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongryeol Seo ,  Sangwon Kim ,  Youngkook Kim

IPC: G09G3/32

Abstract: A display apparatus of a plurality of display apparatuses constituting a wall display includes a first board, a second board, and a plurality of display modules. The first board includes a first communication interface including a circuitry for wireless transmission, and a timing controller configured to, in response to information on an image being received, generate a plurality of driving signals for driving the plurality of display modules based on the received information and transmit the plurality of driving signals to the second board through the first communication interface. The second board includes a second communication interface including circuitry for wireless reception, a plurality of interfaces electrically connected to the plurality of display modules, and an IC chip configured to, based on the plurality of driving signals being received through the second interface, provide each of the received driving signals to each of the display modules.

公开(公告)号：US10551735B2

公开(公告)日：2020-02-04

申请号：US15946087

申请日：2018-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongjun Jeong ,  Hyeonjin Shin ,  Sangwon Kim ,  Seongjun Park ,  Minsu Seol ,  Dongwook Lee ,  Yunseong Lee ,  Alum Jung

IPC: G03F7/20 ,  G03F1/62 ,  G03F1/22

Abstract: A pellicle composition for a photomask, a pellicle for a photomask, the pellicle for a photomask being formed from the pellicle composition, a method of forming the pellicle, a reticle including the pellicle, and an exposure apparatus for lithography including the reticle are provided. The pellicle composition includes: at least one selected from graphene quantum dots and a graphene quantum dot precursor, the graphene quantum dots having a size of about 50 nm or less; and a solvent.

公开(公告)号：US20200015016A1

公开(公告)日：2020-01-09

申请号：US16173516

申请日：2018-10-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon Kim ,  Hyeonjin Shin ,  Minsu Seol ,  Dongwook Lee

IPC: H04R7/12 ,  H04R7/06 ,  H04R15/00 ,  H04R19/00 ,  H04R17/00

Abstract: Provided are an acoustic diaphragm and an acoustic device including the same. The acoustic diaphragm may include graphene nanoparticles, and an average particle size of the graphene nanoparticles may be about 10 nm or less. The graphene nanoparticles substantially may have a particle size of about 1 nm to about 10 nm. The graphene nanoparticles may include at least one functional group selected from a hydroxyl group, a carboxyl group, a carbonyl group, an epoxy group, an amine group, and an amide group.

公开(公告)号：US20190384560A1

公开(公告)日：2019-12-19

申请号：US16399344

申请日：2019-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongryeol Seo ,  Sangwon Kim ,  Youngkook Kim ,  Hyewon Lee

IPC: G06F3/14 ,  G09F9/302 ,  H05K5/00

Abstract: A modular display apparatus is provided. The modular display apparatus includes a plurality of display modules, a plurality of connectors, and a processor configured to divide the plurality of display modules into a plurality of groups based on a vertical direction, and based on an order of connection of at least one display module included in each of the plurality of groups, identify the location of each of the at least one display module included in each of the plurality of groups, and based on the identified locations of the display modules, display images, on each of the plurality of the display modules, corresponding to image signals received from an external apparatus.

公开(公告)号：US09905422B2

公开(公告)日：2018-02-27

申请号：US14984189

申请日：2015-12-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keunwook Shin ,  Minsu Seol ,  Hyeonjin Shin ,  Sangwon Kim ,  Seongjun Park

IPC: H01L21/027 ,  H01L21/033 ,  H01L21/02

CPC classification number: H01L21/0332 ,  H01L21/02118 ,  H01L21/02274

Abstract: A 2D material hard mask includes hydrogen, oxygen, and a 2D material layer having a layered crystalline structure. The 2D material layer may be a material layer including one of a carbon structure (for example, a graphene sheet) and a non-carbon structure.

公开(公告)号：US09583358B2

公开(公告)日：2017-02-28

申请号：US14725390

申请日：2015-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon Kim ,  Hyeonjin Shin ,  Seongjun Park

IPC: H01L21/308 ,  H01L21/324 ,  H01L21/02 ,  H01L21/311 ,  H01L21/3213

CPC classification number: H01L21/3081 ,  C09D1/00 ,  G03F7/16 ,  G03F7/168 ,  G03F7/2006 ,  G03F7/327 ,  G03F7/40 ,  H01L21/02115 ,  H01L21/3086 ,  H01L21/31144 ,  H01L21/32139 ,  H01L21/324

Abstract: A hardmask composition may include a solvent and a 2-dimensional carbon nanostructure containing about 0.01 atom % to about 40 atom % of oxygen or a 2-dimensional carbon nanostructure precursor thereof. A content of oxygen in the 2-dimensional carbon nanostructure precursor may be lower than about 0.01 atom % or greater than about 40 atom %. The hardmask composition may be used to form a fine pattern.

Abstract translation: 硬掩模组合物可以包括溶剂和包含约0.01原子％至约40原子％的氧的二维碳纳米结构或其二维碳纳米结构前体。 二维碳纳米结构前体中的氧含量可以低于约0.01原子％或大于约40原子％。 硬掩模组合物可用于形成精细图案。

公开(公告)号：US09530933B2

公开(公告)日：2016-12-27

申请号：US14909297

申请日：2014-07-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junhee Choi ,  Sangwon Kim ,  Hoyoung Ahn ,  Eunhong Lee

IPC: H01L33/00 ,  H01L29/06 ,  H01L33/06 ,  H01L33/32 ,  H01L33/24 ,  H01L33/38

CPC classification number: H01L33/06 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/18 ,  H01L33/24 ,  H01L33/32 ,  H01L33/38 ,  H01L2933/0016

Abstract: Disclosed are GaN based light emitting devices and methods of manufacturing the same using post-mechanical treatment. The GaN based light emitting device includes first and second electrodes, and a flexible substrate which are sequentially stacked, an n-type GaN layer, an activation layer, and a p-type GaN layer interposed between the first and second electrodes and forming a core-shell structure, and a buried layer interposed between the flexible substrate and the first electrode, wherein the first electrode and the core-shell structure are buried in the buried layer.

Abstract translation: 公开了GaN基发光器件及其制造方法，其使用机械后处理。 GaN基发光器件包括第一和第二电极以及依次层叠的柔性衬底，n型GaN层，激活层和插入在第一和第二电极之间的p型GaN层，并形成芯 壳结构，以及插入在柔性基板和第一电极之间的掩埋层，其中第一电极和芯 - 壳结构被埋在掩埋层中。

公开(公告)号：US09337149B2

公开(公告)日：2016-05-10

申请号：US14681313

申请日：2015-04-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-Hyun Im ,  Hyun Park ,  Soongun Lee ,  Chang Seok Lee ,  Sangwon Kim ,  Seongjun Park ,  Hyeon Jin Shin ,  Hanjin Lim

IPC: H01L27/02 ,  H01L23/532 ,  H01L27/108 ,  H01L23/528 ,  H01L21/02 ,  H01L21/3213 ,  H01L29/06 ,  H01L21/768

CPC classification number: H01L23/53276 ,  H01L21/02527 ,  H01L21/32139 ,  H01L21/768 ,  H01L21/76834 ,  H01L21/7685 ,  H01L21/76852 ,  H01L21/76885 ,  H01L23/528 ,  H01L23/53209 ,  H01L23/53214 ,  H01L23/53223 ,  H01L23/53228 ,  H01L23/53238 ,  H01L23/53257 ,  H01L23/53266 ,  H01L23/53271 ,  H01L27/10814 ,  H01L27/10852 ,  H01L27/10855 ,  H01L27/10873 ,  H01L27/10885 ,  H01L27/10888 ,  H01L29/0642 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Semiconductor devices may include a substrate including an active region defined by a device isolation layer, source/drain regions in the active region, word lines extending in a first direction parallel to the active region and being arranged in a second direction crossing the first direction, a bit line pattern extending in the second direction and crossing over a portion of the active region positioned between the word lines, and a graphene pattern covering at least a portion of the bit line pattern.

Abstract translation: 半导体器件可以包括：衬底，其包括由器件隔离层限定的有源区，有源区中的源极/漏极区，在与有源区平行的第一方向上延伸的并且沿与第一方向交叉的第二方向布置的字线; 在第二方向上延伸并与位于字线之间的有源区的一部分交叉的位线图形，以及覆盖位线图案的至少一部分的石墨烯图案。

公开(公告)号：US20160005625A1

公开(公告)日：2016-01-07

申请号：US14545909

申请日：2015-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonjin Shin ,  Sangwon Kim ,  Seongjun Park

IPC: H01L21/47 ,  C08K3/38 ,  C08K3/30 ,  H01L21/4757

CPC classification number: G03F7/11 ,  C08G83/001 ,  C08K3/30 ,  C08K3/38 ,  C08K2003/3009 ,  C08K2003/385 ,  G03F7/094 ,  G03F7/40 ,  H01L21/0271 ,  H01L21/47 ,  H01L21/47573

Abstract: A hardmask composition includes a first material including one of an aromatic ring-containing monomer and a polymer containing a repeating unit including an aromatic ring-containing monomer, a second material including at least one of a hexagonal boron nitride and a precursor thereof, a chalcogenide-based material and a precursor thereof, and a two-dimensional carbon nanostructure and a precursor thereof, the two-dimensional carbon nanostructure containing about 0.01 atom % to about 40 atom % of oxygen, and a solvent.

Abstract translation: 硬掩模组合物包括包含含芳环的单体和含有含芳环单体的重复单元的聚合物的第一材料，包含六方氮化硼及其前体中的至少一种的第二材料，硫族化物 的二氧化硅材料及其前体，二维碳纳米结构及其前体，含有约0.01原子％至约40原子％氧的二维碳纳米结构和溶剂。

公开(公告)号：US08816509B2

公开(公告)日：2014-08-26

申请号：US13733481

申请日：2013-01-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Seok Hong ,  Kwang-chul Choi ,  Sangwon Kim ,  Hyun-Jung Song ,  Eun-Kyoung Choi

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/02 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L25/065 ,  H01L25/00 ,  H01L23/31

CPC classification number: H01L23/29 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/29017 ,  H01L2224/29036 ,  H01L2224/29099 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/33051 ,  H01L2224/33505 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83986 ,  H01L2224/84201 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/00012

Abstract: A semiconductor package includes first and second semiconductor elements electrically interconnected by a connection structure. The first and second semiconductor elements are joined by a protection structure that includes an adhesive layer surrounded by a retention layer.

Abstract translation: 半导体封装包括通过连接结构电互连的第一和第二半导体元件。 第一和第二半导体元件通过保护结构连接，保护结构包括由保持层包围的粘合剂层。