公开(公告)号：US11699629B2

公开(公告)日：2023-07-11

申请号：US17213974

申请日：2021-03-26

申请人： Qorvo US, Inc.

发明人： Anthony Chiu ,  Bror Peterson ,  Andrew Ketterson

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L25/18 ,  H01L23/48 ,  H01L23/66 ,  H01L23/00 ,  H01L49/02

CPC分类号： H01L23/367 ,  H01L23/3736 ,  H01L23/3738 ,  H01L23/481 ,  H01L23/66 ,  H01L24/29 ,  H01L24/32 ,  H01L25/18 ,  H01L28/90 ,  H01L2223/6683 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32265

摘要： The disclosure is directed to an integrated circuit (IC) die stacked with a backer die, including capacitors and thermal vias. The backer die includes a substrate material to contain and electrically insulate one or more capacitors at a back of the IC die. The backer die further includes a thermal material that is more thermally conductive than the substrate material for thermal spreading and increased heat dissipation. In particular, the backer die electrically couples capacitors to the IC die in a stacked configuration while also spreading and dissipating heat from the IC die. Such a configuration reduces an overall footprint of the electronic device, resulting in decreased integrated circuits (IC) packages and module sizes. In other words, instead of placing the capacitors next to the IC die, the capacitors are stacked on top of the IC die, thereby reducing an overall surface area of the package.

公开(公告)号：US20230197629A1

公开(公告)日：2023-06-22

申请号：US17557551

申请日：2021-12-21

申请人： Qorvo US, Inc.

发明人： Zhunming Du ,  Christopher Sanabria ,  Timothy M. Gittemeier ,  Terry Hon ,  Anthony Chiu ,  Tariq Lodhi

IPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66

CPC分类号： H01L23/552 ,  H01L23/047 ,  H01L23/66 ,  H01L2223/6683

摘要： The disclosure is directed to an electronic device with a lid to manage radiation feedback. The electronic device includes a lid having at least one sidewall and a top wall, as well as a semiconductor positioned within a cavity of the lid. In certain embodiments, the lid includes at least one dielectric material and at least one internal conductive layer at least partially embedded within the at least one dielectric material. In certain embodiments, the lid includes dielectric material, as well as an internal wall extending from the top wall and positioned between an input port and an output port of the semiconductor. Such configurations may suppress any undesirable feedback through the lid between the input port and the output port of the semiconductor.

公开(公告)号：US11303009B2

公开(公告)日：2022-04-12

申请号：US16653387

申请日：2019-10-15

申请人： Qorvo US, Inc.

发明人： Anthony Chiu ,  Bror Peterson ,  Michael Arnold

IPC分类号： H01Q1/22 ,  H01L23/31

摘要： System-in-package (SiP) devices are disclosed that include power amplifiers and controllers such as beamformer integrated circuits that are packaged together. Packaging and thermal management configurations are disclosed that allow a plurality of power amplifiers and a beamformer integrated circuit to operate efficiently while in close proximity to one another. SiP devices are disclosed that include heat spreaders that are incorporated within the SiP devices and exposed at top surfaces of the SiP devices to effectively dissipate heat. Heat spreaders may be provided as part of a lead frame that allows multiple SiP devices to be uniformly assembled with dimensions sized for high frequency applications, including millimeter wave operation.

公开(公告)号：US20210050650A1

公开(公告)日：2021-02-18

申请号：US16653387

申请日：2019-10-15

申请人： Qorvo US, Inc.

发明人： Anthony Chiu ,  Bror Peterson ,  Michael Arnold

IPC分类号： H01Q1/22 ,  H01L23/31

摘要： System-in-package (SiP) devices are disclosed that include power amplifiers and controllers such as beamformer integrated circuits that are packaged together. Packaging and thermal management configurations are disclosed that allow a plurality of power amplifiers and a beamformer integrated circuit to operate efficiently while in close proximity to one another. SiP devices are disclosed that include heat spreaders that are incorporated within the SiP devices and exposed at top surfaces of the SiP devices to effectively dissipate heat. Heat spreaders may be provided as part of a lead frame that allows multiple SiP devices to be uniformly assembled with dimensions sized for high frequency applications, including millimeter wave operation.

公开(公告)号：US20180061730A1

公开(公告)日：2018-03-01

申请号：US15364752

申请日：2016-11-30

申请人： Qorvo US, Inc.

发明人： Kevin J. Anderson ,  Anthony Chiu ,  Tarak A. Railkar

IPC分类号： H01L23/367 ,  H01L23/498 ,  H01L23/00 ,  H01L23/373 ,  H01L23/66

CPC分类号： H01L23/367 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2224/1403 ,  H01L2224/14519 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32235 ,  H01L2224/32237 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： The present disclosure relates to an air-cavity package, which includes a substrate, a base, and a semiconductor die. The substrate includes a substrate body, thermal vias extending through the substrate body, and a metal trace on a bottom side of the substrate body and separate from the thermal vias. The base includes a base body, a perimeter wall extending about a perimeter of the base body, and a signal via structure. Herein, the bottom side of the substrate body resides on the perimeter wall to form a cavity, and the signal via structure extends through the perimeter wall and is electrically coupled to the metal trace. The semiconductor die is mounted on the bottom side of the substrate body, exposed to the cavity, and electrically coupled to the metal trace. The thermal vias conduct heat generated from the semiconductor die toward a top side of the substrate body.

公开(公告)号：US09899292B2

公开(公告)日：2018-02-20

申请号：US15231922

申请日：2016-08-09

申请人： Qorvo US, Inc.

发明人： Anthony Chiu ,  Craig Steinbeiser ,  Oleh Krutko ,  John Beall

IPC分类号： H01L33/00 ,  H01L23/367 ,  H01L23/055 ,  H01L23/66 ,  H01L23/552 ,  H01L23/498

CPC分类号： H01L23/3675 ,  H01L23/055 ,  H01L23/49827 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16153 ,  H01L2924/00014

摘要： Top-side cooling of Radio Frequency (RF) products in air cavity packages is provided. According to one aspect, an air cavity package comprises a substrate, a RF component mounted to the substrate, and a lid structure comprising a first material and being mounted to the substrate that covers the RF component such that a cavity is formed within the lid structure and about the RF component. At least one opening is provided in a top portion of the lid. The air cavity package also comprises a heat transfer structure comprising a second material and comprising a heat path extending from the top surface of the substrate through the opening(s) in the lid to the top outer surface of the air cavity package to provide a top-side thermal interface. In one embodiment, the lid is comprised of a molded material that absorbs RF signals and the heat transfer structure is metal.