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公开(公告)号:US20200176563A1
公开(公告)日:2020-06-04
申请号:US16781856
申请日:2020-02-04
Applicant: QUALCOMM Incorporated
Inventor: Xiangdong CHEN , Venugopal BOYNAPALLI , Hyeokjin LIM
IPC: H01L29/06 , H01L27/02 , H01L27/118 , H01L23/528 , H01L29/66 , H01L23/522 , H01L23/532
Abstract: A chip includes a first gate extended along a second lateral direction, a first source electrically coupled to a power rail, and a first metal interconnect extended along a first lateral direction approximately perpendicular to the second lateral direction, wherein the first metal interconnect lies above the first gate and the first source, and the first metal interconnect is configured to electrically couple the first gate to the first source. The chip also includes a second gate extended along the second lateral direction, a second source electrically coupled to the power rail, and a second metal interconnect extended along the first lateral direction, wherein the second metal interconnect lies above the second gate and second source, the second metal interconnect is configured to electrically couple the second gate to the second source, and the first metal interconnect is aligned with the second metal interconnect in the second lateral direction.
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公开(公告)号:US20170287933A1
公开(公告)日:2017-10-05
申请号:US15264560
申请日:2016-09-13
Applicant: QUALCOMM Incorporated
Inventor: Xiangdong CHEN , Venugopal BOYNAPALLI , Satyanarayana SAHU , Hyeokjin LIM , Mukul GUPTA
IPC: H01L27/118 , H01L29/06
CPC classification number: H01L27/11807 , H01L27/0207 , H01L29/0642 , H01L29/0649 , H01L2027/11829 , H01L2027/11866
Abstract: A standard cell IC includes pMOS transistors in a pMOS region of a MOS device. The pMOS region extends between a first cell edge and a second cell edge opposite the first cell edge. The standard cell IC further includes nMOS transistors in an nMOS region of the MOS device. The nMOS region extends between the first cell edge and the second cell edge. The standard cell IC further includes at least one single diffusion break located in an interior region between the first cell edge and the second cell edge that extends across the pMOS region and the nMOS region to separate the pMOS region into pMOS subregions and the nMOS region into nMOS subregions. The standard cell IC includes a first double diffusion break portion at the first cell edge. The standard cell IC further includes a second double diffusion break portion at the second cell edge.
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公开(公告)号:US20170257080A1
公开(公告)日:2017-09-07
申请号:US15061055
申请日:2016-03-04
Applicant: QUALCOMM Incorporated
Inventor: Seid Hadi RASOULI , Xiangdong CHEN , Venugopal BOYNAPALLI
CPC classification number: H03K3/012 , H03K3/356104 , H03K3/35625
Abstract: In one example, the apparatus includes a first AND gate, a second AND gate, a first NOR gate, a second NOR gate, a third NOR gate, a first inverter, and a second inverter. The first AND gate output is coupled to the first NOR gate first input. The first NOR gate output is coupled to the second NOR gate first input. The second NOR gate output is coupled to the first NOR gate second input. The first inverter output is coupled to the first AND gate second input and the second NOR gate second input. The second AND gate first input is coupled to the first inverter output. The third NOR gate first input is coupled to the second NOR gate output. The third NOR gate second input is coupled to the second AND gate output. The second inverter output is coupled to the second AND gate second input.
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公开(公告)号:US20250150080A1
公开(公告)日:2025-05-08
申请号:US18504062
申请日:2023-11-07
Applicant: QUALCOMM Incorporated
Inventor: Ramaprasath VILANGUDIPITCHAI , Venkat NARAYANAN , Giby SAMSON , Venugopal BOYNAPALLI
IPC: H03K19/0185 , H03K3/012 , H03K3/356
Abstract: At least one integrated power management cell of an IC includes a first cell, which is a 4-height cell, that includes a first continuous n-well, a first power interconnect coupled to a first voltage source associated with a first voltage domain and to the first continuous n-well, a second continuous n-well, a second power interconnect coupled to a second voltage source associated with a second voltage domain and to the second continuous n-well, a first subset of a first voltage level shifter associated with the first voltage domain and coupled to the first power interconnect, and a second subset of the first voltage level shifter associated with the second voltage domain and coupled to the second power interconnect.
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公开(公告)号:US20240249056A1
公开(公告)日:2024-07-25
申请号:US18156999
申请日:2023-01-19
Applicant: QUALCOMM Incorporated
Inventor: Hyeokjin LIM , Ankur MEHROTRA , Renukprasad HIREMATH , Foua VANG , Manjanaika CHANDRANAIKA , Akhtar ALAM , Kamesh MEDISETTI , Seung Hyuk KANG , Venugopal BOYNAPALLI
IPC: G06F30/392 , H01L21/768 , H01L23/48 , H01L23/498 , H01L23/528 , H01L27/02
CPC classification number: G06F30/392 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/5286 , H01L27/0207
Abstract: A chip includes a spare cell including a first active region, and a first gate extending over the first active region in a first direction. The chip also includes a tie cell including a second active region, a second gate extending over the second active region in the first direction, a first drain contact formed over the second active region, a first source contact formed over the second active region, wherein the second gate is between the first drain contact and the first source contact, and first source contact is coupled to a first rail, and a circuit configured to couple the second gate to a second rail. The chip also includes a metal routing extending in a second direction, wherein the second direction is perpendicular to the first direction, and the first metal routing is coupled to the first drain contact and the first gate.
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公开(公告)号:US20220115405A1
公开(公告)日:2022-04-14
申请号:US17065746
申请日:2020-10-08
Applicant: QUALCOMM Incorporated
Inventor: Hyeokjin LIM , Venugopal BOYNAPALLI , Foua VANG , Seung Hyuk KANG
IPC: H01L27/118
Abstract: A MOS IC includes first and second sets of adjacent transistor logic, each of which include collinear gate interconnects extending in a first direction with the same gate pitch. The first set of transistor logic has a first cell height h1 and a first number of Mx layer tracks that extend unidirectionally in a second direction orthogonal to the first direction. The second set of transistor logic has a second cell height h2 and a second number of Mx layer tracks that extend unidirectionally in the second direction, where h2>h1 and the second number of Mx layer tracks is greater than the first number of Mx layer tracks. At least one of a height ratio hR=h2/h1 is a non-integer value or a subset of the first set of transistor logic and a subset of the second set of transistor logic are within one logic cell.
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公开(公告)号:US20180183439A1
公开(公告)日:2018-06-28
申请号:US15393180
申请日:2016-12-28
Applicant: QUALCOMM Incorporated
Inventor: Satyanarayana SAHU , Xiangdong CHEN , Venugopal BOYNAPALLI , Hyeokjin LIM , Mickael MALABRY , Mukul GUPTA
IPC: H03K19/0948 , H01L27/118 , H01L23/528 , H01L23/522
CPC classification number: H03K19/0948 , H01L23/522 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/0924 , H01L27/11807 , H01L2027/11853 , H01L2027/11875 , H01L2027/11887 , H01L2027/11888
Abstract: A MOS device of an IC includes pMOS and nMOS transistors. The MOS device further includes a first Mx layer interconnect extending in a first direction and coupling the pMOS and nMOS transistor drains together, and a second Mx layer interconnect extending in the first direction and coupling the pMOS and nMOS transistor drains together. The first and second Mx layer interconnects are parallel. The MOS device further includes a first Mx+1 layer interconnect extending in a second direction orthogonal to the first direction. The first Mx+1 layer interconnect is coupled to the first Mx layer interconnect and the second Mx layer interconnect. The MOS device further includes a second Mx+1 layer interconnect extending in the second direction. The second Mx+1 layer interconnect is coupled to the first Mx layer interconnect and the second Mx layer interconnect. The second Mx+1 layer interconnect is parallel to the first Mx+1 layer interconnect.
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公开(公告)号:US20170237434A1
公开(公告)日:2017-08-17
申请号:US15044988
申请日:2016-02-16
Applicant: QUALCOMM Incorporated
Inventor: Qi YE , Animesh DATTA , Venkatasubramanian NARAYANAN , Venugopal BOYNAPALLI
IPC: H03K19/003 , H03K3/037
CPC classification number: H03K19/00384 , H03K3/033 , H03K3/0375 , H03K5/04
Abstract: The apparatus may include a first latch configured to store a first state or a second state. The first latch may have a first latch input, one of a set input or a reset input, a first pulse clock input, and a first latch output. The first latch input may be coupled to a fixed logic value. The one of the set input or the reset input may be coupled to a clock signal or an inverted clock signal, respectively. The apparatus may include an AND gate having a first AND gate input, a second AND gate input, and a first AND gate output. The clock signal may be coupled to the first AND gate input. The first latch output may be coupled to the second AND gate input. The AND gate output may be configured to output a pulsed clock. The pulsed clock may be coupled to the first pulse clock input.
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公开(公告)号:US20220093594A1
公开(公告)日:2022-03-24
申请号:US17025211
申请日:2020-09-18
Applicant: QUALCOMM Incorporated
Inventor: Stanley Seungchul SONG , Deepak SHARMA , Bharani CHAVA , Hyeokjin LIM , Peijie FENG , Seung Hyuk KANG , Jonghae KIM , Periannan CHIDAMBARAM , Kern RIM , Giridhar NALLAPATI , Venugopal BOYNAPALLI , Foua VANG
IPC: H01L27/095 , H03K19/0185 , H01L23/528 , H01L29/78
Abstract: Field-effect transistor (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals. A FET circuit is provided that includes a FET that includes a conduction channel, a source, a drain, and a gate. The FET circuit also includes a topside metal contact electrically coupled with at least one of the source, drain, and gate of the FET. The FET circuit also includes a backside metal contact electrically coupled with at least one of the source, drain, and gate of the FET. The FET circuit also includes topside and backside metal lines electrically coupled to the respective topside and backside metal contacts to provide power and signal routing to the FET. A complementary metal oxide semiconductor (CMOS) circuit is also provided that includes a PFET and NFET that each includes a topside and backside contact for power and signal routing.
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公开(公告)号:US20200335151A1
公开(公告)日:2020-10-22
申请号:US16849616
申请日:2020-04-15
Applicant: QUALCOMM Incorporated
Inventor: Chulmin JUNG , Keejong KIM , Changho JUNG , Venugopal BOYNAPALLI
IPC: G11C11/4091 , G11C11/4094 , G11C11/4099 , G11C11/4074 , G11C11/408
Abstract: A charge-transfer transistor couples between a bit line and a sense node for a sense amplifier. During a read operation, a charge-transfer driver drives a gate voltage of the charge-transfer transistor to control whether the charge-transfer transistor conducts during a charge-transfer period. Prior to the charge-transfer period, a bitcell is coupled to the bit line to drive a bitcell-effected voltage on to the bit line. The charge-transfer driver drives the gate voltage such that the charge-transfer transistor only conducts when the bitcell-effected voltage equals a pre-charge voltage for the bit line.
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