SYSTEMS AND METHODS FOR WAFER-LEVEL LOOPBACK TEST
    16.
    发明申请
    SYSTEMS AND METHODS FOR WAFER-LEVEL LOOPBACK TEST 有权
    用于水平回波测试的系统和方法

    公开(公告)号:US20160025807A1

    公开(公告)日:2016-01-28

    申请号:US14339224

    申请日:2014-07-23

    CPC classification number: G01R31/3177 G01R31/31716 G01R31/318513

    Abstract: Circuits and methods for loopback testing are provided. A die incorporates a receiver (RX) to each transmitter (TX) as well as a TX to each RX. This architecture is applied to each bit so, e.g., a die that transmits or receives 32 data bits during operation would have 32 transceivers (one for each bit). Focusing on one of the transceivers, a loopback architecture includes a TX data path and an RX data path that are coupled to each other through an external contact, such as a via at the transceiver. The die further includes a transmit clock tree feeding the TX data path and a receive clock tree feeding the RX data path. The transmit clock tree feeds the receive clock tree through a conductive clock node that is exposed on a surface of the die. Some systems further include a variable delay in the clock path.

    Abstract translation: 提供了用于环回测试的电路和方法。 一个管芯将每个发射器(TX)的接收器(RX)以及每个接收器的TX都包含在内。 该架构被应用于每个位,因此,例如,在操作期间发送或接收32个数据位的管芯将具有32个收发器(每个位一个)。 专注于收发器之一,环回架构包括TX数据路径和RX数据路径,其通过诸如收发器之间的通孔的外部接点相互耦合。 芯片还包括馈送TX数据路径的发射时钟树和馈送RX数据路径的接收时钟树。 传输时钟树通过露出在芯片表面上的导电时钟节点馈送接收时钟树。 一些系统还包括时钟路径中的可变延迟。

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