公开(公告)号：US09536188B2

公开(公告)日：2017-01-03

申请号：US14677836

申请日：2015-04-02

Applicant: NXP B.V.

Inventor： Patrick Schoengrundner ,  Ernst Eiper ,  Christian Zenz

IPC: G06K19/06 ,  G06K19/077 ,  H01L23/00

CPC classification number: G06K19/07769 ,  G06K19/07747 ,  G06K19/07754 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate, which is a component of a dual-interface IC card. Other embodiments are also described.

Abstract translation: 描述了用于制造双接口IC卡组件的双接口集成电路（IC）卡组件和方法。 在一个实施例中，双接口IC卡部件包括单面接触基部结构，其包括具有电接触层的基板。 在单面接触基底结构上，一个或多个天线接触引线附接到单面接触基底结构以通过施加粘合剂材料以部分地覆盖至少一个天线的重叠区域而形成双界面接触结构 接触和基板，它是双接口IC卡的组件。 还描述了其它实施例。

公开(公告)号：US09779349B2

公开(公告)日：2017-10-03

申请号：US14607517

申请日：2015-01-28

Applicant: NXP B.V.

Inventor： Reinhard Rogy ,  Christian Zenz

IPC: G06K19/06 ,  G06K19/077 ,  H01L23/00

CPC classification number: G06K19/07754 ,  G06K19/07743 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07752 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10T29/49018

Abstract: In a method of producing a transponder (T1, T2, T3), a substrate (1, 91) is provided. The substrate (9, 91) comprises a first area (2), a second area (3) adjacent to the first area (2), and a first electric contact (8, 98) adjacent to the second area (3). An electric device (50, 80) is placed in or on the first area (2), preferably without touching the first electric contact (8, 98). Subsequently, a conductive glue (12) is applied on the second area (3) and on the first electric contact (8, 98) so that the conductive glue (12) electrically couples the first electric contact (8, 98) with the electric device (50, 80).

公开(公告)号：US20170140257A1

公开(公告)日：2017-05-18

申请号：US15331739

申请日：2016-10-21

Applicant: NXP B.V.

Inventor： Christian Zenz

IPC: G06K19/077 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L23/66

CPC classification number: G06K19/07754 ,  G06K19/07769 ,  H01L21/4853 ,  H01L23/49838 ,  H01L23/49855 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6677 ,  H01L2224/48227 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/45099

Abstract: The disclosure relates to a dual-interface integrated circuit (IC) card. Embodiments disclosed include a dual-interface card (100) comprising: a card body (122) containing an antenna (120), the antenna having first and second antenna connections; and a dual-interface integrated circuit card module (150) comprising: a substrate (104) having first and second opposing surfaces; a contact area (102) on the first surface of the substrate (104), the contact area (102) comprising a plurality of contact pads (108) and first and second routing connections (106) each having a first end and a second end; an integrated circuit (110) on the second surface of the substrate (104); electrical connections through the substrate (104) connecting the integrated circuit (110) to the plurality of contact pads (108) and to the first end of each of the first and second routing connections (106); and first and second antenna connectors (118) disposed in respective first and second holes (103) in the substrate (104) and in electrical contact with the second end of the respective first and second routing connections, wherein the first and second antenna connectors (118) of the card module are electrically connected to the first and second antenna connections of the card body (122).

公开(公告)号：US20170092612A1

公开(公告)日：2017-03-30

申请号：US15283260

申请日：2016-09-30

Applicant: NXP B.V.

Inventor： Christian Zenz

IPC: H01L23/00 ,  G06K19/077 ,  H01Q1/22

Abstract: The disclosure relates to a dual-interface integrated circuit (IC) card module for use in a dual-interface IC card. Embodiments disclosed include a dual-interface integrated circuit card module (150), the module comprising: a substrate (104) having first and second opposing surfaces; a contact pad (102) on the first surface of the substrate; an integrated circuit (110) on the second surface of the substrate (104), the integrated circuit (110) having electrical connections to the contact pad (102) through the substrate (104); and a pair of antenna pads (108) disposed in recesses (103) in the second surface of the substrate (104) and electrically connected to corresponding antenna connections on the integrated circuit (110).

公开(公告)号：US09196537B2

公开(公告)日：2015-11-24

申请号：US13967164

申请日：2013-08-14

Applicant: NXP B.V.

Inventor： Leonardus Antonius Elisabeth Van Gemert ,  Hartmut Buenning ,  Tonny Kamphuis ,  Sascha Moeller ,  Christian Zenz

IPC: H01L21/30 ,  H01L21/46 ,  H01L21/78 ,  H01L21/301 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/782 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L21/782 ,  H01L21/50 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/31 ,  H01L23/3114 ,  H01L23/3178 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/11 ,  H01L29/0657 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2924/014

Abstract: Consistent with an example embodiment, there is a method for assembling a wafer level chip scale processed (WLCSP) wafer; The wafer has a topside surface and an back-side surface, and a plurality of device die having electrical contacts on the topside surface. The method comprises back-grinding, to a thickness, the back-side surface the wafer. A protective layer of a thickness is molded onto the backside of the wafer. The wafer is mounted onto a sawing foil; along saw lanes of the plurality of device die, the wafer is sawed, the sawing occurring with a blade of a first kerf and to a depth of the thickness of the back-ground wafer. Again, the wafer is sawed along the saw lanes of the plurality of device die, the sawing occurring with a blade of a second kerf, the second kerf narrower than the first kerf, and sawing to a depth of the thickness of the protective layer. The plurality of device die are separated into individual device die. Each individual device die has a protective layer on the back-side, the protective layer having a stand-off distance from a vertical edge of the individual device die.

Abstract translation: 与示例性实施例一致，存在用于组装晶片级芯片尺寸处理（WLCSP）晶片的方法; 晶片具有顶侧表面和背面表面，以及在顶侧表面上具有电触头的多个器件裸片。 该方法包括对晶片的背面进行背面研磨至厚度。 在晶片的背面上模制厚度保护层。 将晶片安装在锯片上; 沿着多个器件裸片的锯条，晶片被锯切，锯切发生在第一切口的刀片和背面晶片厚度的深度上。 再次，晶片沿着多个器件裸片的锯条被锯切，锯切发生在第二切口的刀片上，第二切口比第一切口窄，并锯切到保护层厚度的深度。 将多个器件裸片分离为单个器件管芯。 每个单独的器件管芯在背面具有保护层，保护层具有与单独器件管芯的垂直边缘的间隔距离。

公开(公告)号：US20150278674A1

公开(公告)日：2015-10-01

申请号：US14677836

申请日：2015-04-02

Applicant: NXP B.V.

Inventor： Patrick Schoengrundner ,  Ernst Eiper ,  Christian Zenz

IPC: G06K19/077 ,  H01L23/00

CPC classification number: G06K19/07769 ,  G06K19/07747 ,  G06K19/07754 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure by applying an adhesive material to partially cover an overlapping area of the at least one antenna contact and the substrate, which is a component of a dual-interface IC card. Other embodiments are also described.

Abstract translation: 描述了用于制造双接口IC卡组件的双接口集成电路（IC）卡组件和方法。 在一个实施例中，双接口IC卡部件包括单面接触基部结构，其包括具有电接触层的基板。 在单面接触基底结构上，一个或多个天线接触引线附接到单面接触基底结构以通过施加粘合剂材料以部分地覆盖至少一个天线的重叠区域而形成双界面接触结构 接触和基板，它是双接口IC卡的组件。 还描述了其它实施例。

公开(公告)号：US20150278673A1

公开(公告)日：2015-10-01

申请号：US14242031

申请日：2014-04-01

Applicant: NXP B.V.

Inventor： Christian Zenz ,  Tonny Kamphuis ,  Johannes Wilhelmus van Rijckevorsel ,  Bodin Kasemset ,  David Ceccarelli ,  Boudewijn van Blokland ,  Patrick Schoengrundner

IPC: G06K19/077

CPC classification number: G06K19/07754 ,  G06K19/07745 ,  G06K19/07769 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/8592 ,  Y10T29/49018 ,  H01L2924/00014

Abstract: Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.

Abstract translation: 描述了用于制造双接口IC卡组件的双接口集成电路（IC）卡组件和方法。 在一个实施例中，双接口IC卡部件包括单面接触基部结构，其包括具有电接触层的基板。 在单面接触基体结构上，一个或多个天线接触引线附接到单面接触基底结构以形成双界面接触结构，其是双接口IC卡的组件。 还描述了其它实施例。

公开(公告)号：US20150144704A1

公开(公告)日：2015-05-28

申请号：US14607517

申请日：2015-01-28

Applicant: NXP B.V.

Inventor： Reinhard Rogy ,  Christian Zenz

IPC: G06K19/077

CPC classification number: G06K19/07754 ,  G06K19/07743 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07752 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10T29/49018

Abstract: In a method of producing a transponder (T1, T2, T3), a substrate (1, 91) is provided. The substrate (9, 91) comprises a first area (2), a second area (3) adjacent to the first area (2), and a first electric contact (8, 98) adjacent to the second area (3). An electric device (50, 80) is placed in or on the first area (2), preferably without touching the first electric contact (8, 98). Subsequently, a conductive glue (12) is applied on the second area (3) and on the first electric contact (8, 98) so that the conductive glue (12) electrically couples the first electric contact (8, 98) with the electric device (50, 80).

Abstract translation: 在制造应答器（T1，T2，T3）的方法中，提供基板（1,91）。 基板（9,91）包括与第一区域（2）相邻的第一区域（2），第二区域（3）和邻近第二区域（3）的第一电触点（8,98）。 电气设备（50,80）被放置在第一区域（2）中或第一区域（2）上，优选地不接触第一电触头（8,98）。 随后，在第二区域（3）和第一电触点（8,98）上施加导电胶（12），使得导电胶（12）将第一电触点（8,98）与电 装置（50,80）。