公开(公告)号：US09779349B2

公开(公告)日：2017-10-03

申请号：US14607517

申请日：2015-01-28

Applicant: NXP B.V.

Inventor： Reinhard Rogy ,  Christian Zenz

IPC: G06K19/06 ,  G06K19/077 ,  H01L23/00

CPC classification number: G06K19/07754 ,  G06K19/07743 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07752 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10T29/49018

Abstract: In a method of producing a transponder (T1, T2, T3), a substrate (1, 91) is provided. The substrate (9, 91) comprises a first area (2), a second area (3) adjacent to the first area (2), and a first electric contact (8, 98) adjacent to the second area (3). An electric device (50, 80) is placed in or on the first area (2), preferably without touching the first electric contact (8, 98). Subsequently, a conductive glue (12) is applied on the second area (3) and on the first electric contact (8, 98) so that the conductive glue (12) electrically couples the first electric contact (8, 98) with the electric device (50, 80).

公开(公告)号：US20150144704A1

公开(公告)日：2015-05-28

申请号：US14607517

申请日：2015-01-28

Applicant: NXP B.V.

Inventor： Reinhard Rogy ,  Christian Zenz

IPC: G06K19/077

CPC classification number: G06K19/07754 ,  G06K19/07743 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07752 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10T29/49018

Abstract: In a method of producing a transponder (T1, T2, T3), a substrate (1, 91) is provided. The substrate (9, 91) comprises a first area (2), a second area (3) adjacent to the first area (2), and a first electric contact (8, 98) adjacent to the second area (3). An electric device (50, 80) is placed in or on the first area (2), preferably without touching the first electric contact (8, 98). Subsequently, a conductive glue (12) is applied on the second area (3) and on the first electric contact (8, 98) so that the conductive glue (12) electrically couples the first electric contact (8, 98) with the electric device (50, 80).

Abstract translation: 在制造应答器（T1，T2，T3）的方法中，提供基板（1,91）。 基板（9,91）包括与第一区域（2）相邻的第一区域（2），第二区域（3）和邻近第二区域（3）的第一电触点（8,98）。 电气设备（50,80）被放置在第一区域（2）中或第一区域（2）上，优选地不接触第一电触头（8,98）。 随后，在第二区域（3）和第一电触点（8,98）上施加导电胶（12），使得导电胶（12）将第一电触点（8,98）与电 装置（50,80）。