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公开(公告)号：US20170135617A1
公开(公告)日：2017-05-18
申请号：US15325811
申请日：2015-07-13
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Jukka Alasirniö , Tobias Senn , Mario Cesana , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Pérez Calero , Bassam Hallal , Jens Geiger
IPC: A61B5/1455 , A61B5/024 , G01J1/42 , G01S17/48 , G01S7/497
CPC classification number: A61B5/14551 , A61B5/02416 , A61B5/02433 , A61B5/14552 , G01J1/4204 , G01S7/497 , G01S17/48 , G01S2007/4975
Abstract: The present disclosure describes modules operable to perform optical sensing. The module can be operable to distinguish between signals indicative of reflections from an object or interest and signals indicative of a spurious reflection such as from a smudge (i.e., a blurred or smeared mark) on the host device's cover glass. Signals assigned to reflections from the object of interest can be used to for various purposes, depending on the application (e.g., determining an object's proximity, a person's heart rate or a person's blood oxygen level).
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公开(公告)号：US20170084663A1
公开(公告)日：2017-03-23
申请号：US15367257
申请日：2016-12-02
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L27/146 , H01L31/0232 , H01L33/58
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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公开(公告)号：US20160216777A1
公开(公告)日：2016-07-28
申请号：US14908690
申请日：2014-07-17
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： Jens Geiger , Susanne Westenhöfer
IPC: G06F3/03 , G06F3/0346 , G01D5/34
CPC classification number: G06F3/0312 , G01C9/10 , G01C2009/066 , G01C2009/107 , G01D5/34 , G01D5/342 , G06F3/0325 , G06F3/0346
Abstract: The sensor (1) for determining an orientation of the sensor in a gravity field comprises a ball (2) and a rolling surface (R) describing a generally concave shape on which the ball can roll inside the sensor. A further surface (F) is arranged opposite said rolling surface, and a light emitter (E), a light detector (D) and another light emitter or detector is provided. A region (R) within which the ball (2) can move is limited by at least the rolling surface (R) and the further surface (F). And the light emitters (E) and detectors (D) are arranged outside the region (R) for emitting light through the rolling surface (R) into said region and detecting light exiting the region (3) through the rolling surface (R) or for emitting light through the further surface (F) into said region (R) and detecting light exiting said region (R) through the further surface (F). Corresponding measuring methods and manufacturing methods are described, too.
Abstract translation: 用于确定传感器在重力场中的取向的传感器（1）包括球（2）和滚动表面（R），其描述大体上凹形的球体可以在该传感器内滚动。 另外的表面（F）布置成与所述滚动表面相对，并且提供了光发射器（E），光检测器（D）和另一个发光器或检测器。 滚珠（2）可以在其中移动的区域（R）至少受到滚动表面（R）和另外的表面（F）的限制。 并且发光体（E）和检测器（D）布置在区域（R）的外部，用于通过滚动表面（R）将光发射到所述区域中，并通过滚动表面（R）检测出离开区域（3）的光 用于通过所述另外的表面（F）将光发射到所述区域（R）中，并且通过所述另外的表面（F）检测从所述区域（R）出射的光。 也描述了相应的测量方法和制造方法。
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14.发明申请OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES 审中-公开具有遮光以减少光泄漏或光照的光电模块，以及用于这些模块的制造方法公开(公告)号：US20150325613A1
公开(公告)日：2015-11-12
申请号：US14743073
申请日：2015-06-18
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L27/146 , G02B7/02 , F21V5/04 , G02B13/00 , G02B5/22
CPC classification number: H01L27/14623 , F21V5/048 , F21Y2115/10 , G02B5/22 , G02B7/02 , G02B13/0085 , H01L24/94 , H01L25/50 , H01L31/0203 , H01L31/0543 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2933/0033 , H04N5/2252 , H04N5/2257 , Y02E10/52 , Y10T29/41 , H01L2924/00
Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
Abstract translation: 光电模块包括光电器件和透明盖。 在透明盖的侧壁上设置不透明的材料，这有助于减少透明盖的侧面的光泄漏，或者有助于减少杂散光进入模块。 模块可以例如在晶片级工艺中制造。 在一些实施方案中，诸如沟槽的开口形成在透明晶片中。 然后可以使用例如真空注射工具用不透明材料填充沟槽。 当随后将包括沟槽填充的透明晶片的晶片堆叠分离成单个模块时，结果是每个模块可以包括具有被不透明材料覆盖的侧壁的透明盖。
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公开(公告)号：US20150036046A1
公开(公告)日：2015-02-05
申请号：US14339623
申请日：2014-07-24
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
CPC classification number: H01L27/14623 , F21V5/048 , F21Y2115/10 , G02B5/22 , G02B7/02 , G02B13/0085 , H01L24/94 , H01L25/50 , H01L31/0203 , H01L31/0543 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2933/0033 , H04N5/2252 , H04N5/2257 , Y02E10/52 , Y10T29/41 , H01L2924/00
Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
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Patent Agency Ranking
16.发明授权公开(公告)号：US08606057B1
公开(公告)日：2013-12-10
申请号：US13685193
申请日：2012-11-26
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Mario Cesana , Jukka Alasirnio , Philippe Bouchilloux , Susanne Westenhoefer , Jens Geiger
IPC: G02B6/12
CPC classification number: H05K3/4697 , H01L23/49833 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L31/0203 , H01L2224/04026 , H01L2224/24227 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/83192 , H01L2224/83851 , H01L2224/97 , H01L2924/12041 , H01L2924/12043 , H01L2924/12044 , H01L2924/15153 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579 , H05K1/182 , H05K1/183 , H05K2201/10121 , H05K2203/063 , H01L2224/83 , H01L2924/00
Abstract: Opto-electronic modules include conductive wiring and connections that can facilitate integrating the modules into an external device. Some opto-electronic modules include an opto-electronic stack that includes at least one lens and an opto-electronic element. Conductive paths can extend from the bottom to the top of the module. The conductive paths can include conductive pads on the surface of the opto-electronic element, as well as wiring at least partially embedded in a substrate and walls of a housing for the opto-electronic stack. Conductive connections can be disposed between a top surface of the substrate and the bottom surface of the walls such that the conductive connections electrically connect the second wiring to the first wiring and to the conductive pads on the surface of the opto-electronic element. The modules can be fabricated, for example, in wafer-level processes so that multiple opto-electronic modules can be manufactured at the same time.
Abstract translation: 光电模块包括导电布线和连接，可以方便将模块集成到外部设备中。 一些光电模块包括包括至少一个透镜和光电元件的光电堆叠。 导电路径可以从模块的底部延伸到顶部。 导电路径可以包括在光电子元件的表面上的导电焊盘，以及至少部分地嵌入基板的布线和用于光电叠层的壳体的壁。 导电连接可以设置在基板的顶表面和壁的底表面之间，使得导电连接将第二布线电连接到第一布线和光电元件表面上的导电垫。 模块可以例如在晶片级处理中制造，从而可以同时制造多个光电模块。
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公开(公告)号：US20180064399A1
公开(公告)日：2018-03-08
申请号：US15696431
申请日：2017-09-06
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Bernhard Buettgen , Jens Geiger , Michael Kiy , Oliver Chidley , Markus Rossi
CPC classification number: A61B5/7228 , A61B5/0077 , A61B5/02416 , A61B5/02433 , A61B5/14551 , G01S7/4914 , G01S7/4915 , G01S17/88 , G06K9/00885 , G06K9/2036 , G06K2009/00932 , G06K2009/00939 , H04N5/378
Abstract: Imaging systems include multi-tap demodulation pixels for biometric measurements such as heart rate or blood oxygen level. Using multi-tap demodulation pixels can, in some cases, help facilitate the generation of differential signals to remove background noise and achieve a higher dynamic range for the biometric measurements.
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公开(公告)号：US09773765B2
公开(公告)日：2017-09-26
申请号：US15037392
申请日：2014-11-18
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Jens Geiger
IPC: H01L25/16 , H01L25/00 , H01L27/14 , H01L31/02 , H01L31/16 , G01S7/48 , H01L27/146 , G01S7/481 , H01L31/0232 , H01L31/167 , H01L23/00 , H01L31/173 , H01L33/44 , H01L33/48
CPC classification number: H01L25/167 , G01S7/4813 , H01L24/97 , H01L25/50 , H01L27/14618 , H01L31/02325 , H01L31/167 , H01L31/173 , H01L33/44 , H01L33/486 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/00
Abstract: Compact optoelectronic modules are described that, in some implementations, can have reduced heights, while at the same time having very little optical crosstalk or detection of stray light. An optoelectronic module having optical channel can include a support on which is mounted an optoelectronic device arranged to emit or detect light at a particular one or more wavelengths. The module has a cover including an optically transmissive portion over the optoelectronic device. The optically transmissive portion is surrounded laterally by sections of the cover that are substantially non-transparent to the one or more wavelengths. A passive optical element is present on a surface of the optically transmissive portion. A spacer separates the support from the cover. The cover can be relatively thin so that the overall height of the module is relatively small.
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公开(公告)号：US20160041038A1
公开(公告)日：2016-02-11
申请号：US14774533
申请日：2014-03-12
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： Jens Geiger
CPC classification number: G01J5/0806 , G01J5/0215 , G01J5/04 , G01J5/046 , G01J5/06 , G01J5/0815 , G01J5/10
Abstract: Compact thermal sensor modules, which in some implementations can be manufactured in wafer-level fabrication processes, include features composed of or coated with a low-emissivity material to reduce or prevent detection by a sensor of radiation emitted by other parts of the module. For example, spacers that separate an optics substrate and a sensor package from one another can be composed of or coated with such a low emissivity material. In some cases, the low emissivity material has an emissivity of no more than 0.1.
Abstract translation: 在一些实施方案中，可以在晶片级制造工艺中制造的紧凑型热传感器模块包括由低辐射材料组成或涂覆的特征，以减少或防止传感器对模块的其它部分发射的辐射进行检测。 例如，将光学基板和传感器封装彼此分开的间隔件可由这种低辐射率材料组成或涂覆。 在某些情况下，低辐射率材料的发射率不超过0.1。
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20.发明授权Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules 有权具有屏蔽以减少漏光或杂散光的光电模块，以及这些模块的制造方法公开(公告)号：US09094593B2
公开(公告)日：2015-07-28
申请号：US14339623
申请日：2014-07-24
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
CPC classification number: H01L27/14623 , F21V5/048 , F21Y2115/10 , G02B5/22 , G02B7/02 , G02B13/0085 , H01L24/94 , H01L25/50 , H01L31/0203 , H01L31/0543 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2933/0033 , H04N5/2252 , H04N5/2257 , Y02E10/52 , Y10T29/41 , H01L2924/00
Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
Abstract translation: 光电模块包括光电器件和透明盖。 在透明盖的侧壁上设置不透明的材料，这有助于减少透明盖的侧面的光泄漏，或者有助于减少杂散光进入模块。 模块可以例如在晶片级工艺中制造。 在一些实施方案中，诸如沟槽的开口形成在透明晶片中。 然后可以使用例如真空注射工具用不透明材料填充沟槽。 当随后将包括沟槽填充的透明晶片的晶片堆叠分离成单个模块时，结果是每个模块可以包括具有被不透明材料覆盖的侧壁的透明盖。
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