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公开(公告)号：US09180539B1
公开(公告)日：2015-11-10
申请号：US14218557
申请日：2014-03-18
Applicant: Flextronics AP, LLC
Inventor： Dason Cheung , Murad Kurwa
CPC classification number: B23K1/0016 , B23K1/20 , H05K1/0269 , H05K1/0271 , H05K3/225 , H05K3/3484 , H05K2201/09927 , H05K2201/10371 , H05K2203/0126 , H05K2203/0445 , H05K2203/082 , H05K2203/085 , H05K2203/105 , H05K2203/111 , H05K2203/163
Abstract: A radio-frequency (RF) shield pad is “dressed” by automatically removing melted solder from the shield pad by traversing a pattern of the shield pad. After an RF shield has been removed from a shield pad of a printed circuit board (PCB), the PCB is pre-heated to a temperature sufficient to heat solder on the shield pad and to prevent thermally stressing the PCB during the dressing process. The solder is melted, such as by a heated tip of a desoldering tool, and the melted solder is vacuumed while the tip automatically traverses the pattern of the shield pad, until all or a threshold amount of the melted solder has been removed from the shield pad. After the PCB has been reworked, solder paste is automatically disposed on the RF-shield pad, the RF shield is temporarily mounted on the RF-shield pad, and the PCB is processed in a reflow oven, thereby securely attaching the RF shield to the PCB.
Abstract translation: 通过穿过屏蔽垫的图案，通过从屏蔽垫自动去除熔化的焊料，射频（RF）屏蔽垫被“穿透”。 在已经从印刷电路板（PCB）的屏蔽焊盘上移除RF屏蔽之后，PCB被预热到足以在屏蔽焊盘上加热焊接的温度，并防止在修整过程中对PCB进行热应力。 焊料熔化，例如通过脱焊工具的加热尖端，并且熔化的焊料被抽真空，同时尖端自动穿过屏蔽垫的图案，直到从屏蔽层去除了所有或阈值量的熔化焊料 垫。 在PCB被重新加工之后，焊膏自动地被放置在RF屏蔽垫上，RF屏蔽件临时安装在RF屏蔽垫上，并且PCB在回流炉中被处理，从而将RF屏蔽件牢固地附接到 PCB。
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公开(公告)号：US09149882B1
公开(公告)日：2015-10-06
申请号：US14565295
申请日：2014-12-09
Applicant: Flextronics AP, LLC
Inventor： Omar Garcia Lopez , Enrique Avelar Secada , Dason Cheung , Murad Kurwa
CPC classification number: B23K1/085 , B23K1/0008 , B23K1/0016 , B23K3/0653 , H05K3/3468 , H05K2203/044 , H05K2203/111
Abstract: A method and system for a preheating step of a wave soldering process. A bottom side preheater is positioned underneath a PCB and a thermal carrier is positioned adjacent the PCB. A top side heater may also be used. The PCB includes one or more through holes, and an electronic component having one or more pins is mounted on the PCB so that each pin is positioned in a corresponding through hole. The bottom side preheater directs heat to the bottom surface of the PCB, thereby heating the bottom surface via heat convection. The thermal carrier directs heated air laterally across the top surface of the PCB to increase a heat transfer at the top surface without increasing the temperature of the electronic component, thereby reducing a temperature differential between the top and bottom surfaces.
Abstract translation: 一种用于波峰焊工艺的预热步骤的方法和系统。 底部预热器位于PCB下方，热载体位于PCB附近。 也可以使用顶侧加热器。 PCB包括一个或多个通孔，并且具有一个或多个引脚的电子部件安装在PCB上，使得每个引脚定位在相应的通孔中。 底部预热器将热量引导到PCB的底部表面，从而通过热对流来加热底部表面。 热载体横向穿过PCB的顶表面引导加热的空气，以增加顶表面的热传递，而不增加电子部件的温度，从而降低顶表面和底表面之间的温度差。
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公开(公告)号：US09036354B2
公开(公告)日：2015-05-19
申请号：US13742208
申请日：2013-01-15
Applicant: Flextronics AP, LLC
Inventor： Dason Cheung , Murad Kurwa , Richard Loi
CPC classification number: F28F7/00 , G05B19/02 , G05B19/056 , H01L21/4882 , H05K1/0209 , H05K13/00 , H05K2201/066 , H05K2201/09781 , Y10T29/4935 , Y10T29/49385 , Y10T29/49995 , Y10T29/53113 , Y10T29/53174
Abstract: Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.
Abstract translation: 提供了电子板组装的方法和设备。 该装置可以包括由可编程逻辑控制器控制的一个或多个热敏头。 用户能够通过人机界面将控制参数输入到可编程逻辑控制器中。 热敏头能够与一个或多个气动螺线管连接，使热敏头垂直移动，直到热敏头与散热片接触。 热敏头能够提供等于或高于热垫的操作温度的温度，其能够使相变热界面材料结合散热器和电子板。
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Patent Agency Ranking
公开(公告)号：US09931665B2
公开(公告)日：2018-04-03
申请号：US14526114
申请日：2014-10-28
Applicant: Flextronics AP, LLC
Inventor： Dason Cheung , Murad Kurwa , Raymundo Alatorre Mercado
IPC: B05C17/01 , B05C5/02 , B05C11/10 , B05C17/005
CPC classification number: B05C17/012 , B05C5/0225 , B05C11/1036 , B05C17/00553 , B05C17/0103 , B05C17/014 , Y10S901/16 , Y10S901/21
Abstract: A liquid compound dispensing apparatus for dispensing a controlled amount of liquid compound onto a workpiece is described. The apparatus comprises a cartridge system. The cartridge system may accept a liquid compound cartridge containing liquid compound. The apparatus also comprises a plate, having a threaded bore, positioned above the cartridge system that is movable in a first and second direction, at least one plunger attached to the plate at a first end and attached to a piston at a second end. The piston is dimensioned to move within the liquid compound cartridge to displace liquid compound when the plate is moved in the second direction. A driving mechanism moves the plate in the first and the second directions to dispense product and comprises a motor, a threaded rod disposed through the threaded bore of the plate that is driven by a driving belt attached to the motor.
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公开(公告)号：US09884384B1
公开(公告)日：2018-02-06
申请号：US15158308
申请日：2016-05-18
Applicant: Flextronics AP, LLC.
Inventor： Dason Cheung , Murad Kurwa
IPC: B23K1/00 , B23K3/08 , B23K1/08 , B23K3/06 , B23K101/42
CPC classification number: B23K3/08 , B23K1/0016 , B23K1/018 , B23K1/085 , B23K3/0653 , B23K2101/42
Abstract: A solder dross recovery module has gears and a waste collection chamber positioned within a solder pot. The gears are configured to draw in solder dross from a surface of molten solder stored in the solder pot. The gears apply pressure to the solder dross so as to separate solder from the solder dross. The recovered solder is returned to the molten solder in the solder pot. A resulting waste material is collected in the waste collection chamber.
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公开(公告)号：US09789572B1
公开(公告)日：2017-10-17
申请号：US14531769
申请日：2014-11-03
Applicant: Flextronics AP, LLC
Inventor： Dason Cheung , Murad Kurwa , Tor Krog , Xiuchuan Wang , Hao Tan
IPC: B23P21/00
CPC classification number: B23P21/004
Abstract: A universal automation line is configured for the assembly of electronics and mechanical devices. The universal automation line includes universal cells or stations that can be programmed to perform a variety of automated assembly tasks such as glue dispensing, screw driving, pick and place, etc. The stations are interchangeable by different module design such as selective soldering, heat stacking, bottom lead trimming, bottom screwing and ultrasonic welding. Each station can also include an automated robot, which is also interchangeable, to perform different tasks and complete fully automated assemblies. The stations can be sequenced inline for a fully automated line or combined with some manual operation. The stations can communicate by standardized interfaces and local networks, and can be expanded to an intranet or the internet for remote control.
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公开(公告)号：US09605860B2
公开(公告)日：2017-03-28
申请号：US14067665
申请日：2013-10-30
Applicant: Flextronics AP, LLC
Inventor： Dason Cheung , Murad Kurwa , Richard Loi
CPC classification number: F24F11/0079 , F24F11/0001 , F24F11/77 , F24F2007/001 , F24F2011/0024 , F24F2011/0042 , F24F2110/40 , F24F2110/62 , Y02B30/746 , Y02B30/78
Abstract: An energy-efficient ventilation system comprises a ventilation fan, ductwork, system controller, and a plurality of ventilation points, each comprising a damper, a differential pressure sensor, a ventilation point controller, and a fume detector. When a ventilation point does not require ventilation, a signal is sent to the system controller to reduce the ventilation fan speed thereby using only as much energy as is needed to provide service to the ventilation points that need ventilation. The fume detector, damper, and differential pressure sensor for each ventilation point are used to determine whether ventilation is needed at a ventilation point and to control the ventilation point accordingly.
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公开(公告)号：US20160114348A1
公开(公告)日：2016-04-28
申请号：US14526114
申请日：2014-10-28
Applicant: Flextronics AP, LLC
Inventor： Dason Cheung , Murad Kurwa , Raymundo Alatorre Mercado
CPC classification number: B05C17/012 , B05C5/0225 , B05C11/1036 , B05C17/00553 , B05C17/0103 , B05C17/014 , Y10S901/16 , Y10S901/21
Abstract: A liquid compound dispensing apparatus for dispensing a controlled amount of liquid compound onto a workpiece is described. The apparatus comprises a cartridge system. The cartridge system may accept a liquid compound cartridge containing liquid compound. The apparatus also comprises a plate, having a threaded bore, positioned above the cartridge system that is movable in a first and second direction, at least one plunger attached to the plate at a first end and attached to a piston at a second end. The piston is dimensioned to move within the liquid compound cartridge to displace liquid compound when the plate is moved in the second direction. A driving mechanism moves the plate in the first and the second directions to dispense product and comprises a motor, a threaded rod disposed through the threaded bore of the plate that is driven by a driving belt attached to the motor.
Abstract translation: 描述了用于将受控量的液体化合物分配到工件上的液体化合物分配装置。 该装置包括盒系统。 墨盒系统可以接受含有液体化合物的液体复合墨盒。 该装置还包括一个具有螺纹孔的板，该螺纹孔位于盒系统上方，其可沿第一和第二方向移动，至少一个柱塞在第一端附接到板并在第二端连接到活塞。 活塞的尺寸设计成在液体复合筒内移动，以便当板沿第二方向移动时移动液体化合物。 驱动机构沿着第一和第二方向移动板以分配产品，并且包括电动机，通过板的螺纹孔设置的螺杆，该螺纹杆由连接到电动机的传动带驱动。
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