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公开(公告)号：US20210335917A1
公开(公告)日：2021-10-28
申请号：US16487577
申请日：2019-04-02
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Guoqiang Wang
Abstract: A photodetector (300) includes a first electrode (313) and a second electrode (314) on a base substrate (100); a light-sensitive layer (311) between the first electrode (313) and the second electrode (314); and a light-trapping layer (312) between the light-sensitive layer (311) and the base substrate (100), wherein a surface of the light-trapping layer (312) opposite from the base substrate (100) comprises a plurality of first recessed portions.
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公开(公告)号：US20240088170A1
公开(公告)日：2024-03-14
申请号：US18518526
申请日：2023-11-23
Applicant: BOE Technology Group Co., Ltd.
Inventor： Ke Wang , Muxin Di , Zhiwei Liang , Guoqiang Wang , Renquan Gu , Xiaoxin Song , Xiaoyan Zhu , Yingwei Liu , Zhanfeng Cao
IPC: H01L27/12
CPC classification number: H01L27/124 , H01L27/1251 , H01L27/127
Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.
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13.发明公开公开(公告)号：US20230260982A1
公开(公告)日：2023-08-17
申请号：US18137857
申请日：2023-04-21
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Wenqian Luo , Yingwei Liu , Ke Wang , Qi Yao , Huijuan Wang , Haixu Li , Zhanfeng Cao , Guangcai Yuan , Xue Dong , Guoqiang Wang , Zhijun Lv
CPC classification number: H01L25/167 , H01L24/13 , H01L27/124 , H01L2224/13016 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/1319
Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.
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公开(公告)号：US11527676B2
公开(公告)日：2022-12-13
申请号：US16760475
申请日：2019-10-29
Applicant: BOE Technology Group Co., Ltd.
Inventor： Guoqiang Wang , Jiushi Wang , Qingzhao Liu
Abstract: A light-emitting unit and a method for manufacturing the same are provided. The light-emitting unit includes a first semiconductor layer, a light-emitting layer and a second semiconductor layer that are distributed in a stacking manner. At least one of the first semiconductor layer or the second semiconductor layer is at least in contact with a part of layer surfaces and a part of side of the light-emitting layer, the first semiconductor layer is insulated from the second semiconductor layer, and one of the first semiconductor layer and the second semiconductor layer is an N-type semiconductor layer, and the other is a P-type semiconductor layer. The present disclosure is conducive to increasing the light-emitting area and the light extraction efficiency of the light-emitting unit.
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公开(公告)号：US20210233467A1
公开(公告)日：2021-07-29
申请号：US16767351
申请日：2019-12-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Qingzhao Liu , Guoqiang Wang , Rui Huang , Lizhong Wang , Shuilang Dong , Xinhong Lu
IPC: G09G3/3233 , H01L31/12 , H01L29/78 , H01L27/12 , G09G3/3266
Abstract: The present application discloses a semiconductor apparatus, a pixel circuit and a control method thereof. The semiconductor apparatus comprises: an active layer; a first insulating layer; a first gate and a second gate overlapping with a portion of the active layer with the first insulating layer interposed therebetween, respectively; a first electrode, a second electrode and a third electrode, the first electrode and the second electrode are electrically connected with a first portion and a second portion of the active layer, respectively, the third electrode is used to be electrically connected with a photosensitive device, wherein the third electrode is electrically connected with the first gate or the second gate; or the third electrode is electrically connected with a third portion of the active layer.
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Patent Agency Ranking
公开(公告)号：US20210226091A1
公开(公告)日：2021-07-22
申请号：US16760475
申请日：2019-10-29
Applicant: BOE Technology Group Co., Ltd.
Inventor： Guoqiang Wang , Jiushi Wang , Qingzhao Liu
Abstract: A light-emitting unit and a method for manufacturing the same are provided. The light-emitting unit includes a first semiconductor layer, a light-emitting layer and a second semiconductor layer that are distributed in a stacking manner. At least one of the first semiconductor layer or the second semiconductor layer is at least in contact with a part of layer surfaces and a part of side of the light-emitting layer, the first semiconductor layer is insulated from the second semiconductor layer, and one of the first semiconductor layer and the second semiconductor layer is an N-type semiconductor layer, and the other is a P-type semiconductor layer. The present disclosure is conducive to increasing the light-emitting area and the light extraction efficiency of the light-emitting unit.
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公开(公告)号：US11022736B2
公开(公告)日：2021-06-01
申请号：US16408973
申请日：2019-05-10
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Qingzhao Liu , Jiushi Wang , Shuilang Dong , Guoqiang Wang
Abstract: An embodiment of this disclosure discloses a metal wire grid comprising: a patterned metal layer and a patterned antireflective layer located on the patterned metal layer, wherein a surface of the antireflective layer distal to the patterned metal layer has a plurality of continuous pits. Embodiments of this disclosure further disclose a method of manufacturing a metal wire grid and a display panel.
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公开(公告)号：US20210124897A1
公开(公告)日：2021-04-29
申请号：US17256678
申请日：2020-05-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Qingzhao Liu , Ke Wang , Guoqiang Wang , Shuilang Dong
Abstract: An array substrate and a method for manufacturing the same, a method and assembly for detecting light, and a display device are provided. The array substrate includes: a base substrate having a pixel region; a light detecting unit, a switch unit, and a light emitting unit that are located in the pixel region, where the light emitting unit and the light detecting unit share the switch unit.
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公开(公告)号：US11929358B2
公开(公告)日：2024-03-12
申请号：US18137857
申请日：2023-04-21
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Wenqian Luo , Yingwei Liu , Ke Wang , Qi Yao , Huijuan Wang , Haixu Li , Zhanfeng Cao , Guangcai Yuan , Xue Dong , Guoqiang Wang , Zhijun Lv
CPC classification number: H01L25/167 , H01L24/13 , H01L27/124 , H01L2224/13016 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/1319
Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.
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公开(公告)号：US11894353B2
公开(公告)日：2024-02-06
申请号：US17010575
申请日：2020-09-02
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhiwei Liang , Wenqian Luo , Guoqiang Wang , Yingwei Liu
CPC classification number: H01L25/167 , H01L24/03 , H01L24/11 , H01L24/13 , H01L24/81 , H01L27/124 , H01L27/1259 , H01L2224/0382 , H01L2224/10122 , H01L2224/1182 , H01L2224/13007 , H01L2224/13016 , H01L2224/13078 , H01L2224/81201
Abstract: The present disclosure provides a driving substrate and a manufacturing method thereof, and a micro LED bonding method. The driving substrate includes: a base substrate; a driving function layer provided on the base substrate, and including a plurality of driving thin film transistors and a plurality of common electrode lines; a pad layer including a plurality of pads provided on a side of the driving function layer away from the base substrate, each pad including a pad body and a microstructure of hard conductive material provided on a side of the pad body away from the base substrate; and a plurality of buffer structures provided on the side of the driving function layer away from the base substrate, each buffer structure surrounding a portion of a corresponding microstructure close to the base substrate, and a height of the buffer structure being lower than a height of the microstructure.
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