公开(公告)号：US20220199340A1

公开(公告)日：2022-06-23

申请号：US17159004

申请日：2021-01-26

申请人： Seong Ho SHIN

发明人： Seong Ho SHIN

IPC分类号： H01H13/85 ,  G06F3/16

摘要： A haptic generator in accordance with an embodiment of the present disclosure may include a driving signal generator and a haptic device. The driving signal generator may be configured to receive a sound signal and generate a driving signal including an impact driving signal and an inertia driving signal. The haptic device may be configured to generate impact vibrations pursuant to the impact driving signal and generate rotational inertia vibrations pursuant to the inertia driving signal, the rotational inertia vibrations being different from the impact vibrations. The impact driving signal and the inertia driving signal may be generated based on different properties of the sound signal.

公开(公告)号：US08680667B2

公开(公告)日：2014-03-25

申请号：US13400035

申请日：2012-02-17

申请人： Heung-Kyu Kwon ,  Seong-Ho Shin ,  Yun-Seok Choi ,  Yong-Hoon Kim

发明人： Heung-Kyu Kwon ,  Seong-Ho Shin ,  Yun-Seok Choi ,  Yong-Hoon Kim

IPC分类号： H01L23/02

CPC分类号： H01L24/06 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A package stack structure may an upper package include an upper package substrate having a first edge and a second edge opposite to the first edge. The upper package substrate has a first region arranged near the first edge and a second region arranged near the second edge. A first upper semiconductor device is mounted on the upper package substrate. The package stack structure may also include a lower package having a lower package substrate and a lower semiconductor device. The lower package is connected to the upper package through a plurality of inter-package connectors. The plurality of the inter-package connectors may include first inter-package connectors configured to transmit data signals; second inter-package connectors configured to transmit address/control signals; third inter-package connectors configured to provide a supply voltage for an address/control circuit; and fourth inter-package connectors configured to provide a supply voltage for a data circuit.

摘要翻译： 封装堆叠结构可以是上封装包括具有第一边缘和与第一边缘相对的第二边缘的上封装基板。 上封装衬底具有布置在第一边缘附近的第一区域和布置在第二边缘附近的第二区域。 第一上半导体器件安装在上封装衬底上。 封装堆叠结构还可以包括具有下封装衬底和下半导体器件的下封装。 下封装通过多个封装间连接器连接到上封装。 多个包装间连接器可以包括被配置为传送数据信号的第一包装间连接器; 配置成发送地址/控制信号的第二串联连接器连接器; 第三组件间连接器，被配置为提供地址/控制电路的电源电压; 以及被配置为提供数据电路的电源电压的第四组件间连接器。

公开(公告)号：US08404449B2

公开(公告)日：2013-03-26

申请号：US12429897

申请日：2009-04-24

申请人： Hagan Bayley ,  Seong-Ho Shin ,  Tudor Luchian ,  Stephen Cheley

发明人： Hagan Bayley ,  Seong-Ho Shin ,  Tudor Luchian ,  Stephen Cheley

IPC分类号： G01N33/53

CPC分类号： G01N33/5308 ,  C12Q1/001 ,  G01N33/5438 ,  G01N33/6872

摘要： A system and method for stochastic sensing in which the analyte covalently bonds to the sensor element or an adaptor element. If such bonding is irreversible, the bond may be broken by a chemical reagent. The sensor element may be a protein, such as the engineered PSH type or αHL protein pore. The analyte may be any reactive analyte, including chemical weapons, environmental toxins and pharmaceuticals. The analyte covalently bonds to the sensor element to produce a detectable signal. Possible signals include change in electrical current, change in force, and change in fluorescence. Detection of the signal allows identification of the analyte and determination of its concentration in a sample solution. Multiple analytes present in the same solution may be detected.

摘要翻译： 用于随机感测的系统和方法，其中分析物共价键合到传感器元件或适配器元件。 如果这种键合是不可逆的，则该键可能被化学试剂破坏。 传感器元件可以是蛋白质，例如工程化的PSH型或αHL蛋白质孔。 分析物可以是任何反应性分析物，包括化学武器，环境毒素和药物。 分析物共价键合到传感器元件以产生可检测的信号。 可能的信号包括电流的变化，力的变化和荧光的变化。 信号的检测允许鉴定分析物并确定其在样品溶液中的浓度。 可以检测存在于相同溶液中的多种分析物。

公开(公告)号：US08384315B2

公开(公告)日：2013-02-26

申请号：US12713279

申请日：2010-02-26

申请人： Seong-ho Shin ,  Young-jung Yun

发明人： Seong-ho Shin ,  Young-jung Yun

IPC分类号： H02P5/00

CPC分类号： H02P5/74 ,  H02P6/04

摘要： An image forming apparatus includes an engine unit to perform an image forming job, an engine control unit to control operation of the engine unit, a plurality of brushless direct current (BLDC) motors to operate the engine unit, a communication interface unit to receive a digital control command for the plurality of brushless DC motors from the engine control unit, a sensor unit to sense operation information of the plurality of brushless DC motors, an operation signal unit to generate an operation signal to control the plurality of brushless DC motors, and a speed control unit to control operation of the operation signal unit according to the received digital control command and sensing result of the sensor unit.

摘要翻译： 图像形成装置包括执行图像形成作业的发动机单元，用于控制发动机单元的运转的发动机控制单元，用于操作发动机单元的多个无刷直流电动机，用于接收发动机单元的通信接口单元 来自发动机控制单元的多个无刷直流电动机的数字控制命令，感测多个无刷直流电动机的操作信息的传感器单元，产生用于控制多个无刷直流电动机的操作信号的操作信号单元，以及 速度控制单元，用于根据接收到的数字控制命令和传感器单元的感测结果来控制操作信号单元的操作。

公开(公告)号：US20100142018A1

公开(公告)日：2010-06-10

申请号：US12572822

申请日：2009-10-02

申请人： Seong-Ho SHIN

发明人： Seong-Ho SHIN

IPC分类号： G02B26/10

CPC分类号： G02B26/127 ,  G02B26/085 ,  G02B26/105 ,  H04N1/053 ,  H04N1/1135 ,  H04N1/12 ,  H04N2201/02439 ,  H04N2201/0468 ,  H04N2201/0471 ,  H04N2201/04732 ,  H04N2201/04744 ,  H04N2201/04748 ,  H04N2201/04755 ,  H04N2201/04794

摘要： Disclosed are a light scanning unit and a method of synchronizing the scanning operation of such light scanning unit. The light scanning unit includes a deflection, mirror that is driven to oscillate so as to deflect and scan a light beam in a bidirectional scanning path. The synchronization, of a scanning operation may be made at least in part in consideration of the direction of flow of the current that is supplied to drive the deflection mirror to oscillate.

摘要翻译： 公开了一种光扫描单元和使这种光扫描单元的扫描操作同步的方法。 光扫描单元包括偏转镜，其被驱动以振荡以便在双向扫描路径中偏转和扫描光束。 扫描操作的同步可以至少部分地考虑供应以驱动偏转镜振荡的电流的流动方向。

公开(公告)号：US20070268099A1

公开(公告)日：2007-11-22

申请号：US11654582

申请日：2007-01-18

申请人： Hee-moon Jeong ,  Seong-ho Shin ,  Jin-ho Lee ,  Jin-woo Cho ,  Young-chul Ko

发明人： Hee-moon Jeong ,  Seong-ho Shin ,  Jin-ho Lee ,  Jin-woo Cho ,  Young-chul Ko

IPC分类号： H01H51/22

CPC分类号： H02K33/18 ,  G02B26/085 ,  G02B26/101

摘要： An actuator and a two dimensional scanner. The actuator and the two dimensional scanner include a base plate, a movable plate pivoted around at least one of a first imaginary axis or a second imaginary axis which are perpendicular to each other, a magnetic field-producing portion forming a magnetic force which acts in a direction parallel to the second axis and has a minimum size at a position of the first axis, a support member disposed coaxially with at least one of the first axis and the second axis, connecting the base plate and the movable plate, and forming a pivoting axis of the movable plate, and a driving coil portion to which a driving power of the movable plate is applied and disposed on the movable plate so as to have a point symmetry shape with respect to an intersecting point of the first axis and the second axis.

摘要翻译： 执行器和二维扫描仪。 致动器和二维扫描仪包括基板，围绕彼此垂直的第一假想轴或第二假想轴中的至少一个枢转的可动板，形成磁力的磁场产生部分，其作用在 与第二轴平行的方向，在第一轴的位置具有最小尺寸，与第一轴和第二轴的至少一个同轴设置的支撑构件，连接基板和可动板，并形成 可移动板的枢转轴线和驱动线圈部分，可动板的驱动力被施加到可动板上，以便相对于第一轴线和第二轴线的交叉点具有点对称形状 轴。

公开(公告)号：US11600458B2

公开(公告)日：2023-03-07

申请号：US17159004

申请日：2021-01-26

申请人： Seong Ho Shin

发明人： Seong Ho Shin

IPC分类号： H01H13/85 ,  G06F3/16 ,  G06F3/01 ,  G08B6/00 ,  H01H3/00

摘要： A haptic generator in accordance with an embodiment of the present disclosure may include a driving signal generator and a haptic device. The driving signal generator may be configured to receive a sound signal and generate a driving signal including an impact driving signal and an inertia driving signal. The haptic device may be configured to generate impact vibrations pursuant to the impact driving signal and generate rotational inertia vibrations pursuant to the inertia driving signal, the rotational inertia vibrations being different from the impact vibrations. The impact driving signal and the inertia driving signal may be generated based on different properties of the sound signal.

公开(公告)号：US09570383B2

公开(公告)日：2017-02-14

申请号：US14746247

申请日：2015-06-22

申请人： Jin-Kyung Kim ,  Yong-hoon Kim ,  Seong-Ho Shin

发明人： Jin-Kyung Kim ,  Yong-hoon Kim ,  Seong-Ho Shin

IPC分类号： H01L23/02 ,  H01L23/498 ,  H05K1/18 ,  H01L23/31

CPC分类号： H01L23/49816 ,  H01L23/3128 ,  H01L23/49838 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/181 ,  H05K2201/09218 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00

摘要： Semiconductor packages, module substrates and semiconductor package modules having the same are provided. The semiconductor package module includes a module substrate provided with a plurality of signal wires on an upper surface thereof, a package substrate disposed on the module substrate, a semiconductor chip disposed on one surface of the package substrate, and a plurality of external connection terminals disposed on another surface of the package substrate.

摘要翻译： 提供半导体封装，模块基板和具有该半导体封装的半导体封装模块。 半导体封装模块包括在其上表面上设置有多个信号线的模块基板，设置在模块基板上的封装基板，设置在封装基板的一个表面上的半导体芯片，以及设置在多个外部连接端子 在封装衬底的另一个表面上。

公开(公告)号：US20140339692A1

公开(公告)日：2014-11-20

申请号：US14102430

申请日：2013-12-10

申请人： YONG-HOON KIM ,  JI-CHUL KIM ,  SEONG-HO SHIN ,  IN-HO CHOI

发明人： YONG-HOON KIM ,  JI-CHUL KIM ,  SEONG-HO SHIN ,  IN-HO CHOI

IPC分类号： H01L23/367

CPC分类号： H01L23/36 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/49816 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor package stack, comprising: a lower semiconductor package including a lower semiconductor chip mounted on a lower package board; an upper semiconductor package stacked on the lower semiconductor package and including an upper semiconductor chip mounted on an upper package board, wherein the upper package board includes an opening configured to expose a lower surface of the upper semiconductor chip; and a first heat slug disposed within the opening, contacting the lower surface of the upper semiconductor chip, and contacting an upper surface of the lower semiconductor chip.

摘要翻译： 一种半导体封装堆叠，包括：下半导体封装，包括安装在下封装板上的下半导体芯片; 上半导体封装，堆叠在下半导体封装上并且包括安装在上封装板上的上半导体芯片，其中上封装板包括被配置为暴露上半导体芯片的下表面的开口; 以及设置在所述开口内的第一热块，与所述上半导体芯片的下表面接触并且接触所述下半导体芯片的上表面。

公开(公告)号：US08872319B2

公开(公告)日：2014-10-28

申请号：US13243704

申请日：2011-09-23

申请人： Yong-Hoon Kim ,  Hee-Seok Lee ,  Seong-Ho Shin ,  Se-Ho You ,  Yun-Hee Lee

发明人： Yong-Hoon Kim ,  Hee-Seok Lee ,  Seong-Ho Shin ,  Se-Ho You ,  Yun-Hee Lee

IPC分类号： H01L23/02 ,  H01L23/552 ,  H01L25/10 ,  H01L25/16 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/5226 ,  H01L23/552 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.

摘要翻译： 提供堆叠的包装结构。 堆叠封装结构包括：堆叠封装，包括下半导体封装，设置在下半导体封装上并与下半导体封装隔开预定距离的上半导体封装;电连接下半导体封装和 上部半导体封装，同时支撑它们之间的空间，以及绝缘层，其至少设置在所述封装间连接部分的外部并填充所述下部半导体封装和所述上部半导体封装之间的空间，以及围绕所述下部半导体封装的横向和顶部表面的电磁屏蔽层 堆叠包装。