公开(公告)号：US20100267175A1

公开(公告)日：2010-10-21

申请号：US12719067

申请日：2010-03-08

申请人： Haruo AMADA ,  Kenji SHIMAZAWA

发明人： Haruo AMADA ,  Kenji SHIMAZAWA

IPC分类号： H01L21/66 ,  H01L21/78

CPC分类号： H01L29/7395 ,  H01L21/3083 ,  H01L21/6835 ,  H01L21/78 ,  H01L22/14 ,  H01L29/66333 ,  H01L2221/6834 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/00

摘要： In a process for a semiconductor typically represented by a vertical power MOSFET, etc. of repeating various fabrications in a state of a thin film wafer with the thickness of the wafer being 200 μm or less, it is a standard procedure of conducting processing in a stage of bonding a reinforcing glass sheet to a device surface of the wafer (main surface on the side of surface) in the step after film thickness-reduction. However according to the study of the present inventors, it has been found that about 70% for the manufacturing cost is concerned with the reinforcing glass sheet. In the present invention, a stress relief insulation film pattern is formed to the peripheral end of the rear face of a wafer in which processing to the device surface (surface side face) of the wafer has been completed substantially and back grinding has been applied.

摘要翻译： 在通常以由晶片厚度为200μm以下的薄膜晶片的状态重复各种制造的垂直功率MOSFET等通常表示的半导体的制造方法中，是在 在薄膜厚度减薄之后的步骤中将强化玻璃板粘合到晶片的器件表面（表面侧的主表面）的阶段。 然而，根据本发明人的研究，已经发现制造成本的约70％涉及增强玻璃板。 在本发明中，在晶片背面的周面的周面形成有应力消除绝缘膜图案，其中晶片的器件表面（表面侧）的处理已基本完成，并且已经进行了背面研磨。

公开(公告)号：US20050233499A1

公开(公告)日：2005-10-20

申请号：US11100598

申请日：2005-04-07

申请人： Hidekazu Okuda ,  Haruo Amada ,  Taizo Hashimoto

发明人： Hidekazu Okuda ,  Haruo Amada ,  Taizo Hashimoto

IPC分类号： H01L21/28 ,  H01L21/304 ,  H01L21/336 ,  H01L21/44 ,  H01L21/60 ,  H01L21/68 ,  H01L29/41 ,  H01L29/739 ,  H01L29/78

CPC分类号： H01L29/7397 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/01014 ,  H01L2924/0105 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/013

摘要： Provided is a technology capable of improving a production yield of a semiconductor device having, for example, IGBG as a semiconductor element. After formation of an interconnect on the surface side of a semiconductor substrate, a supporting substrate covering the interconnect is bonded onto the interconnect. Then, a BG tape is overlapped and bonded onto the supporting substrate and the semiconductor substrate is ground from the backside. The BG tape is then peeled off and an impurity is introduced into the backside of the semiconductor substrate by ion implantation. Then, the supporting substrate is peeled off, followed by heat treatment of the semiconductor substrate.

摘要翻译： 提供了能够提高具有例如作为半导体元件的IGBG的半导体器件的制造成品率的技术。 在半导体衬底的表面侧上形成互连后，覆盖互连的支撑衬底接合到互连上。 然后，将BG带重叠并接合到支撑基板上，并且半导体基板从背面研磨。 然后将BG带剥离，通过离子注入将杂质引入半导体衬底的背面。 然后，将支撑基板剥离，然后对半导体基板进行热处理。

公开(公告)号：US5857661A

公开(公告)日：1999-01-12

申请号：US550373

申请日：1995-10-30

申请人： Haruo Amada ,  Takashi Komatsu

发明人： Haruo Amada ,  Takashi Komatsu

IPC分类号： F16K7/17 ,  B01D27/10 ,  B05B9/03 ,  F04B43/02 ,  F16K7/07 ,  F16K23/00 ,  F16K31/12

CPC分类号： F16K23/00 ,  F16K7/075 ,  Y10T137/7736

摘要： A valve drive control apparatus having a communication unit for communicating a flow-in-side tube path with a flow-out-side tube path, which guide a fluid member, and a control medium storage chamber into which an attenuation characteristic control medium is filled. The valve drive control apparatus further includes an elastic deform member for defining the communication unit and the control medium storage chamber, a drive unit for pressuring the attenuation characteristic control medium so as to deform the elastic deform member via the attenuation characteristic control medium, and also a control unit for controlling the drive unit based on a drive control valve obtained from a valve drive characteristic representative of a relationship between a deform amount of a valve mechanism unit and a drive pressure value of the valve mechanism unit. The valve drive characteristic is acquired from a dynamic fluid characteristic of the fluid member and a dynamic fluid characteristic of the attenuation characteristic control medium.

摘要翻译： 一种阀驱动控制装置，其具有用于使流入侧管路与引导流体构件的流出侧管路连通的通信单元以及填充有衰减特性控制介质的控制介质储存室 。 阀驱动控制装置还包括用于限定通信单元和控制介质存储室的弹性变形构件，用于对衰减特性控制介质进行加压以便经由衰减特性控制介质使弹性变形构件变形的驱动单元，以及 控制单元，用于基于从表示阀机构单元的变形量与阀机构单元的驱动压力值之间的关系的阀驱动特性获得的驱动控制阀来控制驱动单元。 阀驱动特性是从流体部件的动态流体特性和衰减特性控制介质的动态流体特性获得的。

公开(公告)号：US07335574B2

公开(公告)日：2008-02-26

申请号：US11100598

申请日：2005-04-07

申请人： Hidekazu Okuda ,  Haruo Amada ,  Taizo Hashimoto

发明人： Hidekazu Okuda ,  Haruo Amada ,  Taizo Hashimoto

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L29/7397 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/01014 ,  H01L2924/0105 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/013

摘要： Provided is a technology capable of improving a production yield of a semiconductor device having, for example, IGBG as a semiconductor element. After formation of an interconnect on the surface side of a semiconductor substrate, a supporting substrate covering the interconnect is bonded onto the interconnect. Then, a BG tape is overlapped and bonded onto the supporting substrate and the semiconductor substrate is ground from the backside. The BG tape is then peeled off and an impurity is introduced into the backside of the semiconductor substrate by ion implantation. Then, the supporting substrate is peeled off, followed by heat treatment of the semiconductor substrate.

摘要翻译： 提供了能够提高具有例如作为半导体元件的IGBG的半导体器件的制造成品率的技术。 在半导体衬底的表面侧上形成互连后，覆盖互连的支撑衬底接合到互连上。 然后，将BG带重叠并接合到支撑基板上，并且半导体基板从背面研磨。 然后将BG带剥离，通过离子注入将杂质引入半导体衬底的背面。 然后，将支撑基板剥离，然后对半导体基板进行热处理。

公开(公告)号：US4593168A

公开(公告)日：1986-06-03

申请号：US581268

申请日：1984-02-17

申请人： Haruo Amada

发明人： Haruo Amada

IPC分类号： H01L21/205 ,  C23C16/44 ,  C23C16/458 ,  C30B25/10 ,  C30B25/12 ,  C30B31/12 ,  C30B31/14 ,  H01L21/18 ,  H01L21/22 ,  H05B6/80 ,  H05B6/78

CPC分类号： H01L21/18 ,  C30B25/10 ,  C30B25/12 ,  C30B31/12 ,  C30B31/14 ,  H05B6/806 ,  Y10T29/41

摘要： The present invention relates to a method of heat-treating a semiconductor wafer by utilizing an electromagnetic wave. The wafer is floated by the blast of a gas and is held in a non-contacting state, and the electromagnetic wave, such as microwave, is projected on the wafer in this state so as to heat it. According to the present invention, only the wafer is heated and, hence, the wafer can be heat-treated uniformly and efficiently with great precision.

摘要翻译： 本发明涉及利用电磁波对半导体晶片进行热处理的方法。 晶片被气体喷射而浮起并保持在非接触状态，并且在这种状态下将电磁波（如微波）投影在晶片上以便加热。 根据本发明，只有晶片被加热，因此可以高精度地均匀且有效地热处理晶片。

公开(公告)号：US20100127306A1

公开(公告)日：2010-05-27

申请号：US12644376

申请日：2009-12-22

申请人： Hidekazu Okuda ,  Haruo Amada ,  Taizo Hashimoto

发明人： Hidekazu Okuda ,  Haruo Amada ,  Taizo Hashimoto

IPC分类号： H01L29/739 ,  H01L21/331

CPC分类号： H01L29/7397 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L2221/6834 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/01014 ,  H01L2924/0105 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/013

摘要： Provided is a technology capable of improving a production yield of a semiconductor device having, for example, IGBG as a semiconductor element. After formation of an interconnect on the surface side of a semiconductor substrate, a supporting substrate covering the interconnect is bonded onto the interconnect. Then, a BG tape is overlapped and bonded onto the supporting substrate and the semiconductor substrate is ground from the backside. The BG tape is then peeled off and an impurity is introduced into the backside of the semiconductor substrate by ion implantation. Then, the supporting substrate is peeled off, followed by heat treatment of the semiconductor substrate.

摘要翻译： 提供了能够提高具有例如作为半导体元件的IGBG的半导体器件的制造成品率的技术。 在半导体衬底的表面侧上形成互连后，覆盖互连的支撑衬底接合到互连上。 然后，将BG带重叠并接合到支撑基板上，并且半导体基板从背面研磨。 然后将BG带剥离，通过离子注入将杂质引入半导体衬底的背面。 然后，将支撑基板剥离，然后对半导体基板进行热处理。

公开(公告)号：US5134962A

公开(公告)日：1992-08-04

申请号：US524378

申请日：1990-05-16

申请人： Haruo Amada ,  Akihiro Kojima ,  Hiroshi Kagohashi ,  Atsuyuki Sakai ,  Katsumasa Shimura ,  Hisamitsu Maekawa

发明人： Haruo Amada ,  Akihiro Kojima ,  Hiroshi Kagohashi ,  Atsuyuki Sakai ,  Katsumasa Shimura ,  Hisamitsu Maekawa

IPC分类号： G03F7/16 ,  B05C5/00 ,  B05C11/08 ,  B05C11/10 ,  G11B5/842 ,  H01L21/00 ,  H01L21/027 ,  H01L21/30

CPC分类号： H01L21/6715 ,  B05C11/08

摘要： The present invention relates to a spin coating apparatus for feeding a clean liquid at a fixed rate. In any of the feeding apparatus in the prior art, no constituent other than a filter has the function of eliminating foreign matter, and the operation of feeding a liquid under precise control is not attained. This results in the problem of the mixing of the foreign matter (and air bubbles) in the feed liquid, and the problem of nonuniformity in a feed speed as well as a feed amount. As expedients for solving these problems, the present invention provides the functions of automatically sensing and excluding factors for the appearances of the foreign matters, and devices for automatically and precisely controlling feed control elements such as a pump, thereby feeding the clean liquid in a constant amount and at a constant speed.

摘要翻译： 本发明涉及一种用于以固定速率供给清洁液体的旋涂装置。 在现有技术中的任何一个进料装置中，除了过滤器之外的其它成分都不具有消除异物的功能，并且不能实现在精确控制下供给液体的操作。 这导致进料液体中异物（和气泡）的混合以及进料速度不均匀以及进料量的问题。 作为解决这些问题的方法，本发明提供了自动检测和排除外来物质的因素的功能，以及用于自动和精确地控制诸如泵的进料控制元件的装置，由此将清洁液体进料恒定 数量和恒定速度。