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公开(公告)号:US10001583B2
公开(公告)日:2018-06-19
申请号:US15082805
申请日:2016-03-28
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Dmitry Bakin , Matthias Gloor , Moshe Doron
CPC classification number: G01V8/20 , G03B17/54 , G03B21/2066 , G03B2215/0596
Abstract: The present disclosure describes structured light projection in which a structured light projector includes a light emitter and a compound patterned mask. The mask includes a spacer substrate that is transparent to a wavelength of light emitted by the light emitter. On a first side of the spacer substrate is a first reflective surface having apertures therein to allow light to pass through. Lenses are arranged to focus light, produced by the light emitter, toward the apertures in the first reflective surface. A second reflective surface on a second side of the spacer substrate opposite the first side has apertures therein to allow light passing through the spacer substrate to exit the compound patterned mask.
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12.
公开(公告)号:US09977153B2
公开(公告)日:2018-05-22
申请号:US15116599
申请日:2015-02-02
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Hartmut Rudmann , Markus Rossi , Mario Cesana , Ohad Meitav , Peter Roentgen , Jukka Alasirniö , Stephan Heimgartner , Kai Engelhardt
CPC classification number: G02B3/0062 , G02B7/003 , G02B7/021 , G02B7/022 , G02B27/0961
Abstract: Various stacks of arrays of beam shaping elements are described. Each array of beam shaping elements can be formed, for example, as part of a monolithic piece that includes a body portion as well as the beam shaping elements. In some implementations, the monolithic pieces may be formed, for example, as integrally formed molded pieces. The monolithic pieces can include one or more features to facilitate stacking, aligning and/or centering of the arrays with respect to one another.
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公开(公告)号:US20180138222A1
公开(公告)日:2018-05-17
申请号:US15850003
申请日:2017-12-21
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Hartmut Rudmann , Jukka Alasirniö , Bojan Tesanovic , Tobias Senn , Devanraj Kupusamy , Alexander Bietsch
IPC: H01L27/146 , H04N5/225 , H01L23/00
CPC classification number: H01L27/14618 , H01L24/48 , H01L27/1462 , H01L27/14625 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L2224/48091 , H01L2224/48225 , H01L2924/00014 , H01L2924/181 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N5/2258 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
Abstract: Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the optical channels, and/or prevent adhesive from migrating to active portions of an image sensor.
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14.
公开(公告)号:US20180059218A1
公开(公告)日:2018-03-01
申请号:US15689079
申请日:2017-08-29
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Bernhard Buettgen , Jens Geiger , Michael Kiy , Oliver Chidley , Markus Rossi
CPC classification number: G01S7/483 , G01S7/481 , G01S7/4813 , G01S7/497 , G01S17/026 , G01S17/36 , G01S17/42 , G01S2007/4975
Abstract: A time of flight-based system is operable for ambient light measurements. A method of operation includes detecting, in at least one active demodulation detection pixel, a first particular wavelength and generating amplitude data of the first particular wavelength; and detecting, in at least one spurious reflection detection pixel, a second particular wavelength and generating amplitude data of the second particular wavelength. In a computational device that stores spectrum data corresponding respectively to a plurality of different ambient light source types, an ambient lighting condition is determined based on the amplitude data of the first particular wavelength, the amplitude data of the second particular wavelength and the spectrum data of a particular one of the ambient light source types associated with the amplitude data of the first particular wavelength and the amplitude data of the second particular wavelength.
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公开(公告)号:US09880391B2
公开(公告)日:2018-01-30
申请号:US15026721
申请日:2014-09-05
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Markus Rossi
CPC classification number: G02B27/1013 , G02B3/0031 , G02B3/0062 , G02B13/0065 , G02B13/007 , G02B13/0085 , G02B17/08 , G02B17/086 , G02B27/1066 , G02B27/123 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H04N5/2254
Abstract: A lens module includes a substrate, a first array of passive optical elements on the substrate, and a second array of passive optical elements separate from the first array. The optical elements of the first array and the optical elements of the second array form multiple optical channels, in which at least one optical channel is a catadioptric optical channel including a reflective optical element and a refractive optical element. The reflective optical element is arranged to reflect light toward the refractive optical element, each optical channel has a corresponding field-of-view, and the lens module has an overall field of view defined by the range of angles subtended by the field-of-view of the plurality of optical channels.
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公开(公告)号:US09859327B2
公开(公告)日:2018-01-02
申请号:US15367257
申请日:2016-12-02
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L21/00 , H01L27/146 , H01L31/0203 , H01L31/0232 , H01L33/58
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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公开(公告)号:US20170356622A1
公开(公告)日:2017-12-14
申请号:US15618253
申请日:2017-06-09
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Markus Rossi , Peter Riel , Peter Roentgen
IPC: F21V9/08 , F21V5/00 , F21V7/22 , F21Y2115/30
CPC classification number: F21V9/08 , F21V5/004 , F21V7/22 , F21V9/30 , F21Y2115/30
Abstract: The present disclosure describes light conversion modules each having a single laser diode or multiple laser diodes. The light conversion modules can be particularly small in size (height and lateral footprint) and can overcome various challenges associated with the high optical power and heat emitted by laser diodes. In some implementations, the light conversion modules include glass phosphors, which, in some instances, can resist degradation caused by the optical power and/or heat generated by the laser diodes. In some instances, the light conversion modules include optical filters which, in some instances, can reduce or eliminate human eye-safety risk.
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公开(公告)号:US20170343889A1
公开(公告)日:2017-11-30
申请号:US15675955
申请日:2017-08-14
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Peter Riel , Markus Rossi , Daniel Pérez Calero , Matthias Gloor , Moshe Doron , Dmitry Bakin , Philippe Bouchilloux
CPC classification number: G03B21/142 , G02B7/003 , G02B7/02 , G03B21/2033 , H01L27/14618 , H01L33/483 , H01L33/58 , H01L2933/0033 , H01L2933/0058
Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.
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公开(公告)号:US20170336543A1
公开(公告)日:2017-11-23
申请号:US15522423
申请日:2015-11-11
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Nicola SPRING , Hartmut RUDMANN , Markus ROSSI
CPC classification number: G02B5/045 , F21V7/0091 , G02B3/0062 , G02B5/04 , G02B6/13 , G02B6/43 , G02B13/0065 , G02B17/0856
Abstract: The method for manufacturing optical light guide elements comprises a) providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; b) positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; c) fixing the plurality of initial bars with respect to each other in the position achieved in step b) to obtain a bar arrangement. The method further comprises at least one of the following steps d), d′), d″): d) segmenting the bar arrangement into bars referred to as prism bars each of which comprises a portion of at least two different ones of the plurality of initial bars, by conducting a plurality of cuts through the bar arrangement; in particular wherein the cuts are parallel cuts; d′) segmenting the bar arrangement into bars referred to as prism bars by separating the bar arrangement into parts along cut lines, wherein the cut lines are at an angle with the initial-bar directions; d″) segmenting the bar arrangement into bars referred to as prism bars by separating the bar arrangement into sections by creating cut faces which are at an angle with respect to the initial-bar directions. And the method further comprises e) segmenting the prism bars into parts.
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公开(公告)号:US09826316B2
公开(公告)日:2017-11-21
申请号:US14894059
申请日:2014-05-26
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Jens Geiger , Markus Rossi , Hartmut Rudmann
CPC classification number: H04R19/04 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/096 , B81C1/00873 , H04R3/00 , H04R19/005 , H04R31/00
Abstract: A method of fabricating a plurality of MEMS microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an LED 102, an IC chip 22 and a MEM microphone device 24, where the LED 102 and IC chip 22 are surrounded and separated by first spacers 104, 64A, 64, the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the IC chip 22, mounting a MEMS microphone device 24 to the second substrate 60, the second substrate not extending over the LED 102, surrounding the MEMS microphone device by second spacers 32A, 32, attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the MEMS cavities, dividing the substrate wafer 62 into individual MEMS microphone modules through the width of the separating spacers 104, 32, 64. Conductive traces may extend through the spacers. Also defined are MEMS modules without LED's, without stacking, on a single substrate, or on either side of a single substrate.
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