公开(公告)号：US20170336543A1

公开(公告)日：2017-11-23

申请号：US15522423

申请日：2015-11-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Nicola SPRING ,  Hartmut RUDMANN ,  Markus ROSSI

IPC: G02B5/04 ,  F21V7/00 ,  G02B17/08

CPC classification number: G02B5/045 ,  F21V7/0091 ,  G02B3/0062 ,  G02B5/04 ,  G02B6/13 ,  G02B6/43 ,  G02B13/0065 ,  G02B17/0856

Abstract: The method for manufacturing optical light guide elements comprises a) providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; b) positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; c) fixing the plurality of initial bars with respect to each other in the position achieved in step b) to obtain a bar arrangement. The method further comprises at least one of the following steps d), d′), d″): d) segmenting the bar arrangement into bars referred to as prism bars each of which comprises a portion of at least two different ones of the plurality of initial bars, by conducting a plurality of cuts through the bar arrangement; in particular wherein the cuts are parallel cuts; d′) segmenting the bar arrangement into bars referred to as prism bars by separating the bar arrangement into parts along cut lines, wherein the cut lines are at an angle with the initial-bar directions; d″) segmenting the bar arrangement into bars referred to as prism bars by separating the bar arrangement into sections by creating cut faces which are at an angle with respect to the initial-bar directions. And the method further comprises e) segmenting the prism bars into parts.

公开(公告)号：US20160112808A1

公开(公告)日：2016-04-21

申请号：US14894059

申请日：2014-05-26

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： Jens GEIGER ,  Markus ROSSI ,  Hartmut RUDMANN

IPC: H04R19/04 ,  B81C1/00 ,  H04R19/00 ,  H04R3/00 ,  H04R31/00

CPC classification number: H04R19/04 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00873 ,  H04R3/00 ,  H04R19/005 ,  H04R31/00

Abstract: A method of fabricating a plurality of MEMS microphone modules by providing a first substrate wafer 62 on which are mounted a plurality of sets comprising an LED 102, an IC chip 22 and a MEM microphone device 24, where the LED 102 and IC chip 22 are surrounded and separated by first spacers 104, 64A, 64, the spacer 104 being much taller, attaching a second substrate on top of the first spacer elements above the IC chip 22, mounting a MEMS microphone device 24 to the second substrate 60, the second substrate not extending over the LED 102, surrounding the MEMS microphone device by second spacers 32A, 32, attaching a cover wafer 28 across the whole first substrate wafer 62 covering all the plurality of sets, forming openings 30 to the MEMS cavities, dividing the substrate wafer 62 into individual MEMS microphone modules through the width of the separating spacers 104, 32, 64. Conductive traces may extend through the spacers. Also defined are MEMS modules without LED's, without stacking, on a single substrate, or on either side of a single substrate.

Abstract translation: 通过提供第一衬底晶片62来制造多个MEMS麦克风模块的方法，第一衬底晶片62上安装有包括LED 102，IC芯片22和MEM麦克风装置24的多个组，其中LED 102和IC芯片22是 由第一间隔件104,64A，64包围和隔开，间隔件104高得多，将第二衬底附接在IC芯片22上方的第一间隔件的顶部上，将MEMS麦克风装置24安装到第二衬底60上，第二衬底 衬底不延伸穿过LED102，通过第二间隔件32A，32围绕MEMS麦克风装置，将覆盖晶片28的整个第一衬底晶片62覆盖所有多个组，将开口30形成到MEMS空腔，将衬底 晶片62通过分离间隔物104,32,64的宽度分成单独的MEMS麦克风模块。导电迹线可延伸穿过间隔物。 还定义了没有LED的MEMS模块，不在单个衬底上或在单个衬底的任一侧上堆叠。

公开(公告)号：US20150340351A1

公开(公告)日：2015-11-26

申请号：US14760059

申请日：2014-01-02

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： Markus ROSSI ,  Jens GEIGER

IPC: H01L25/16 ,  H01L31/0232 ,  H01L33/58

CPC classification number: H01L25/167 ,  H01L25/165 ,  H01L31/02325 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Opto-electronic modules, which can be fabricated in a wafer-scale process, include light emitting and/or light sensing devices mounted on or in a substrate. The modules, which can include various features to help reduce the occurrence of optical cross-talk and help prevent interference from stray light, can be used in a wide range of applications, including medical and health-related applications. For example, performing a measurement on a human body can include bringing a portion of the human body into direct contact with an exterior surface of the opto-electronic module and using a differential optical absorption spectroscopy technique to obtain an indication of a physical condition of the human body.

Abstract translation: 可以以晶片级工艺制造的光电模块包括安装在衬底上或衬底中的发光和/或光感测装置。 这些模块可以包括各种功能，以帮助减少光串扰的发生并有助于防止杂散光的干扰，可用于广泛的应用，包括医疗和健康相关应用。 例如，对人体进行测量可以包括使人体的一部分与光电子模块的外表面直接接触，并且使用差分光吸收光谱技术来获得对所述光电子模块的物理状态的指示 人体。