公开(公告)号：US11746085B2

公开(公告)日：2023-09-05

申请号：US17284274

申请日：2019-09-27

申请人： Changzhou Tronly Advanced Electronic Materials Co., Ltd. ,  Changzhou Tronly New Electronic Materials Co., Ltd.

发明人： Xiaochun Qian

IPC分类号： C07C381/12 ,  C07D209/88 ,  C07D307/91 ,  C07D333/76 ,  G03F7/004

CPC分类号： C07C381/12 ,  C07D209/88 ,  C07D307/91 ,  C07D333/76 ,  G03F7/004

摘要： The present invention discloses a triphenylsulfonium salt compound as shown in the general formula (I), wherein R1 represents an electron-withdrawing group and R2 represents an amplification group. Said compound shows significantly enhanced solubility and photosensitivity compared with unsubstituted triphenylsulfonium salts, and has significantly advantageous performance compared with prior art improved substitutes.

公开(公告)号：US20230274936A1

公开(公告)日：2023-08-31

申请号：US18173344

申请日：2023-02-23

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Yasuyuki YAMAMOTO ,  Kenta ISHIWATA ,  Toshiharu YANO ,  Tsutomu OGIHARA

IPC分类号： H01L21/027 ,  G03F7/004 ,  G03F7/025 ,  G03F7/09 ,  C09G1/16 ,  H01L21/311 ,  H01L21/3105 ,  H01L21/033 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/3213

CPC分类号： H01L21/0276 ,  G03F7/0045 ,  G03F7/0048 ,  G03F7/025 ,  G03F7/091 ,  G03F7/094 ,  C09G1/16 ,  H01L21/0275 ,  H01L21/31116 ,  H01L21/31058 ,  H01L21/31138 ,  H01L21/31144 ,  H01L21/0337 ,  H01L21/3065 ,  H01L21/3086 ,  H01L21/3081 ,  H01L21/32139 ,  H01L21/32135

摘要： The present invention is a planarizing agent for forming an organic film, including an aromatic-group-containing compound having a molecular weight represented by a molecular formula of 200 to 500, wherein a blended composition that includes the planarizing agent and a preliminary composition containing an organic film-forming resin and a solvent, and having a complex viscosity of 1.0 Pa·s or more in a temperature range of 175° C. or higher has a temperature range in which a complex viscosity of the blended composition is less than 1.0 Pa·s in a temperature range of 175° C. or higher. This provides a planarizing agent for forming an organic film to yield a composition for forming an organic film having a high planarizing ability; a composition for forming an organic film containing this planarizing agent; a method for forming an organic film using this composition; and a patterning process.

公开(公告)号：US20230273523A1

公开(公告)日：2023-08-31

申请号：US18311627

申请日：2023-05-03

申请人： Samsung SDI Co., Ltd.

发明人： Jaeyeol BAEK ,  Soonhyung KWON ,  Minsoo KIM ,  Hyeon PARK ,  Shinhyo BAE ,  Daeseok SONG ,  Yoojeong CHOI

IPC分类号： G03F7/11 ,  G03F7/26 ,  C07D251/32 ,  G03F7/16 ,  G03F7/004

CPC分类号： G03F7/11 ,  G03F7/26 ,  C07D251/32 ,  G03F7/168 ,  G03F7/0045

摘要： A resist underlayer composition includes a polymer including a structural unit represented by Chemical Formula 1, and a solvent. A method of forming patterns uses the resist underlayer composition under a photoresist pattern to enhance the sensitivity of the photoresist to an exposure light source, thereby providing enhanced resolution and faster processing times.

公开(公告)号：US11740555B2

公开(公告)日：2023-08-29

申请号：US17175957

申请日：2021-02-15

申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

发明人： Yukako Anryu ,  Satoshi Yamaguchi ,  Koji Ichikawa

IPC分类号： G03F7/004 ,  G03F7/38 ,  C08F220/18 ,  C07C69/84 ,  C07D309/12 ,  G03F7/038 ,  G03F7/039

CPC分类号： G03F7/0046 ,  C07C69/84 ,  C07D309/12 ,  C08F220/1808 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/039 ,  G03F7/38

摘要： Disclosed is a resist composition including a compound represented by formula (I), a resin having an acid-labile group and an acid generator, the resin having an acid-labile group including at least one selected from the group consisting of a structural unit represented by formula (a1-1) and a structural unit represented by formula (a1-2):

公开(公告)号：US20230258864A1

公开(公告)日：2023-08-17

申请号：US18043630

申请日：2021-08-31

申请人： Arizona Board of Regents on Behalf of the University of Arizona

发明人： Dong-Chul "Jeffrey" PYUN ,  Robert A. NORWOOD ,  Julie Ilana FRISH ,  Tristan Stephen KLEINE

IPC分类号： G02B6/122 ,  G02B6/138 ,  G03F7/027 ,  G03F7/004

CPC分类号： G02B6/1221 ,  G02B6/138 ,  G03F7/027 ,  G03F7/0046

摘要： The present invention is directed to refractive index contrast (“RIC”) polymers and methods for producing and using the same. In one particular embodiment, RIC polymers of the invention can be used as waveguides. RIC polymers of the invention are produced from a monomeric mixture comprising a first monomer and a second monomer comprising an acid-labile protecting group, where a first polymer produced from the first monomer has a different refractive index compared to the refractive index of a second polymer produced from the second monomer. The base refractive index of RIC polymers can be tuned by controlling the amount of the first and the second monomers. Furthermore, the refractive index of the waveguide can be modulated by the amount of acid-labile protecting group removal.

公开(公告)号：US11720021B2

公开(公告)日：2023-08-08

申请号：US17062048

申请日：2020-10-02

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Jun Hatakeyama ,  Masahiro Fukushima

IPC分类号： G03F7/004 ,  G03F7/039 ,  C08F212/14 ,  C08F220/18 ,  C08F220/30 ,  C08F20/52 ,  C08F220/56

CPC分类号： G03F7/039 ,  C08F20/52 ,  C08F212/24 ,  C08F220/1808 ,  C08F220/30 ,  C08F220/303 ,  C08F220/56

摘要： A positive resist composition comprising a base polymer comprising recurring units (a) containing an imide group having an iodized aromatic group bonded thereto and recurring units (b1) having an acid labile group-substituted carboxyl group and/or recurring units (b2) having an acid labile group-substituted phenolic hydroxyl group has a high sensitivity and resolution and forms a pattern of good profile with reduced edge roughness and size variation.

公开(公告)号：US20230244140A1

公开(公告)日：2023-08-03

申请号：US17919025

申请日：2021-03-11

申请人： SAMSUNG SDI CO., LTD.

发明人： Ieju KIM ,  Seungbeom KEE ,  Juho JUNG

IPC分类号： G03F7/00 ,  G03F7/033 ,  G03F7/004 ,  C09D5/32 ,  C09D4/06 ,  C09D135/02 ,  C09D7/63 ,  C09D7/41

CPC分类号： G03F7/0007 ,  C09D4/06 ,  C09D5/32 ,  C09D7/41 ,  C09D7/63 ,  C09D135/02 ,  G03F7/033 ,  G03F7/0045

摘要： Provided are a photosensitive resin composition, a photosensitive resin film manufactured by using the photosensitive resin composition, and a color filter including same, the photosensitive resin composition including: (A) a binder resin; (B) a colorant; (C) a polymerizable compound; (D) an initiator comprising a photopolymerization initiator and a thermal polymerization initiator; and (E) a solvent, wherein the thermal polymerization initiator has a half-life of 50 or less (t½ = 10 h), and the thermal polymerization initiator is included in an amount equal to or greater than that of the photopolymerization initiator.

公开(公告)号：US20230236507A1

公开(公告)日：2023-07-27

申请号：US17585033

申请日：2022-01-26

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Tzu-Yang LIN ,  Chen-Yu LIU ,  Ching-Yu CHANG

IPC分类号： G03F7/039 ,  G03F7/004 ,  G03F7/20 ,  C25D7/12 ,  G03F7/32 ,  G03F7/34

CPC分类号： G03F7/0392 ,  G03F7/0045 ,  G03F7/2006 ,  C25D7/12 ,  G03F7/322 ,  G03F7/34

摘要： A method of manufacturing a semiconductor structure includes the following operations. A photoresist layer is formed on a metal layer, in which the photoresist layer includes an additive selected from the group consisting of a first heterocyclic compound containing a triazole ring, a second heterocyclic compound containing an imidazole ring, biphenyl thiol, biphenyl dithiol, benzenethiol, and benzenedithiol. The photoresist layer is exposed to an actinic radiation. The photoresist layer is developed by a developer to form holes in the photoresist layer. Redistribution lines are formed in the holes by an electroplating process.

公开(公告)号：US20230229078A1

公开(公告)日：2023-07-20

申请号：US18177742

申请日：2023-03-02

申请人： FUJIFILM Corporation

发明人： Masahiro YOSHIDOME

IPC分类号： G03F7/004 ,  G03F7/16 ,  G03F7/40

CPC分类号： G03F7/0048 ,  G03F7/16 ,  G03F7/40

摘要： An object of the present invention is to provide a chemical liquid supply method capable of reducing the content of impurities in a chemical liquid. Another object of the present invention is to provide a pattern forming method.
The chemical liquid supply method according to an embodiment of the present invention is a chemical liquid supply method of supplying a chemical liquid containing an organic solvent through a pipe line that an apparatus for semiconductor devices comprises, the chemical liquid supply method having a gas pumping step of sending the chemical liquid by pressurization using a gas, in which a moisture content in the gas is 0.00001 to 1 ppm by mass with respect to a total mass of the gas.

公开(公告)号：US11703760B2

公开(公告)日：2023-07-18

申请号：US17223256

申请日：2021-04-06

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Jun Hatakeyama ,  Masahiro Fukushima

IPC分类号： G03F7/004 ,  G03F7/11 ,  G03F7/039 ,  G03F7/038 ,  C07C69/653 ,  C08F220/24 ,  C08F220/28 ,  C08F212/14 ,  C08F220/30 ,  C08F220/22

CPC分类号： G03F7/0392 ,  C07C69/653 ,  C08F212/24 ,  C08F220/22 ,  C08F220/24 ,  C08F220/281 ,  C08F220/282 ,  C08F220/283 ,  C08F220/301 ,  C08F220/303 ,  G03F7/0046 ,  G03F7/0382 ,  G03F7/0397 ,  G03F7/11 ,  C07C2601/08

摘要： A fluorocarboxylic acid-containing polymer comprising recurring units having formula (A1), but not acid labile group-containing recurring units is provided. A resist composition comprising the same offers a high sensitivity and is unsusceptible to nano-bridging or pattern collapse independent of whether it is of positive or negative tone.