公开(公告)号：US20090294734A1

公开(公告)日：2009-12-03

申请号：US12453810

申请日：2009-05-22

申请人： Cheng Yang ,  Matthew Ming Fai Yuen ,  Bing Xu

发明人： Cheng Yang ,  Matthew Ming Fai Yuen ,  Bing Xu

IPC分类号： H01B1/20

CPC分类号： H01B1/22 ,  H05K3/321 ,  H05K2203/125 ,  Y10T428/2991 ,  Y10T428/2998

摘要： An electroconductive bonding material is formed as a Modified Electrically Conductive Adhesive (MECA), and consists of a resin matrix and a modified conductive filler. The resin matrix if formed by providing a thermosetting or thermoplastic resin-based polymer resin. The conductive filler is a metal filler material suitable for use as conductive filler for the resin matrix. The metal filler is modified by applying a material selected from one of halogens, pseudohalogens or their precursors.

摘要翻译： 形成导电接合材料作为改性导电胶（MECA），由树脂基体和改性导电填料组成。 如果通过提供热固性或热塑性树脂基聚合物树脂形成树脂基体。 导电填料是适用于树脂基体的导电填料的金属填料。 通过施加选自卤素，假卤素或其前体之一的材料来修饰金属填料。

公开(公告)号：US20090291230A1

公开(公告)日：2009-11-26

申请号：US12468066

申请日：2009-05-19

申请人： CHENG-HSIEN LIN ,  YAO-WEN BAI ,  RUI ZHANG

发明人： CHENG-HSIEN LIN ,  YAO-WEN BAI ,  RUI ZHANG

IPC分类号： B05D3/06 ,  C09D11/02 ,  C08K3/10

CPC分类号： C09D11/102 ,  C09D11/52 ,  C23C18/06 ,  C23C18/08 ,  C23C18/14 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1612 ,  C23C18/1651 ,  C23C18/204 ,  C23C18/405 ,  H05K3/105 ,  H05K3/182 ,  H05K2203/013 ,  H05K2203/107 ,  H05K2203/1157 ,  H05K2203/125

摘要： A silver-containing ink includes an aqueous carrier medium having both a silver salt and an amine sensitizer for the silver salt dissolved therein, and a light sensitive reducing agent dispersed in the aqueous carrier medium. The amine sensitizer includes at one or more amine group; and the light sensitive reducing agent is capable of reducing the silver in the silver-containing ink to silver particles when irradiated.

摘要翻译： 含银油墨包括具有溶解银盐的银盐和胺敏化剂的水性载体介质和分散在载体介质中的光敏还原剂​​。 胺敏化剂包括一个或多个胺基团; 并且光敏还原剂​​能够在照射时将含银墨水中的银还原成银颗粒。

公开(公告)号：US20090269606A1

公开(公告)日：2009-10-29

申请号：US12093117

申请日：2006-11-08

申请人： Kazuhiko Matsumoto

发明人： Kazuhiko Matsumoto

IPC分类号： B32B3/10 ,  C25D5/54 ,  H05K3/10 ,  C25D5/02

CPC分类号： H05K3/188 ,  C23C18/1653 ,  C23C18/1658 ,  C23C18/1834 ,  C23C18/2066 ,  C23C18/31 ,  C25D5/022 ,  C25D5/18 ,  C25D5/56 ,  H05K3/108 ,  H05K3/181 ,  H05K3/387 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10T428/12063

摘要： The present invention provides a method for forming a metal film including: (a1) a step of providing, on a substrate, a polymer layer that includes a polymer containing a functional group that interacts with a metal ion or a metal salt, the polymer directly chemically bonding to the substrate; (a2) a step of applying a metal ion or a metal salt to the polymer layer; (a3) a step of reducing the metal ion or the metal salt to form a conductive layer having a surface resistivity of from 10 to 100 kΩ/square; and (a4) a step of forming a conductive layer having a surface resistivity of 1×10−1 Ω/square or less by electroplating.

摘要翻译： 本发明提供一种形成金属膜的方法，包括：（a1）在基材上提供包含含有与金属离子或金属盐相互作用的官能团的聚合物的聚合物层的步骤，所述聚合物直接 化学键合到基底上; （a2）向聚合物层施加金属离子或金属盐的工序; （a3）还原金属离子或金属盐以形成表面电阻率为10〜100kΩ/□的导电层的工序; 和（a4）通过电镀形成表面电阻率为1×10 -1Ω/平方或以下的导电层的步骤。

公开(公告)号：US20090269510A1

公开(公告)日：2009-10-29

申请号：US12109740

申请日：2008-04-25

申请人： Daniel Lieberman ,  Peter W. de Oliveira ,  Karsten Moh ,  Sarah Schumacher ,  Michael Veith

发明人： Daniel Lieberman ,  Peter W. de Oliveira ,  Karsten Moh ,  Sarah Schumacher ,  Michael Veith

IPC分类号： B05D3/06 ,  B05D5/12 ,  B05C9/14

CPC分类号： H05K3/105 ,  C23C18/14 ,  H05K1/0393 ,  H05K2201/2054 ,  H05K2203/107 ,  H05K2203/125 ,  H05K2203/1545

摘要： Methods and systems for applying printed electronics to various substrates are provided. In specific embodiments methods and systems for providing a highly reflective silver coating to a substrate are provided. Such methods include use of a photocatalytic material to initiate the reduction of a silver complex applied to the substrate to provide the highly reflective silver coating. The silver coating may conduct electricity.

摘要翻译： 提供了将印刷电子器件应用于各种基板的方法和系统。 在具体实施方案中，提供了用于向基材提供高反射性银涂层的方法和系统。 这样的方法包括使用光催化材料来引发施加到基底上的银络合物的还原以提供高反射性银涂层。 银涂层可能会导电。

公开(公告)号：US20090258490A1

公开(公告)日：2009-10-15

申请号：US12420265

申请日：2009-04-08

申请人： Atsushi DENDA

发明人： Atsushi DENDA

IPC分类号： H01L21/3205

CPC分类号： H05K3/1283 ,  H01L27/124 ,  H01L27/1292 ,  H05K3/105 ,  H05K2203/087 ,  H05K2203/1131 ,  H05K2203/1157 ,  H05K2203/125

摘要： A method for forming a conductive film, includes: applying a dispersion liquid above a substrate, the dispersion liquid including a plurality of conductive fine-particles made of one conductive material selected from the group consisting of copper, nickel, and an alloy that includes copper or nickel as a main component; and forming the conductive film made from the conductive fine-particles, by heating the dispersion liquid that has been applied above the substrate in an atmosphere including formic acid, by baking the conductive fine-particles so that the conductive fine-particles are mutually fusion bonded.

摘要翻译： 一种形成导电膜的方法，包括：在基底上施加分散液，所述分散液包括由选自铜，镍和包含铜的合金的一种导电材料制成的多个导电微粒 或镍为主要成分; 并且通过在导电性微粒中焙烧导电性微粒，使导电性微粒相互融合而形成由导电性微粒构成的导电膜，通过在包含甲酸的气氛中加热涂布在基板上方的分散液， 。

公开(公告)号：US20090142482A1

公开(公告)日：2009-06-04

申请号：US11948509

申请日：2007-11-30

申请人： Yuning LI ,  Ping LIU ,  Yiliang WU ,  Hualong PAN ,  Paul F. SMITH ,  Hadi K. MAHABADI

发明人： Yuning LI ,  Ping LIU ,  Yiliang WU ,  Hualong PAN ,  Paul F. SMITH ,  Hadi K. MAHABADI

IPC分类号： B05D5/12

CPC分类号： B41M3/001 ,  B41M3/006 ,  B41M3/008 ,  D06P1/0048 ,  D06P1/445 ,  D06P1/67308 ,  H05K3/105 ,  H05K3/182 ,  H05K2203/013 ,  H05K2203/1157 ,  H05K2203/121 ,  H05K2203/125

摘要： A method of forming a conductive ink silver features on a substrate by printing a silver compound solution and a hydrazine compound reducing agent solution on the surface of a substrate with a printhead. The silver compound solution and the hydrazine compound reducing agent solution are mixed just before, during, or following the printing of both solutions on the surface of the substrate, and the silver compound is then reduced to form conductive silver ink features on the substrate.

摘要翻译： 通过用印刷头在基板的表面上印刷银化合物溶液和肼化合物还原剂溶液，在基板上形成导电油墨银的方法。 将银化合物溶液和肼化合物还原剂溶液在两种溶液在基材表面上印刷之前，之中或之后混合，然后还原银化合物以在基材上形成导电银墨。

公开(公告)号：US20080178761A1

公开(公告)日：2008-07-31

申请号：US12017411

申请日：2008-01-22

申请人： Atsushi TOMOTAKE ,  Hirotaka IIJIMA

发明人： Atsushi TOMOTAKE ,  Hirotaka IIJIMA

IPC分类号： B05D5/12 ,  C23C20/02

CPC分类号： C23C18/06 ,  C23C18/08 ,  C23C18/161 ,  C23C18/1692 ,  C23C18/2006 ,  C23C18/30 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  H05K3/105 ,  H05K2203/013 ,  H05K2203/1105 ,  H05K2203/121 ,  H05K2203/125

摘要： An objective is to provide plate making printing exhibit conductivity and flexibility with respect to a flexible substrate, and to provide a method of forming metal patterns via non-plate making printing, and a metal salt mixture usable for the method. Also disclosed is a method of forming a metal pattern possessing the steps of conducting patterning on a substrate with a metal salt mixture for the metal pattern formation possessing a metal salt and a reducing agent, and having a viscosity of 3-50 mPa·s at 25 ° C., and forming the metal pattern via heating to a temperature of 80-400° C.

摘要翻译： 目的是提供相对于柔性基板显示出导电性和柔性的制版印刷品，并提供通过非印版印刷形成金属图案的方法和可用于该方法的金属盐混合物。 还公开了一种形成金属图案的方法，该金属图案具有以下步骤：用金属盐混合物在基底上进行图案化，所述金属盐混合物具有金属盐和还原剂，并且具有3-50mPa.s的粘度 25℃，通过加热形成金属图案至80-400℃。

公开(公告)号：US20060057827A1

公开(公告)日：2006-03-16

申请号：US11217878

申请日：2005-09-01

申请人： Lauri Huhtasalo ,  Samuli Stromberg ,  Marko Hanhikorpi ,  Olli Hyvarinen ,  Pekka Taskinen ,  Tuija Suortti

发明人： Lauri Huhtasalo ,  Samuli Stromberg ,  Marko Hanhikorpi ,  Olli Hyvarinen ,  Pekka Taskinen ,  Tuija Suortti

IPC分类号： H01L21/20

CPC分类号： H05K3/207 ,  G06K19/07779 ,  G06K19/07783 ,  H05K1/092 ,  H05K3/386 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/087 ,  H05K2203/102 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10T29/49149 ,  Y10T29/49155

摘要： The present invention relates to a method for manufacturing an electrically conductive pattern by printing a layer comprising metal oxide on a carrier substrate (2) and reducing the metal oxide to metal. The reduced layer is transferred to an application substrate (7). The present invention also relates to the use of the method.

摘要翻译： 本发明涉及通过在载体基板（2）上印刷包含金属氧化物的层并将金属氧化物还原成金属来制造导电图案的方法。 还原层被转移到施加衬底（7）上。 本发明还涉及该方法的用途。

公开(公告)号：US20040259007A1

公开(公告)日：2004-12-23

申请号：US10500124

申请日：2004-06-25

发明人： Katsuhiko Takahashi ,  Kiwako Ohmori ,  Masanori Endo ,  Hikaru Yasuhara ,  Akinobu Ono ,  Takayuki Imai ,  Yukihiko Kurosawa ,  Hiroaki Zaima

IPC分类号： G03C005/00

CPC分类号： H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/105 ,  H05K3/321 ,  H05K2203/1157 ,  H05K2203/125

摘要： An electrically conductive composition can be obtained that provides an electrically conductive coating having low volume resistivity and high electrical conductivity comparable to that of metallic silver independent of high-temperature film deposition conditions, while also enabling the line width of an electrical circuit to be sufficiently narrow without having to increase thickness in the case of forming an electrical circuit of a flexible circuit board and so forth. An electrically conductive composition is formed with a composition composed of a particulate silver compound, a reducing agent and optionally a dispersion medium. Silver oxide, silver carbonate or silver acetate and so forth is used for the particulate silver compound. Water or alcohol, for example, is used for the dispersion medium, and ethylene glycol or diethylene glycol and so forth is used for the reducing agent. In addition, the average particle diameter of the particulate silver compound is preferably about 0.01-10 nullm.

摘要翻译： 可以获得导电组合物，其提供导电涂层，其具有与金属银相比具有低体积电阻率和高导电性的导电涂层，而与高温膜沉积条件无关，同时还使电路的线宽足够窄 而在形成柔性电路板等的电路的情况下不必增加厚度。 用由颗粒状银化合物，还原剂和任选的分散介质组成的组合物形成导电组合物。 氧化银，碳酸银或乙酸银等用于颗粒状银化合物。 例如，水或醇用于分散介质，并且还原剂使用乙二醇或二甘醇等。 此外，颗粒状银化合物的平均粒径优选为约0.01-10μm。

公开(公告)号：US06742250B2

公开(公告)日：2004-06-01

申请号：US10180097

申请日：2002-06-27

申请人： Kazuyuki Takahashi

发明人： Kazuyuki Takahashi

IPC分类号： H05K302

CPC分类号： H05K3/4661 ,  H05K3/184 ,  H05K3/26 ,  H05K2201/0761 ,  H05K2203/0786 ,  H05K2203/125 ,  H05K2203/1407 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A method for manufacturing a wiring substrate 1 includes a conductor layer forming step for forming a second conductor layer 29, through electroless copper plating and copper electroplating, on a first resin dielectric layer 7, which is surface-roughened to a predetermined roughness and to which palladium adheres; a cyan treatment step for cleaning a substrate 41 on which the second conductor layer 29 is formed, using a cyanide-containing solution; and an upper resin dielectric layer forming step for forming a second resin dielectric layer 9 on the first resin dielectric layer 7 and the second conductor layer 29 of the cyan-treated substrate 41.

摘要翻译： 布线基板1的制造方法包括：通过无电镀铜和电镀铜形成第二导体层29的导体层形成工序，在第一树脂电介质层7上进行表面粗糙化至规定的粗糙度， 钯粘附; 使用含氰化物溶液清洗其上形成有第二导体层29的基板41的青色处理步骤; 以及用于在第一树脂电介质层7和青色处理的基板41的第二导体层29上形成第二树脂电介质层9的上树脂电介质层形成步骤。