公开(公告)号：US12301391B2

公开(公告)日：2025-05-13

申请号：US17729507

申请日：2022-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunseob Song

IPC: H04B5/00 ,  H04B1/16 ,  H04B5/72 ,  H04L25/06 ,  H04L27/00 ,  H04L27/06 ,  H04W4/80

Abstract: Provided is a near-field communication (NFC) receiver. The NFC receiver includes at least one antenna configured to receive an amplitude modulation (AM) signal, a first analog-to-digital converter (ADC) configured to generate an in-phase (I)-sample by sampling the AM signal based on a first clock signal, a second ADC configured to generate a quadrature-phase (Q)-sample by sampling the AM signal based on a second clock signal, the second clock signal having a phase difference of 90° from the first clock signal, and processing circuitry configured to calculate a root-sum-square (RSS) value between the I-sample and the Q-sample, and detect an envelope of the AM signal by using the RSS value.

公开(公告)号：US12301372B2

公开(公告)日：2025-05-13

申请号：US16202079

申请日：2018-11-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sompong Paul Olarig

IPC: G06F13/00 ,  G06F30/331 ,  H03K19/173 ,  H04L12/04 ,  H04L12/44 ,  G06F13/38 ,  G06F13/40

Abstract: A chassis front-end is disclosed. The chassis front-end may include a switchboard including an Ethernet switch, a Baseboard Management Controller, and a mid-plane connector. The chassis front-end may also include a mid-plane including at least one storage device connector and a speed logic to inform at least one storage device of an Ethernet speed of the chassis front-end. The Ethernet speeds may vary.

公开(公告)号：US12301353B2

公开(公告)日：2025-05-13

申请号：US18469150

申请日：2023-09-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-Ju Kim ,  Chae-Man Lim ,  Min-Goo Kim ,  Jong-Han Lim ,  Hyuk-Joon Kwon ,  Jung-Won Lee

IPC: H04J11/00 ,  H04L1/00 ,  H04L25/03 ,  H04L1/1825 ,  H04W92/20

Abstract: Methods, a Base Station (BS), and a User Equipment (UE) in a wireless communication system for transmitting and receiving control information are provided. The method for transmitting control information by a BS in a wireless communication system includes receiving information related to a signal transmitted by a second BS that the second BS which is a neighboring BS of the first BS, determining whether a second UE using an identical resource to that used by a first UE included in a cell of the first BS exists within a cell of the second BS based on the received information, when the second UE exists, generating control information for controlling a signal transmitted to the second UE by the second BS based on the received information, and transmitting the generated control information to the first UE through a control channel.

公开(公告)号：US12301273B2

公开(公告)日：2025-05-13

申请号：US17882008

申请日：2022-08-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bosoon Kang ,  Kangmoon Kim ,  Namsu Kim ,  Jieun Myung ,  Dahyun Lee ,  Junwon Lee ,  Jinhoo Lee

IPC: H04B1/3888 ,  G06F3/0354 ,  G09F9/30

Abstract: Disclosed is a cover for a foldable electronic device. The cover includes: a first cover portion configured to be coupled to a first housing of the electronic device, a second cover portion configured to be coupled to a second housing of the electronic device, a connecting portion provided between the first cover portion and the second cover portion and extending in a first direction, the connecting portion being configured such that the first cover portion and the second cover portion are folded to be superimposed on each other or are unfolded, and a pen holder configured to at least partially accommodate a pen and mounted on the connecting portion to be detachable.

公开(公告)号：US12300730B2

公开(公告)日：2025-05-13

申请号：US18668743

申请日：2024-05-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoin Lee ,  Kiseok Lee

IPC: H01L29/423 ,  H01L29/40

Abstract: A semiconductor device includes lower electrodes, a first supporter structure including first supporter patterns interconnecting the lower electrodes, wherein side surfaces of the first supporter patterns and side surfaces of the lower electrodes that are exposed by the first supporter patterns at least partially define a first open region, the first supporter patterns being spaced apart from one another, the first open region extending among the first supporter patterns in a horizontal direction, a dielectric layer covering the first supporter structure and the lower electrodes, and an upper electrode on the dielectric layer. A distance between adjacent ones of the first supporter patterns is smaller than or equal to a pitch of the lower electrodes.

公开(公告)号：US12300629B2

公开(公告)日：2025-05-13

申请号：US18204505

申请日：2023-06-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngwoo Park

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/528 ,  H01L23/538 ,  H01L25/18

Abstract: A semiconductor package is disclosed. The semiconductor package may include a substrate, a first semiconductor chip on the substrate, an inner mold layer provided on the substrate to at least partially enclose the first semiconductor chip, an inner shielding layer provided on the substrate to at least partially enclose the inner mold layer, a second semiconductor chip stack on the inner shielding layer, an outer mold layer provided on the substrate to at least partially enclose the inner shielding layer and the second semiconductor chip stack, and an outer shielding layer at least partially enclosing the outer mold layer. Each of the inner and outer shielding layers may include a conductive material, and the inner shielding layer may be electrically connected to a ground pad of the substrate.

公开(公告)号：US12300589B2

公开(公告)日：2025-05-13

申请号：US17405603

申请日：2021-08-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gwangjae Jeon ,  Jung-Ho Park ,  Seokhyun Lee ,  Yaejung Yoon

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package comprises a first redistribution substrate and a first semiconductor device on the first redistribution substrate. The first redistribution substrate includes a first dielectric layer that includes a first hole, an under-bump that includes a first bump part in the first hole and a second bump part that protrudes from the first bump part onto the first dielectric layer, an external connection terminal on a bottom surface of the first dielectric layer and connected to the under-bump through the first hole, a wetting layer between the external connection terminal and the under-bump, and a first barrier/seed layer between the under-bump and the first dielectric layer and between the under-bump and the wetting layer.

公开(公告)号：US12300302B2

公开(公告)日：2025-05-13

申请号：US18581018

申请日：2024-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hee-Woong Kang ,  Dong-Hun Kwak ,  Jun-Ho Seo ,  Hee-Won Lee

IPC: G11C16/34 ,  G11C7/10 ,  G11C7/12 ,  G11C8/12 ,  G11C11/4074 ,  G11C11/408 ,  G11C11/4097 ,  G11C11/56 ,  G11C16/04 ,  G11C16/06 ,  G11C16/08 ,  G11C16/10 ,  G11C16/30

Abstract: A nonvolatile memory device includes a memory cell array and a row decoder. The memory cell array includes a plurality of mats. A first cell string of first mat is connected to a plurality of first word-lines, a first bit-line and a first string selection line. A second cell string of second mat is connected to a plurality of second word-lines, a second bit-line and a second string selection line. Each of the first and second cell strings includes a ground selection transistor, memory cells, and a string selection transistor coupled in series. The row decoder applies a first voltage to a third word-line among the plurality of first and second word-lines for a first period of time in a single mat mode and to apply a second voltage to the third word-line for a second period of time longer than the first period of time in a multi-mat mode.

公开(公告)号：US12300039B2

公开(公告)日：2025-05-13

申请号：US18141777

申请日：2023-05-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mijung Park ,  Hyeonho Kim ,  Soyoung Park ,  Jinwook Kang ,  Yangsoo Lee ,  Hyemi Lee ,  Kangwook Her

IPC: G06V40/60 ,  G06V40/12 ,  G06V40/13 ,  G06V40/50

Abstract: Provided is an electronic device. The electronic device may include a display, a fingerprint sensor provided in an area of the display, and at least one processor. The at least one processor may receive a user input for fingerprint registration, based on the user input, control the display to display a first user interface displaying information to guide a position for a touch input based on a position of the fingerprint sensor at a first position on the display, and based on receiving a first touch on the first user interface, control the display to display a second user interface indicating a degree of a fingerprint recognition related to the first touch.

公开(公告)号：US12300025B2

公开(公告)日：2025-05-13

申请号：US18419874

申请日：2024-01-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungju Han ,  Minsu Ko ,  Deoksang Kim ,  Jae-Joon Han

IPC: G06V40/16

Abstract: A facial verification method and apparatus is disclosed. The facial verification method includes detecting a face region in an input image, determining whether the detected face region represents a partial face, in response to a determination that the detected face region represents the partial face, generating a synthesized image by combining image information of the detected face region and reference image information, performing a verification operation with respect to the synthesized image and predetermined first registration information, and indicating whether facial verification of the input image is successful based on a result of the performed verification operation.