INTEGRATED CIRCUIT DEVICE
    1.
    发明申请

    公开(公告)号:US20250126778A1

    公开(公告)日:2025-04-17

    申请号:US18768579

    申请日:2024-07-10

    Abstract: An integrated circuit device and a method of manufacturing the same are provided. The integrated circuit device includes: a substrate having a plurality of active regions; a bit line extending on the substrate in a horizontal direction parallel to an upper surface of the substrate; a direct contact electrically connected to a first active region of the plurality of active regions and connected to the bit line; a contact plug electrically connected to a second active region of the plurality of active regions adjacent to the first active region; and an outer insulation spacer between the bit line and the contact plug and overlapping the bit line in a vertical direction perpendicular to the upper surface of the substrate. The outer insulation spacer includes a doped region doped with a metal element.

    Electronic device
    2.
    外观设计

    公开(公告)号:USD1043602S1

    公开(公告)日:2024-09-24

    申请号:US29863212

    申请日:2022-12-16

    Abstract: FIG. 1 is a front perspective view of an electronic device showing our new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is a right side view thereof;
    FIG. 6 is a top plan view thereof; and,
    FIG. 7 is a bottom plan view thereof.
    The dashed broken lines in the figures depict portions of the electronic device that form no part of the claimed design.

    Semiconductor devices
    5.
    发明授权

    公开(公告)号:US11882687B2

    公开(公告)日:2024-01-23

    申请号:US17368053

    申请日:2021-07-06

    CPC classification number: H10B12/315

    Abstract: A semiconductor device includes an active pattern on a substrate, a gate structure buried at an upper portion of the active pattern, a bit line structure on the active pattern, a spacer structure on a sidewall of the bit line structure, a contact plug structure contacting the spacer structure, an insulating interlayer structure partially penetrating through upper portions of the contact plug structure, the spacer structure and the bit line structure, and a capacitor on the contact plug structure. The spacer structure includes an air spacer including air. The insulating interlayer structure includes first and second insulating interlayers. The second insulating interlayer may include an insulation material different from that of the first insulating interlayer. A lower surface of the second insulating interlayer covers a top of the air spacer, and a lowermost surface of the first insulating interlayer is covered by the second insulating interlayer.

    Stylus pen case
    7.
    外观设计

    公开(公告)号:USD1002624S1

    公开(公告)日:2023-10-24

    申请号:US29816192

    申请日:2021-11-19

    Abstract: FIG. 1 is a perspective view of a stylus pen case showing our new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is a right side view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof; and,
    FIG. 8 is a bottom perspective view thereof.
    The unshaded inside surfaces of the stylus pen case, shown through the opening in FIGS. 1, 2, 6, and 8 and the broken line, form no part of the claimed design.
    The dashed broken lines in the figures depict portions of the stylus pen case that form no part of the claimed design.

    Cover for foldable electronic device including pen holder

    公开(公告)号:US12301273B2

    公开(公告)日:2025-05-13

    申请号:US17882008

    申请日:2022-08-05

    Abstract: Disclosed is a cover for a foldable electronic device. The cover includes: a first cover portion configured to be coupled to a first housing of the electronic device, a second cover portion configured to be coupled to a second housing of the electronic device, a connecting portion provided between the first cover portion and the second cover portion and extending in a first direction, the connecting portion being configured such that the first cover portion and the second cover portion are folded to be superimposed on each other or are unfolded, and a pen holder configured to at least partially accommodate a pen and mounted on the connecting portion to be detachable.

    Semiconductor device including storage node electrode including step and method of manufacturing the semiconductor device

    公开(公告)号:US11322499B2

    公开(公告)日:2022-05-03

    申请号:US16943019

    申请日:2020-07-30

    Abstract: A semiconductor device may include a bottom sub-electrode on a substrate, a top sub-electrode on the bottom sub-electrode, a dielectric layer covering the bottom and top sub-electrodes, and a plate electrode on the dielectric layer. The top sub-electrode may include a step extending from a side surface thereof, which is adjacent to the bottom sub-electrode, to an inner portion of the top sub-electrode. The top sub-electrode may include a lower portion at a level that is lower than the step and an upper portion at a level which is higher than the step. A maximum width of the lower portion may be narrower than a minimum width of the upper portion. The maximum width of the lower portion may be narrower than a width of a top end of the bottom sub-electrode. The bottom sub-electrode may include a recess in a region adjacent to the top sub-electrode.

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