公开(公告)号：US20030161959A1

公开(公告)日：2003-08-28

申请号：US10286363

申请日：2002-11-01

发明人： Toivo T. Kodas ,  Mark J. Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron D. Stump ,  Allen B. Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B05D005/12 ,  B05D003/02

CPC分类号： H05K1/167 ,  B33Y10/00 ,  B33Y80/00 ,  C09D11/30 ,  H01C17/06506 ,  H01C17/06533 ,  H01C17/06573 ,  H01L21/288 ,  H01L21/31691 ,  H05K1/0346 ,  H05K1/097 ,  H05K1/162 ,  H05K3/105 ,  H05K3/125 ,  H05K2203/013 ,  H05K2203/1142 ,  H05K2203/121 ,  H05K2203/125

摘要： Precursor compositions for the fabrication of electronic features such as resistors and capacitors. The precursor compositions are formulated to have a low conversion temperature, such as not greater than about 350null C., thereby enabling the fabrication of such electronic features on a variety of substrates, including organic substrates such as polymer substrates.

摘要翻译： 用于制造诸如电阻器和电容器的电子特征的前体组合物。 将前体组合物配制成具有低转化温度，例如不大于约350℃，从而使得能够在各种基材上制造这样的电子特征，包括有机基底如聚合物基底。

公开(公告)号：US20030108664A1

公开(公告)日：2003-06-12

申请号：US10265295

申请日：2002-10-04

发明人： Toivo T. Kodas ,  Mark J. Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron D. Stump ,  Allen B. Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B05D005/12 ,  B05D003/12

CPC分类号： C09D11/30 ,  C23C18/08 ,  H01B1/026 ,  H01C17/06506 ,  H01C17/06533 ,  H01C17/06573 ,  H01L21/02205 ,  H01L21/288 ,  H01L21/31691 ,  H05K1/0346 ,  H05K1/097 ,  H05K1/162 ,  H05K3/105 ,  H05K3/107 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2201/09036 ,  H05K2203/013 ,  H05K2203/1142 ,  H05K2203/121 ,  H05K2203/125

摘要： Precursor compositions having a low conversion temperature and methods for the fabrication of recessed electrical features from the precursor compositions. The electrical features can be conductors, resistors and dielectric features. The precursor compositions are deposited into recessed features, such as trenches, formed in a substrate and are reacted at a low temperature to form electrical features having good electrical and mechanical properties. The substrate can be a low temperature substrate, such as an organic substrate.

摘要翻译： 具有低转化温度的前体组合物和用于从前体组合物制造凹陷电特征的方法。 电气特征可以是导体，电阻和电介质特征。 将前体组合物沉积到形成在基底中的凹陷特征，例如沟槽，并在低温下反应以形成具有良好电学和机械性能的电特征。 衬底可以是低温衬底，例如有机衬底。

公开(公告)号：US5856068A

公开(公告)日：1999-01-05

申请号：US850791

申请日：1997-05-02

申请人： Yaroslaw Antin Magera ,  Everett Furber Simons

发明人： Yaroslaw Antin Magera ,  Everett Furber Simons

IPC分类号： H05K3/00 ,  H05K3/18 ,  H05K3/46 ,  G03F7/26

CPC分类号： H05K3/184 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2203/074 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/125 ,  H05K3/0023

摘要： A process for fabricating a multilayer printed circuit board, in which interlayer adhesion of the layers is greatly enhanced by curing under superatmospheric pressure. The method generally includes depositing a first resin layer (12) onto a substrate (10), which is then patterned so as to cross-link a preselected portion of the resin layer (12). A second resin layer (18) is then deposited over the first resin layer (12), and then patterned to cross-link a portion thereof. Openings in the first and second resins are developed by removing those portions of the resins that were not cross-linked during patterning. Openings (26) in the second resin layer (18) provide access to the first resin layer (12) by subsequent chemical processes. The portions of the first (12) and second (18) resin layers cross-linked during patterning remain on the substrate (10) to form permanent dielectric layers. The first resin layer (12) preferably includes a filler catalytic to plating, thereby enabling direct plating of the first resin layer (12) to form metal features within the multilayer structure. The process yields a multilayer printed circuit board that exhibits increased interlayer adhesion subsequent to plating caused by curing the first and second resin under superatmospheric pressure.

摘要翻译： 一种制造多层印刷电路板的方法，其中通过在超大气压下固化来大大提高层的层间粘合。 该方法通常包括将第一树脂层（12）沉积到衬底（10）上，然后将其图案化以交联树脂层（12）的预选部分。 然后在第一树脂层（12）上沉积第二树脂层（18），然后将其图案化以交叉其一部分。 第一和第二树脂中的开口通过去除在图案化期间未交联的那些部分树脂来开发。 第二树脂层（18）中的开口（26）通过后续的化学处理提供对第一树脂层（12）的通路。 在图案化期间交联的第一（12）和第二（18）树脂层的部分保留在基板（10）上以形成永久电介质层。 第一树脂层（12）优选包括催化镀层的填料，从而能够直接电镀第一树脂层（12）以在多层结构内形成金属特征。 该方法产生多层印刷电路板，其在超大气压下通过固化第一和第二树脂而在电镀之后表现出增加的层间粘附。

公开(公告)号：US5218034A

公开(公告)日：1993-06-08

申请号：US746682

申请日：1991-08-21

申请人： Stuart N. Milligan ,  Yia-Ching Ray

发明人： Stuart N. Milligan ,  Yia-Ching Ray

IPC分类号： C08G73/10 ,  C08J5/18 ,  C08K3/16 ,  C08K3/24 ,  C08K5/09 ,  C08K5/098 ,  C08L79/08 ,  C09J179/08 ,  H05K1/03

CPC分类号： C08J5/18 ,  C08G73/1067 ,  C08G73/1071 ,  C08K3/16 ,  C08K5/098 ,  C09J179/08 ,  H05K1/0373 ,  C08J2379/08 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2203/125

摘要： A polyimide film having improved adhesion and thermal durability containing from 0.02 to 1% by weight of tin based on the weight of the film. A process for preparing a polyimide film is also described wherein a tin (II) or tin (IV) salt is introduced into a film-forming polyamide acid polymer prior to the casting step.

公开(公告)号：US5145715A

公开(公告)日：1992-09-08

申请号：US569288

申请日：1990-08-17

申请人： Takahiro Asano ,  Shinichi Mizuguchi

发明人： Takahiro Asano ,  Shinichi Mizuguchi

IPC分类号： H05K3/18 ,  C09D11/02 ,  C09D11/03 ,  C23C18/18 ,  C23C20/04 ,  H01L21/48 ,  H01L23/498 ,  H05K3/10

CPC分类号： H01L23/49883 ,  H01L21/481 ,  H01L21/4867 ,  H05K3/105 ,  H01L2924/0002 ,  H05K2203/056 ,  H05K2203/1157 ,  H05K2203/125

摘要： Light transmission paste and a metallic copper deposition method of the present invention can educe metallic copper in the desired portion by applying or contacting light transmission paste on cuprous oxide and applying light upon the desired portion. Also, the light is applied through a mask corresponding to the pattern to be obtained, so that desired circuit pattern may be easily obtained. Further, metallic copper of high density may be educed by the contacting or applying metal deposition paste upon metal of a substrate.

公开(公告)号：US3914517A

公开(公告)日：1975-10-21

申请号：US42637873

申请日：1973-12-19

申请人： OWENS ILLINOIS INC

发明人： PIROOZ PERRY P

IPC分类号： C03C10/00 ,  C03C17/06 ,  C03C23/00 ,  H05K1/03 ,  H05K3/10 ,  H05K3/42 ,  C03B32/00 ,  B44D1/02 ,  C03C17/00

CPC分类号： H05K3/105 ,  C03C10/0045 ,  C03C17/06 ,  C03C23/00 ,  C03C2217/251 ,  H05K1/0306 ,  H05K3/426 ,  H05K2203/1105 ,  H05K2203/125 ,  Y10T428/31678

摘要： Provided are three distinct crystallizable copper-bearing alumina-silicate glass compositions. When heat treated during or subsequent to crystallization in an oxidizing atmosphere a copper oxide layer is formed upon the surface of the glass. Subsequent reduction of this layer to a metallic copper results in a strongly adherent film of copper upon a glass-ceramic substrate which may be further processed for use in microelectronic devices and printed circuit boards. The compositions, either crystallized or in vitreous state, are easily drilled using ultrasonic techniques. When such holes are formed prior to heat treatment, subsequent oxidation and reduction results in the copper film extending through the holes, thus providing a conductive lead from one side of the ceramic substrate to the other.

摘要翻译： 提供三种不同的可结晶含铜的硅酸铝玻璃组合物。 当在氧化气氛中结晶期间或之后进行热处理时，在玻璃表面上形成氧化铜层。 随后将该层还原成金属铜导致在玻璃陶瓷衬底上的强烈粘附的铜膜，其可进一步处理用于微电子器件和印刷电路板。 结晶或玻璃状态的组合物可以使用超声波技术容易地钻孔。 当在热处理之前形成这样的孔时，随后的氧化和还原导致铜膜延伸穿过孔，从而从陶瓷衬底的一侧向另一侧提供导电引线。

公开(公告)号：US3900305A

公开(公告)日：1975-08-19

申请号：US35801373

申请日：1973-05-07

申请人： CORNING GLASS WORKS

发明人： DELUCA ROBERT D

IPC分类号： C03C17/09 ,  H01B1/00 ,  H01J9/00 ,  H01J43/24 ,  H05K3/10 ,  C23C13/04

CPC分类号： H05K3/105 ,  C03C17/09 ,  H01B1/00 ,  H01J9/00 ,  H01J43/24 ,  H05K2203/1105 ,  H05K2203/125

摘要： Disclosed is a method of forming a conductive layer on an oxidecontaining ceramic substrate. The substrate is disposed in an essentially oxygen-free atmosphere and is heated to a temperature greater than 300*C. but less than the softening or deforming point of the substrate. The surface of the heated substrate is subjected to magnesium vapor, and the resultant reaction reduces the substrate surface and forms a conductive cermet layer thereon. This method can be used to form conductive layers and paths in such devices as resistors, channel amplifier arrays, multilead arrays, cathode ray tubes, and the like.

公开(公告)号：US3697319A

公开(公告)日：1972-10-10

申请号：US3697319D

申请日：1970-12-09

申请人： RCA CORP

发明人： FELDSTEIN NATHAN

IPC分类号： H01L49/02 ,  H05K3/18 ,  H05K3/38 ,  B41M3/08 ,  B44D1/14

CPC分类号： H05K3/387 ,  H01L49/02 ,  H05K3/181 ,  H05K2201/0116 ,  H05K2203/0709 ,  H05K2203/1105 ,  H05K2203/121 ,  H05K2203/125

摘要： A LAYER OF A RESINOUS ADHESIVE HAVING A METAL FORMATE SALT DISPERSED THERIN IS APPLIED TO THE INSULATING SURFACE. THE LAYER IS THEN HEATED TO DECOMPOSE THE METAL FORMATE SALT AND TO PRODUCE DECOMPOSITION PRODUCTS OF THE METAL OF THE SALT AND GASES, WHICH FORM MICROPORES IN THE LAYER AT THE SURFACE. THE SURFACE OF THE LAYER IS THEN ELECTROLESSLY PLATED WITH A METAL FOR WHICH THE METAL OF THE FORMATE SALT IS A CATALYST.

公开(公告)号：US3523039A

公开(公告)日：1970-08-04

申请号：US3523039D

申请日：1968-07-29

申请人： TEXAS INSTRUMENTS INC

发明人： RAMSEY THOMAS H JR

IPC分类号： C23C18/16 ,  C23C18/18 ,  G03C1/705 ,  H01L21/60 ,  H01L49/02 ,  H05K3/10 ,  H05K1/16

CPC分类号： H05K3/105 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1868 ,  G03C1/705 ,  H01L24/81 ,  H01L49/02 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K2203/092 ,  H05K2203/1105 ,  H05K2203/125 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T428/24942 ,  H01L2924/00

公开(公告)号：US09891777B2

公开(公告)日：2018-02-13

申请号：US14883339

申请日：2015-10-14

申请人： FUJIFILM Corporation

发明人： Akira Ichiki

IPC分类号： G06F3/047 ,  G06F3/044 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/10

CPC分类号： G06F3/047 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K1/115 ,  H05K3/106 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4053 ,  H05K2201/09563 ,  H05K2201/09681 ,  H05K2203/125

摘要： An object of the invention is to provide a method for more easily manufacturing a touch-panel conductive sheet in which end portions of lead-out wires are collected on one surface side of a substrate with high productivity, and a touch-panel conductive sheet. The method for manufacturing a touch-panel conductive sheet of the invention includes: forming, on a rear surface of a substrate, first detection electrodes and rear surface-side wires of which one ends are electrically connected to the first detection electrodes and the other ends have first pad portions, and on a front surface of the substrate, second detection electrodes, second lead-out wires which are electrically connected to the second detection electrodes, and second pad portions which are arranged at positions opposed to the first pad portions via the substrate; forming through holes penetrating the first pad portions, the substrate, and the second pad portions; and producing through wires which electrically connect the first pad portions and the second pad portions by filling the through holes with a conductive material to form first lead-out wires which include the rear surface-side wires and the through wires and are electrically connected to the first detection electrodes.