Abstract:
This invention provides a multielectron gun which generates a plurality of electron beams having uniform characteristics. A multielectron gun (2) is formed of a plurality of electron guns (2a-2c). The electron gun (2a) has, in addition to an electron source (21a), Wehnelt electrode (22a), and anode electrode (23), a shield electrode (24) between the Wehnelt electrode (22a) and anode electrode (23). The shield electrode reduces field interference among the electron guns.
Abstract:
The invention relates to a method for producing an aperture (10) in a semiconductor material (12) comprising the following steps: Preparing a semiconductor wafer (14), for example, a (100)-oriented silicon wafer having an upper surface (16) and a lower surface (18); producing a cavity (20) with a side wall (22) in the upper surface (16) of the semiconductor wafer (14) by partially etching said upper surface (16), whereby the cavity (20) comprises a closed bottom area (24) which faces the lower surface (18) and which preferably has, in particular, a convex or, in particular, a concave corner or edge or a curvature of this type. After depositing an oxide layer (26) on the semiconductor material (12) at least in the area of the cavity (20) by oxidizing the semiconductor material (12), whereby the oxide layer (26) preferably comprises an inhomogeneity (28) in the bottom area (24), the semiconductor material (14) is selectively etched back on the lower surface (18) of the semiconductor wafer (14) until at least the oxide layer (26) located in the bottom area (24) is exposed. Afterwards, the exposed oxide layer (26) is etched until it is at least severed. In addition, the invention relates to an aperture (10) in a semiconductor material (12) especially produced according to the inventive method, and to different uses of such an aperture (10).
Abstract:
An electron beam lithography apparatus of the present invention prevents the electron beam trajectory from being affected by a leakage magnetic field from a permanent magnet which is used as a sample stage guide/driving mechanism. In this electron beam lithography apparatus, an air bearing guide is used as a sample stage guide mechanism, and the stage posture is held by attracting the stage floating on a surface plate to the surface plate side by the permanent magnet. To avoid the leakage magnetic field from the permanent magnet from affecting the electron beam irradiation position on the sample, the permanent magnet is magnetically shielded by a shield member. In addition, to reduce variations in magnetic field above the sample, which are generated when the shield member moves in a leakage magnetic field from the electron lens, another shield member is arranged under the electron lens.
Abstract:
Charged-particle-beam (CPB) optical systems are disclosed in which external magnetic fields are effectively canceled. Such systems are especially suitable for use in CPB microlithography systems in which extreme isolation from external magnetic fields is required in each of the lens columns of the system. In an embodiment, four magnetic-field sensors are situated downstream of the substrate stage of the CPB microlithography system. The sensors are located in a plane perpendicular to the optical axis and situated equi-angularly relative to each other about the optical axis. Each sensor can be configured as, e.g., a Hall-effect sensor, a magnetic-resistance sensor, or a search coil (the latter for detecting AC magnetic fields). Most desirably, the sensors are incorporated into a single sensor capable of detecting magnetic fields in each of the X, Y, and Z directions. The sensors can be used in conjunction with an active-canceller.
Abstract:
CPB microlithography systems are disclosed that effectively cancel the effects of floating external magnetic fields and that exhibit a high magnetic shielding ratio using small components. An exemplary system includes a search coil situated and configured to detect external magnetic field, and a compensation coil situated and configured to produce a magnetic field that, based on the detected magnetic field, cancels the external magnetic field. These coils desirably are situated downstream of an illumination lens. The external magnetic field detected by the search coil is converted to a corresponding electrical signal by an external-magnetic-field-detection circuit and routed to an external-magnetic-field-compensation circuit to which the compensation coil is connected. The external-magnetic-field-compensation circuit cancels the external magnetic field by providing an electrical current, corresponding to the detected external magnetic field, to the compensation coil. A search coil and compensation coil also can be provided in a similar manner downstream of a second projection lens, and provided with a respective external-magnetic-field-detection circuit and external-magnetic-field-compensation circuit.
Abstract:
To provide a method using compact, simple, lightweight apparatus, for canceling the effects, on a charged particle beam optical system, of magnetic fields external to the system, and of fields formed on the outer skin of a beam tube of the particle beam exposure system. External magnetic fields penetrate through the openings A, B, and C to the optical axis of the charged particle beam exposure system, disrupting the operation of the charged particle beam optical system. In this mode of the invention, as shown in the drawing, the coils 5, 6, and 7 are wound horizontally, on the illumination optical system beam tube 1 and the exposure optical system beam tube 2. Currents flowing in these coils can therefore create magnetic fields parallel to the optical axis such as to cancel external magnetic fields in that direction.. Each of the three coils (5, 6, and 7) in FIG. 3 are driven by separate power supplies capable of adjusting the individual coil currents as required to minimize the effects of flux leakage on the beam.
Abstract:
A particle beam lithography method for imaging a structure pattern onto one or more fields on a substrate (11) by means of electrically charged particles, e.g. ions, in which a particle beam is shaped into a desired beam pattern by means of a mask positioned in the particle beam, converted into a beam pattern by apertures in the mask and projected onto the substrate to form an image of the mask apertures. According to the invention, a plurality of masks is positioned on one mask carrier, thus offering a plurality of aperture patterns which are used for producing structure patterns to be imaged onto respective areas (S) of the substrate. The patterns thus imaged, as a whole, combine together to form e.g. the total pattern of a die-field (D) of the substrate (11). By means of reference marks provided for each mask reference beamlets are produced, projected and measured with respect to their position, and from the measurement, alignment control signals are determined for aligning the position of the imaged pattern with a desired position on the substrate.
Abstract:
Hollow-beam apertures and methods for using same are disclosed, especially for achieving alignment of the beam center with the center of the hollow-beam aperture. The hollow-beam apertures define beam-transmissive portions (e.g., through-holes) that form a hollow beam propagating downstream of the hollow-beam aperture. Also included is a relatively thick region that causes absorption of at least a portion of the incident beam and may also cause localized scattering of the beam. Absorption of charged particles generates an electrical current that can be measured. From such current measurements accompanying controlled displacement of the incident beam, a measurement of the lateral beam-intensity distribution can be obtained. I.e., the current typically is maximal whenever the beam center is aligned with the center of the hollow-beam aperture. Lateral beam adjustment can be achieved using an aligner (deflector assembly).
Abstract:
A plurality of removable shields are disclosed for use with ion source in ion implanters. Specifically, the shields fit over the extraction electrode assembly, the sides of the interior walls and the cold-plate inside an ion source chamber. The shields are easily mountable and dismountable by the maintenance personnel. It is shown that shields can very effectively protect the insides of ion source from contamination by toxic materials emanating from the ionization source. A method is also disclosed for cleaning the shields outside the ion source by means of bead blasting followed by washing by deionized water and rinse with isopropyl alcohol. It is shown that the turn-around-time for preventive maintenance of an ion source in an ion implanter can be shortened by a factor of four.
Abstract:
A plurality of removable shields are disclosed for use with ion source in ion implanters. Specifically, the shields fit over the extraction electrode assembly, the sides of the interior walls and the cold-plate inside an ion source chamber. The shields are easily mountable and dismountable by the maintenance personnel. It is shown that shields can very effectively protect the insides of ion source from contamination by toxic materials emanating from the ionization source. A method is also disclosed for cleaning the shields outside the ion source by means of bead blasting followed by washing by deionized water and rinse with isopropyl alcohol. It is shown that the turn-around-time for preventive maintenance of an ion source in an ion implanter can be shortened by a factor of four.