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1136 条记录 (耗时 0.029 秒)

    Methods and systems for predictive torch height control
    96.
    发明授权
    Methods and systems for predictive torch height control 有权
    预测火炬高度控制的方法和系统

    公开(公告)号：US09539664B2

    公开(公告)日：2017-01-10

    申请号：US12485606

    申请日：2009-06-16

    申请人： Matthew Fagan

    发明人： Matthew Fagan

    IPC分类号： B23K10/00 ,  B23K26/04 ,  B23K26/38

    CPC分类号： B23K10/006 ,  B23K26/046 ,  B23K26/048 ,  B23K26/38

    摘要： A method for controlling a height of a cutting torch, includes loading a workpiece onto a numerical control machine, scanning the workpiece with a scanning device at a plurality of discrete points on an upper surface of the workpiece, measuring an X-, a Y-, and a Z-coordinate for each respective one of the scanned discrete points, where X and Y define a plane substantially parallel to the loaded workpiece and Z represents a distance between the upper surface and the scanning device at a respective discrete point, storing the measured XYZ coordinates from each of the scanned discrete points into a data set, mathematically fitting the stored data set to a smooth surface representative of the upper surface of the loaded workpiece, and cutting the workpiece along a cutting path programmed into the numerical control machine, while controlling the cutting torch height to correspond to the representative smooth surface.

    摘要翻译： 一种用于控制割炬的高度的方法，包括将工件装载到数控机床上，在工件的上表面上的多个离散点处用扫描装置扫描工件，测量X，Y轴， 和每个扫描的离散点中的每一个的Z坐标，其中X和Y限定基本上平行于加载的工件的平面，Z表示在相应离散点处的上表面和扫描装置之间的距离， 将从每个扫描的离散点测量的XYZ坐标转换成数据集，将存储的数据集数学拟合到表示所加载的工件的上表面的平滑表面，以及沿着被编程到数控机床中的切割路径切割工件， 同时控制割炬高度对应于代表性的光滑表面。

    Laser machining system and method for machining three-dimensional objects from a plurality of directions
    97.
    发明授权
    Laser machining system and method for machining three-dimensional objects from a plurality of directions 有权
    激光加工系统和从多个方向加工三维物体的方法

    公开(公告)号：US09511448B2

    公开(公告)日：2016-12-06

    申请号：US14822048

    申请日：2015-08-10

    申请人： Resonetics, LLC

    发明人： Pascal Miller ,  Sergey V. Broude ,  David L. Wall ,  Kenneth Todd McDaniel ,  David S. Holbrook

    IPC分类号： B23K26/03 ,  B23K26/04 ,  B23K26/06 ,  B23K26/00 ,  B23K26/36 ,  G02F1/29

    CPC分类号： B23K26/032 ,  B23K26/042 ,  B23K26/046 ,  B23K26/0648 ,  B23K26/082 ,  B23K26/355 ,  B23K26/361 ,  B23K26/362 ,  B23K2103/50 ,  G02F1/29

    摘要： A laser machining system for machining a work-piece includes a laser scanning head, external optical subsystems, and an image acquisition device. The external optical subsystems correspond to optical channels that include a first optical channel and a second optical channel. The laser scanning head controls an optical path so that a laser beam is directed and focused on the work-piece through the first optical channel and the second optical channel at different times. The first optical channel and the second optical channel correspond to respective specific portions of the work-piece to be machined by the laser beam. The image acquisition device is positioned to view the work-piece through the optical path. The image acquisition device acquires via the first optical channel one or more images of the work-piece to determine a displacement of the work-piece with reference to a best optical focus position of the second optical channel.

    摘要翻译： 用于加工工件的激光加工系统包括激光扫描头，外部光学子系统和图像采集装置。 外部光学子系统对应于包括第一光学通道和第二光学通道的光学通道。 激光扫描头控制光路，使得激光束在不同时间通过第一光通道和第二光通道定向并聚焦在工件上。 第一光通道和第二光通道对应于由激光束加工的工件的各个特定部分。 图像采集装置定位成通过光路观察工件。 图像获取装置经由第一光学通道获取工件的一个或多个图像，以参考第二光学通道的最佳光学焦点位置来确定工件的位移。

    Laser processing machine
    98.
    发明授权
    Laser processing machine 有权
    激光加工机

    公开(公告)号：US09492889B2

    公开(公告)日：2016-11-15

    申请号：US13814227

    申请日：2012-07-26

    申请人： Masami Suzuki ,  Norio Nishi ,  Junichi Matsumoto ,  Nobutaka Yoneyama ,  Satoshi Tokuoka ,  Etsushi Kato

    发明人： Masami Suzuki ,  Norio Nishi ,  Junichi Matsumoto ,  Nobutaka Yoneyama ,  Satoshi Tokuoka ,  Etsushi Kato

    IPC分类号： B23K26/02 ,  B23K26/04 ,  B23K26/067 ,  B23K26/03 ,  B23K26/06 ,  B23K26/08

    CPC分类号： B23K26/04 ,  B23K26/032 ,  B23K26/042 ,  B23K26/0643 ,  B23K26/0665 ,  B23K26/067 ,  B23K26/082 ,  B23K26/0853

    摘要： A processing machine includes mirrors and to reflect a beam L oscillated from a laser oscillator to a predetermined surface on which a workpiece is arranged, optical axis operating mechanisms and to position an optical axis of the beam L at a desired target irradiation position by changing directions of the mirrors and, a camera sensor to capture an image of the target irradiation position and its periphery reflected in the mirror, and an error calibration mechanism to detect an error between the target irradiation position instructed to the optical axis operating mechanisms and an actual position of the optical axis of the beam L in the predetermined surface by referring to the image captured by the camera sensor. A correction amount to the optical axis operating mechanisms and is determined based on the error to irradiate the target irradiation position with the beam L during processing.

    摘要翻译： 加工机器包括反射镜并将从激光振荡器振荡的光束L反射到其上布置工件的预定表面，光轴操作机构，并且通过改变方向将光束L的光轴定位在期望的目标照射位置 以及用于拍摄目标照射位置的图像及其反射镜中的周边的图像的摄像机传感器，以及用于检测指示到光轴操作机构的目标照射位置与实际位置之间的误差的误差校准机构 通过参照由照相机传感器拍摄的图像，在预定表面中的光束L的光轴。 对光轴操作机构的校正量，并且基于在处理期间用光束L照射目标照射位置的误差来确定。

    Method and device for monitoring a laser processing operation to be performed on a workpiece and laser processing head having such a device
    99.
    发明授权
    Method and device for monitoring a laser processing operation to be performed on a workpiece and laser processing head having such a device 有权
    用于监测对具有这种装置的工件和激光加工头执行的激光加工操作的方法和装置

    公开(公告)号：US09492886B2

    公开(公告)日：2016-11-15

    申请号：US13130426

    申请日：2009-11-20

    申请人： Ingo Stork Genannt Wersborg

    发明人： Ingo Stork Genannt Wersborg

    IPC分类号： H05B3/00 ,  B23K26/03 ,  B23K26/02 ,  B23K26/04

    CPC分类号： B23K26/03 ,  B23K26/02 ,  B23K26/04

    摘要： A method for monitoring a laser machining operation to be performed on a workpiece by detecting at least two current measured valued by at least one sensor which monitors the laser machining operation and determining at least two current characteristic values from the at least two current measured value, wherein the at least two current characteristic values jointly represent a current fingerprint in a characteristic value space and providing a predetermined point set in a characteristic value space, and classifying the laser machining operation by\detecting the position of the current fingerprint relative to the predetermined point set in the characteristic value space.

    摘要翻译： 一种用于通过检测由至少一个传感器测量的至少两个电流来监测对工件执行的激光加工操作的方法，所述至少一个传感器监测所述激光加工操作并且根据所述至少两个当前测量值确定至少两个电流特性值， 其中所述至少两个电流特性值联合地表示特征值空间中的当前指纹并且提供在特征值空间中设置的预定点，并且通过\检测当前指纹相对于预定点的位置来分类激光加工操作 设置在特征值空间中。