公开(公告)号：US5840170A

公开(公告)日：1998-11-24

申请号：US982999

申请日：1992-11-30

申请人： Albert E. Nagy

发明人： Albert E. Nagy

IPC分类号： C25D1/04 ,  C25D3/38 ,  C25D21/12 ,  H05K3/24 ,  H05K3/38 ,  C25D5/34

CPC分类号： C25D21/12 ,  C25D3/38 ,  H05K3/384 ,  C25D1/04 ,  H05K2201/0355 ,  H05K2203/0723 ,  H05K3/241 ,  Y10S204/13

摘要： The invention relates to a process for electrolytic treatment of copper foil, comprising the steps of: (A) applying a voltage across an anode and cathode, wherein the anode and cathode are in contact with an electroplating composition containing a gelatin component; (B) removing organic particulate matter by contacting the electroplating solution containing the organic particulate matter with an adsorbent polymer; and (C) electrolytically treating the copper foil. The electroplating composition can additionally contain an active sulfur-containing component, such as thiourea.

摘要翻译： 本发明涉及铜箔的电解处理方法，包括以下步骤：（A）在阳极和阴极之间施加电压，其中阳极和阴极与含有明胶组分的电镀组合物接触; （B）通过使含有有机颗粒物质的电镀溶液与吸附剂聚合物接触来除去有机颗粒物质; 和（C）对铜箔进行电解处理。 电镀组合物可另外含有活性含硫组分如硫脲。

公开(公告)号：US5804052A

公开(公告)日：1998-09-08

申请号：US750314

申请日：1996-11-26

申请人： Reinhard Schneider

发明人： Reinhard Schneider

IPC分类号： C25D5/22 ,  C25D5/00 ,  C25D7/00 ,  C25F3/02 ,  C25F7/00 ,  H01L21/3063 ,  H05K3/07 ,  H05K3/24 ,  C25D5/02

CPC分类号： H05K3/07 ,  C25D21/00 ,  C25D7/0657 ,  C25F3/02 ,  C25F7/00 ,  H05K3/241 ,  Y10S204/07

摘要： The invention relates to a method for continuous uniform electrolytic metallizing or etching of metal surfaces, and to a device suitable for carrying out this method. The invention is particularly suitable for treating printed circuit boards and conductive films in installations through which the metal surface being treated passes horizontally. In order to avoid metal coatings of differing thicknesses being deposited on narrow and wide conductor strips in printed circuit boards, according to the present invention operation is with movable, preferably rotating roller-shaped intermediate electrodes, which roll without short circuit at a very close effective distance above the metal surface being treated, or which contact the surface in a wiping manner. These intermediate electrodes are not electrically connected to the source of bath current, thus serving as bipolar electrodes, and are located between the surface being treated and a suitable counter-electrode.

摘要翻译： PCT No.PCT / DE95 / 00706 Sec。 371日期1996年11月26日 102（e）日期1996年11月26日PCT提交1995年5月26日PCT公布。 WO95 / 33086 PCT出版物 日期1995年12月7日本发明涉及金属表面的连续均匀电解金属化或蚀刻的方法以及适用于实施该方法的装置。 本发明特别适用于处理经过水平处理的金属表面的设备中的印刷电路板和导电膜。 为了避免不同厚度的金属涂层沉积在印刷电路板的狭窄和宽的导体条上，根据本发明，操作是可移动的，优选旋转的辊状中间电极，它们以非常接近的有效的方式滚动而没有短路 在正在处理的金属表面之上的距离，或者以擦拭方式接触表面。 这些中间电极不与电流源电连接，因此用作双极电极，并且位于待处理的表面和合适的对电极之间。

公开(公告)号：US5514258A

公开(公告)日：1996-05-07

申请号：US292417

申请日：1994-08-18

申请人： Oscar J. Brinket ,  Brian C. Brinket

发明人： Oscar J. Brinket ,  Brian C. Brinket

IPC分类号： C25D5/08 ,  H05K3/24 ,  C25D17/00

CPC分类号： C25D5/08 ,  H05K3/241

摘要： The present invention provides an apparatus for electrodepositing metals onto a substrate or the like which creates a uniform laminar flow of the electroplating solution across the surface of the substrate. Specifically, the plating bath according to this invention utilizes an insert plate with a plurality of conical-shaped apertures and a cylindrical tunnel plate to create and maintain a laminar flow of the solution across the surface of the substrate. Additionally, every plate in the invention can be separately and slidably removed to facilitate easy disassembly for cleaning and user customization to achieve the various results and specifications desired by the user.

摘要翻译： 本发明提供了一种用于将金属电沉积到基板等上的装置，其在电镀表面上形成均匀的电镀液层。 具体来说，根据本发明的电镀槽采用具有多个圆锥形孔的插入板和圆柱形隧道板，以产生并保持溶液跨层的表面的层流。 此外，本发明中的每个板可以单独地和可滑动地移除，以便于拆卸清洁和用户定制以实现用户期望的各种结果和规格。

公开(公告)号：US5512154A

公开(公告)日：1996-04-30

申请号：US186907

申请日：1994-01-27

申请人： Jorg W. Rischke ,  Wilhelmus G. L. van Sprang

发明人： Jorg W. Rischke ,  Wilhelmus G. L. van Sprang

IPC分类号： C23F1/04 ,  C25D5/02 ,  C25D7/00 ,  C25D13/12 ,  C25D13/22 ,  C25D17/00 ,  C25D17/08 ,  C25F3/14 ,  H01L23/50 ,  H05K3/00 ,  H05K3/20 ,  H05K3/24

CPC分类号： C25D5/022 ,  H05K3/243 ,  H01L2924/0002 ,  H05K2201/10924 ,  H05K2203/135 ,  H05K3/0091 ,  H05K3/202 ,  H05K3/241

摘要： The invention relates to an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For masking purposes a fully closed photoresist layer is electrophoretically applied to the products, and after drying of the photoresist layer, the products are covered with a photomask in accordance with the locations to be plated, after which exposure takes place. Then the photoresist layer is partially removed, while the remaining part of the photoresist layer remains behind on the products, to serve as a mask for the metal products upon electroplating.

摘要翻译： 本发明涉及一种选择性地电镀有孔产品的装置。 产品根据预期的电镀被掩蔽，随后暴露于电解质以电镀产品。 为了掩蔽目的，将完全闭合的光致抗蚀剂层电泳施加到产品上，并且在光致抗蚀剂层干燥之后，根据要镀覆的位置用光掩模覆盖产品，之后进行曝光。 然后光致抗蚀剂层被部分去除，而光致抗蚀剂层的剩余部分保留在产品的后面，用作电镀时金属产品的掩模。

公开(公告)号：US5467252A

公开(公告)日：1995-11-14

申请号：US136845

申请日：1993-10-18

申请人： Victor Nomi ,  John R. Pastore ,  Twila J. Reeves

发明人： Victor Nomi ,  John R. Pastore ,  Twila J. Reeves

IPC分类号： H01L21/58 ,  H01L23/31 ,  H01L23/498 ,  H05K3/00 ,  H05K3/24 ,  H05K7/02

CPC分类号： H01L24/32 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/83 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/241 ,  Y10T29/49144

摘要： Routing density of a wiring substrate (10) is increased by providing a nested plating bus (18) as a supplement to an external plating bus (16). A first group of conductive traces (14) is connected to the nested plating bus, while another group of traces is connected to the external plating bus. After the conductive elements are plated, the nested plating bus is removed by etching, milling, or stamping techniques. Use of a nested plating bus increases I/O count for a given substrate area and/or reduces the need to have routing on more than one layer of the substrate.

公开(公告)号：US5401370A

公开(公告)日：1995-03-28

申请号：US917022

申请日：1992-10-06

申请人： Rudolf Kauper ,  Gerhard Wilhelm

发明人： Rudolf Kauper ,  Gerhard Wilhelm

IPC分类号： C25D5/02 ,  C25D5/00 ,  C25D17/00 ,  H05K3/24 ,  C25D17/06

CPC分类号： C25D17/00 ,  C25D17/008 ,  C25D17/06 ,  C25D21/00 ,  C25D5/04 ,  H05K3/241 ,  Y10S204/07

摘要： The invention builds on an arrangement for the masking of field lines in an electroplating plant for the treatment of essentially plate-shaped workpieces, which are loaded into the bath suspended from a workpiece holder, wherein a mask is provided which is vertically adjustably guided on the plating tank. To permit the vertical adjustment of the mask regardless of the shape and, in particular, the thickness of the workpiece to be treated, as well as the manner in which the workpiece is held on the workpiece holder, and further, so that said mask(s) can optionally mask the lower or the upper area of the workpiece(s) to be treated, a hold-down clamp (21) is provided, attached to the workpiece holder (6) in such a way as to be height-adjustable and lockable in the particular position, and moves the masks (12, 13; 14, 15) located laterally to the workpieces (5) into a preselected position as the workpiece holder (6) is loaded into the treatment station (1).

摘要翻译： PCT No.PCT / DE91 / 00145 Sec。 371日期：1992年10月6日 102（e）日期1992年10月6日PCT 1991年2月19日PCT PCT。 出版物WO91 / 13190 日本1991年9月5日。本发明基于用于掩蔽电镀设备中的场线的布置，用于处理基本上板状的工件，其被装载到从工件保持器悬挂的浴中，其中提供掩模 其在电镀槽上垂直调节导向。 为了允许掩模的垂直调整，不管形状，特别是待处理的工件的厚度，以及工件在工件保持器上的保持方式如何，并且还使得所述掩模（ s）可以可选地掩蔽要被处理的工件的下部或上部区域，提供压紧夹具（21），其以可调节的高度可调节的方式附接到工件保持器（6） 并且可锁定在特定位置，并且当工件保持器（6）装载到处理台（1）中时，将位于工件（5）的横向的掩模（12,13; 14,15）移动到预定位置。

公开(公告)号：US5281325A

公开(公告)日：1994-01-25

申请号：US907830

申请日：1992-07-02

申请人： N. Edward Berg

发明人： N. Edward Berg

IPC分类号： C25D5/02 ,  H05K3/24 ,  C25D17/00

CPC分类号： H05K3/241 ,  C25D5/022

摘要： A method and apparatus for the uniform electroplating of printed circuit boards is described. At least one non conductive apertured mask covers selected areas of the electroactive surface of the anode or cathode electrode, whereby to establish substantially uniform electroplating ion transfer over the target areas of the target cathode.

摘要翻译： 描述了用于印刷电路板的均匀电镀的方法和装置。 至少一个非导电孔径掩模覆盖阳极或阴极电极的电活性表面的选定区域，从而在目标阴极的目标区域上建立基本均匀的电镀离子转移。

公开(公告)号：US5227046A

公开(公告)日：1993-07-13

申请号：US772513

申请日：1991-10-07

申请人： Timothy I. Murphy ,  Brian R. Reynolds

发明人： Timothy I. Murphy ,  Brian R. Reynolds

IPC分类号： C25D3/60 ,  H05K3/24 ,  H05K3/34

CPC分类号： C25D3/60 ,  H05K3/241 ,  H05K3/3473 ,  Y10S204/13

摘要： A system for electroplating a tin-bismuth alloy at near eutectic composition is disclosed. The system includes the plating bath and the process for initially preparing the bath as well as the process for plating an object with tin-bismuth alloy. The system further includes an apparatus for regulating the concentrations of tin and bismuth in the plating bath and the process by which the concentrations are controlled.

摘要翻译： 公开了一种用于以接近共晶组成电镀锡 - 铋合金的系统。 该系统包括电镀浴和用于初始制备浴的方法以及用锡 - 铋合金电镀物体的方法。 该系统还包括用于调节镀浴中锡和铋浓度的装置以及控制浓度的过程。

公开(公告)号：US5143593A

公开(公告)日：1992-09-01

申请号：US716870

申请日：1991-06-18

申请人： Kenichi Ueno ,  Kazuhiro Hirao ,  Genzo Yamane

发明人： Kenichi Ueno ,  Kazuhiro Hirao ,  Genzo Yamane

IPC分类号： C25D3/38 ,  C25D5/56 ,  C25D17/00 ,  C25D21/14 ,  H05K3/24

CPC分类号： C25D3/38 ,  H05K3/241 ,  Y10S205/92

摘要： A method of copper-plating a material whereby electrolysis is performed using an electrolytic plating cell including a diaphragm which separates an anode chamber having therein an insoluble metal electrode as an anode from a cathode chamber having therein the material to be plated as a cathode, and further using an electrolyte solution containing copper ions and an additive, wherein the electrolyte is fed to the cathode chamber in a manner such that the copper ion concentration in the electrolyte within the cathode chamber is kept constant and electrolyte is further fed to the anode chamber at a rate of from about 0.2 to 11 ml/KAh.

公开(公告)号：US5102521A

公开(公告)日：1992-04-07

申请号：US740509

申请日：1991-08-05

申请人： Hitoshi Usuda ,  Ryoei Yamakawa ,  Kenichi Ueno ,  Kazuhiro Hirao

发明人： Hitoshi Usuda ,  Ryoei Yamakawa ,  Kenichi Ueno ,  Kazuhiro Hirao

IPC分类号： C25D7/00 ,  C25D17/00 ,  C25D17/10 ,  C25D17/12 ,  C25D21/04 ,  H05K3/24

CPC分类号： C25D17/008 ,  C25D17/001 ,  C25D17/002 ,  C25D21/04 ,  H05K3/241

摘要： According to the present invention, an upper electrode and a lower electrode are integrally assembled with insoluble electrodes and diaphragmn in diaphragm electrode structure. Small holes are furnished on the upper electrode, and the diaphragm of the upper electrode is installed obliquely with degassing means. By simply carrying the objects to be plated in horizontal direction, uniform and high quality electroplating can be continuously performed with extensive increase in productivity, while enjoying all of the benefits such as shorter interpolar distance between two electrodes, compact design of the apparatus, saving of expensive additives, etc. Further, the inspection of the diaphragm and the like can be rapidly and easily accomplished, and perfect protection of the diaphragm is assured, thus providing a horizontal carrying type electroplating apparatus suitable for practical use.