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公开(公告)号：US4964964A
公开(公告)日：1990-10-23
申请号：US332047
申请日：1989-04-03
申请人： Timothy I. Murphy
发明人： Timothy I. Murphy
CPC分类号： H05K3/241 , C25D17/00 , C25D17/007 , C25D17/06 , C25D21/12 , Y10S204/07
摘要： An electroplating rack is constructed of corrosion resistant stainless steel, with oppposed side frames milled with vertical channels to accommodate opposite side edge portions of a printed circuit board for plating. Mechanical and electrical connections with the circuit board are made with recessed stainless steel screws with rounded tips. Current is provided to the top of the rack, and also to the bottom of each side frame through an elongate, vertically disposed copper bar surrounded by an insulative sheath and contained within each side frame. Each of the copper rods is threadedly engaged in a steel end cap at the bottom of the associated frame. The current fed into the top and bottom of the rack can be adjusted by adjusting the comparative conductivity of the two paths.
摘要翻译： 电镀架由耐腐蚀不锈钢构成，对置的侧框架用垂直通道铣削，以适应用于电镀的印刷电路板的相对侧边缘部分。 与电路板的机械和电气连接是用带圆形尖端的凹槽不锈钢螺丝制成的。 电流被提供到机架的顶部，并且还通过由绝缘护套包围并包含在每个侧框架内的细长的垂直布置的铜条到每个侧框架的底部。 每个铜棒螺纹地接合在相关框架底部的钢制端盖中。 可以通过调节两条路径的比较电导率来调节进入机架顶部和底部的电流。
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2.发明授权
公开(公告)号：US4933049A
公开(公告)日：1990-06-12
申请号：US331876
申请日：1989-04-03
申请人： Timothy I. Murphy , James M. Fisher
发明人： Timothy I. Murphy , James M. Fisher
摘要： In a system for electroplating a printed circuit board in which multiple spray orifices are provided in arrays on opposite sides of the circuit board, and multiple vacuum orifices are interspersed symmetrically and midway between adjacent spray orifices, a mounting means is provided for rapid and accurate locating of the printed circuit board in two selectively offset alternative positions to facilitate forming an electroplated layer of uniform thickness. The printed circuit board is supported from an elongate copper bar, with two alignment members mounted to opposite ends of the bar. A pair of saddles are fixed with respect to the tank containing the electrolyte. Each of the saddles has two V-shaped mounting surfaces conforming to the alignment members for a nesting engagement. The mounting surfaces of each saddle are offset from one another a predetermined horizontal and vertical distance, whereby alternative nesting engagements of the alignment members and saddles support the circuit borad in alternative positions, respectively aligning particular circuit board surface areas with spray orifices, and then with vacuum orifices.
摘要翻译： 在用于电镀印刷电路板的系统中，其中在电路板的相对侧上以阵列形式提供多个喷射孔，并且多个真空孔在相邻喷嘴之间的对称和中间散布，提供了用于快速和准确定位的安装装置 的印刷电路板的两个选择性偏移的替代位置，以便于形成均匀厚度的电镀层。 印刷电路板由细长铜棒支撑，两个对准构件安装在杆的相对端。 一对鞍座相对于容纳电解质的罐固定。 每个鞍座具有两个V形安装表面，这些安装表面符合对准构件以进行嵌套接合。 每个鞍座的安装表面彼此偏移预定的水平和垂直距离，由此对准构件和鞍座的替代嵌套接合将替代位置支撑电路板，分别将特定电路板表面区域与喷孔对准，然后与 真空孔。
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公开(公告)号：US5308464A
公开(公告)日：1994-05-03
申请号：US21397
申请日：1993-02-23
CPC分类号： C25D3/60 , H05K3/241 , H05K3/3473 , Y10S204/13
摘要： A system for electroplating a tin-bismuth alloy at near eutectic composition is disclosed. The system includes the plating bath and the process for initially preparing the bath as well as the process for plating an object with tin-bismuth alloy. The system further includes an apparatus for regulating the concentrations of tin and bismuth in the plating bath and the process by which the concentrations are controlled.
摘要翻译： 公开了一种用于以接近共晶组成电镀锡 - 铋合金的系统。 该系统包括电镀浴和用于初始制备浴的方法以及用锡 - 铋合金电镀物体的方法。 该系统还包括用于调节镀浴中锡和铋浓度的装置以及控制浓度的过程。
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公开(公告)号：US5227046A
公开(公告)日：1993-07-13
申请号：US772513
申请日：1991-10-07
CPC分类号： C25D3/60 , H05K3/241 , H05K3/3473 , Y10S204/13
摘要： A system for electroplating a tin-bismuth alloy at near eutectic composition is disclosed. The system includes the plating bath and the process for initially preparing the bath as well as the process for plating an object with tin-bismuth alloy. The system further includes an apparatus for regulating the concentrations of tin and bismuth in the plating bath and the process by which the concentrations are controlled.
摘要翻译： 公开了一种用于以接近共晶组成电镀锡 - 铋合金的系统。 该系统包括电镀浴和用于初始制备浴的方法以及用锡 - 铋合金电镀物体的方法。 该系统还包括用于调节镀浴中锡和铋浓度的装置以及控制浓度的过程。
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