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    Process for fabricating printed circuit boards
    2.
    发明授权
    Process for fabricating printed circuit boards 失效
    印刷电路板制造工艺

    公开(公告)号：US5384230A

    公开(公告)日：1995-01-24

    申请号：US845266

    申请日：1992-03-02

    Applicant: N. Edward Berg

    Inventor： N. Edward Berg

    IPC: G03F7/095 ,  H05K3/00 ,  G03F7/00

    CPC classification number: H05K3/0082 ,  G03F7/0952 ,  H05K2203/0505 ,  H05K2203/0551

    Abstract: A process for forming interconnection lines on a printed circuit board is described. The surface of a circuit board substrate is covered with a photoresist layer, and the photoresist layer in turn is covered with a halide emulsion layer. The emulsion layer is then exposed to a predetermined pattern of white light, and the image developed. The board is then exposed to UV light through the imaged emulsion layer which acts as a pattern masking selected portions of the photoresist mask. The emulsion layer is then stripped and the photoresist processed in conventional manner.

    Abstract translation: 描述了在印刷电路板上形成布线的工艺。 电路板基板的表面被光致抗蚀剂层覆盖，光致抗蚀剂层依次被卤化物乳剂层覆盖。 然后将乳剂层暴露于预定的白光图案，并且图像显影。 然后将该板通过成像的乳剂层暴露于UV光，该乳剂层用作掩模光刻胶掩模的所选部分的图案。 然后剥离乳剂层，并以常规方式处理光致抗蚀剂。

    Method of forming through-holes in printed wiring board substrates
    4.
    发明授权
    Method of forming through-holes in printed wiring board substrates 失效
    在印刷线路板基板上形成通孔的方法

    公开(公告)号：US5653893A

    公开(公告)日：1997-08-05

    申请号：US493965

    申请日：1995-06-23

    Applicant: N. Edward Berg

    Inventor： N. Edward Berg

    IPC: H05K1/03 ,  H05K3/00

    CPC classification number: H05K3/002 ,  H05K1/0366 ,  H05K2203/0554 ,  H05K2203/0783 ,  H05K2203/081 ,  H05K2203/107 ,  H05K3/0055

    Abstract: Through-holes are formed in a printed circuit board substrate by chemical etching a metal foil clad circuit board having open positions in the metal foil where a hole is to be formed using N-methyl-2-pyrrolidone, a mixture of methylene chloride and HF, or a mixture of methylene chloride, HF and xylene.

    Abstract translation: 通过化学蚀刻在金属箔中具有开口位置的金属箔包覆电路板，在印刷电路板基板上形成通孔，使用N-甲基-2-吡咯烷酮，二氯甲烷和HF的混合物形成空穴 ，或二氯甲烷，HF和二甲苯的混合物。

    Process for manufacturing printed circuit boards
    5.
    发明授权
    Process for manufacturing printed circuit boards 失效
    印刷电路板制造工艺

    公开(公告)号：US06709962B2

    公开(公告)日：2004-03-23

    申请号：US10183574

    申请日：2002-06-27

    Applicant: N. Edward Berg

    Inventor： N. Edward Berg

    IPC: H01L2144

    CPC classification number: H05K3/061 ,  H05K1/0266 ,  H05K3/0079 ,  H05K3/108 ,  H05K3/1275 ,  H05K2203/0113 ,  H05K2203/013 ,  H05K2203/0517 ,  H05K2203/0534 ,  H05K2203/0783 ,  H05K2203/105 ,  H05K2203/1173 ,  H05K2203/1545 ,  H05K2203/1572 ,  H05K2203/163

    Abstract: A method for producing printed circuits utilizing direct printing methods to apply a pattern mask to a substrate. The direct printing methods include correcting positional errors in a printing apparatus by ascertaining the errors in the printer through comparison of a printed pattern and a known standard pattern. Printer inputs are manipulated to compensate for the ascertained errors of the printer. The pattern mask applied by the corrected printer may be an etch resist mask for forming conductive pathways by an etching process, or the pattern mask may be a plating mask with conductive pathways being formed by a plating operation. The process of the present invention is applicable to forming both single-sided and double-sided printed circuit boards.

    Abstract translation: 一种使用直接印刷方法制造印刷电路的方法，用于将图案掩模施加到基板上。 直接打印方法包括通过比较打印图案和已知标准图案来确定打印机中的错误来校正打印装置中的位置错误。 操作打印机输入以补偿确定的打印机错误。 由校正的打印机施加的图案掩模可以是用于通过蚀刻工艺形成导电路径的抗蚀剂掩模，或者图案掩模可以是具有通过电镀操作形成的导电路径的电镀掩模。 本发明的方法可用于形成单面和双面印刷电路板。

    Circuit board substrate for use in fabricating a circuit board on which is formed a light sensitive emulsion layer covering and in direct contact with photoresist
    7.
    发明授权
    Circuit board substrate for use in fabricating a circuit board on which is formed a light sensitive emulsion layer covering and in direct contact with photoresist 失效
    用于制造电路板的电路板基板，其上形成覆盖并与光刻胶直接接触的感光乳剂层

    公开(公告)号：US6004734A

    公开(公告)日：1999-12-21

    申请号：US376740

    申请日：1995-01-23

    Applicant: N. Edward Berg

    Inventor： N. Edward Berg

    IPC: G03F7/095 ,  H05K3/00 ,  G03C1/46

    CPC classification number: H05K3/0082 ,  G03F7/0952 ,  H05K2203/0505 ,  H05K2203/0551

    Abstract: A process for forming interconnection lines on a printed circuit board is described. The surface of a circuit board substrate is covered with a photoresist layer, and the photoresist layer in turn is covered with a halide emulsion layer. The emulsion layer is then exposed to a predetermined pattern of white light, and the image developed. The board is then exposed to UV light through the imaged emulsion layer which acts as a pattern masking selected portions of the photoresist mask. The emulsion layer is then stripped and the photoresist processed in conventional manner.

    Abstract translation: 描述了在印刷电路板上形成布线的工艺。 电路板基板的表面被光致抗蚀剂层覆盖，光致抗蚀剂层依次被卤化物乳剂层覆盖。 然后将乳剂层暴露于预定的白光图案，并且图像显影。 然后将该板通过成像的乳剂层暴露于UV光，该乳剂层用作掩模光刻胶掩模的所选部分的图案。 然后剥离乳剂层，并以常规方式处理光致抗蚀剂。

    Uniform electroplating of printed circuit boards
    8.
    发明授权
    Uniform electroplating of printed circuit boards 失效
    印刷电路板均匀电镀

    公开(公告)号：US5281325A

    公开(公告)日：1994-01-25

    申请号：US907830

    申请日：1992-07-02

    Applicant: N. Edward Berg

    Inventor： N. Edward Berg

    IPC: C25D5/02 ,  H05K3/24 ,  C25D17/00

    CPC classification number: H05K3/241 ,  C25D5/022

    Abstract: A method and apparatus for the uniform electroplating of printed circuit boards is described. At least one non conductive apertured mask covers selected areas of the electroactive surface of the anode or cathode electrode, whereby to establish substantially uniform electroplating ion transfer over the target areas of the target cathode.

    Abstract translation: 描述了用于印刷电路板的均匀电镀的方法和装置。 至少一个非导电孔径掩模覆盖阳极或阴极电极的电活性表面的选定区域，从而在目标阴极的目标区域上建立基本均匀的电镀离子转移。

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