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91.发明申请公开(公告)号：US20100266240A1
公开(公告)日：2010-10-21
申请号：US11962419
申请日：2007-12-21
CPC分类号： G02B6/43 , G02B6/12009 , H01L23/48 , H01L25/0652 , H01L25/0657 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2924/0002 , H01L2924/14 , H01L2924/1433 , H01L2924/00
摘要： Embodiments of a system are described. This system includes an array of chip modules (CMs) and a baseplate, where the baseplate is configured to communicate data signals via optical communication. Moreover, the array includes first CMs mechanically coupled to first alignment features on the baseplate, and adjacent second CMs mechanically coupled to second alignment features on the baseplate. In this array, a given first CM is electrically coupled to a given set of electrical proximity connectors. Additionally, the array includes bridge components, wherein a given bridge component is electrically coupled to the second SCM and another set of electrical proximity connectors, which is electrically coupled to the set of electrical proximity connectors, thereby facilitating communication of other data signals between adjacent first CMs and second CMs via electrical proximity communication. Moreover, the given bridge component is optically coupled to the baseplate, thereby facilitating optical communication of the data signals between CMs via the baseplate.
摘要翻译： 描述系统的实施例。 该系统包括芯片模块（CM）和基板阵列，其中基板配置为通过光通信传送数据信号。 此外，阵列包括机械耦合到基板上的第一对准特征的第一CM，以及与基板上的第二对准特征机械耦合的相邻的第二CM。 在该阵列中，给定的第一CM电耦合到给定的一组电接近连接器。 另外，阵列包括桥组件，其中给定的桥组件电耦合到第二SCM和另一组电接近连接器，其被电耦合到该组电接近连接器，由此有助于在相邻的第一SCM之间的其它数据信号的通信 CM和第二CM通过电气接近通信。 而且，给定的桥式组件光耦合到基板，从而有助于通过基板在CM之间的数据信号的光通信。
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公开(公告)号：US07747173B1
公开(公告)日：2010-06-29
申请号：US11728841
申请日：2007-03-26
IPC分类号： H04B10/00
CPC分类号： H04B10/801
摘要： Embodiments of an integrated circuit are described. This integrated circuit includes a clock-generator circuit configured to provide a clock signal and an optical clock path coupled to the clock-generator circuit. Note that the optical clock path is configured to distribute optical signals corresponding to the clock signal. Furthermore, note that a given optical signal has a phase which is different than phases of the other optical signals.
摘要翻译： 描述集成电路的实施例。 该集成电路包括时钟发生器电路，其被配置为提供时钟信号和耦合到时钟发生器电路的光时钟通路。 注意，光时钟路径被配置为分配对应于时钟信号的光信号。 此外，注意，给定的光信号具有与其它光信号的相位不同的相位。
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公开(公告)号：US07539418B1
公开(公告)日：2009-05-26
申请号：US11228917
申请日：2005-09-16
CPC分类号： H04J14/02 , G02F1/011 , G02F2201/16 , G02F2203/05 , G02F2203/15
摘要： A system that facilitates optical multiplexing and demultiplexing. The system includes an optical transmitter which is structured in the following way. A wavelength-splitting mechanism is coupled to the optical transmitter, which separates the wavelengths of light onto an array of input-optical-waveguide busses within the optical transmitter. An array of ring modulators within the optical transmitter is coupled to each optical-waveguide bus, wherein the input-end of a given ring modulator is coupled to a corresponding input-optical-waveguide bus. Output-optical-waveguide busses within the optical transmitter are coupled to the array of ring modulators, wherein the output-end of each ring modulator is coupled to a corresponding output-optical-waveguide bus. When a modulation signal is applied to a given ring modulator within the array of ring modulators, a specific wavelength of light is directed to the corresponding output-optical-waveguide bus.
摘要翻译： 一种有助于光复用和解复用的系统。 该系统包括以下列方式构造的光发射机。 波长分解机构耦合到光发射器，光发射器将光的波长分离成光发射器内的输入光波导总线的阵列。 光发射机内的环形调制器阵列耦合到每个光波导总线，其中给定环形调制器的输入端耦合到对应的输入光波导总线。 光发射机内的输出光波导总线被耦合到环形调制器阵列，其中每个环形调制器的输出端耦合到对应的输出光波导总线。 当调制信号施加到环形调制器阵列内的给定环形调制器时，特定波长的光被引导到相应的输出光波导总线。
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公开(公告)号：US20090089466A1
公开(公告)日：2009-04-02
申请号：US11864762
申请日：2007-09-28
IPC分类号： G06F13/00
CPC分类号： H01L25/18 , H01L23/48 , H01L24/73 , H01L25/0652 , H01L2224/1403 , H01L2224/16227 , H01L2224/16235 , H01L2224/1703 , H01L2225/06513 , H01L2225/06531 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/00 , H01L2224/48
摘要： A “sombrero” bridge transports signal communication between a processor and one or more cache memories. The bridge surrounds the processor's perimeter, and includes an aperture opposite the processor through which power and data can be provided to the processor from another device. The bridge exchanges signals with the cache memories via capacitively coupled proximity connections. The bridge communicates with the processor via conductive (e.g. wire) connections and optionally proximity connections. Spacing between opposing pads of the proximity connection(s) between the bridge and the cache memories can be provided by recesses in a surface of the cache memory, corresponding recesses in an opposing surface of the bridge, and a ball for each matching pair of corresponding cache memory and bridge recesses. The ball fits in and between the recesses of the matching pair. The recess depths and ball diameter(s) constrain a minimum distance between opposing pads of the proximity connection(s).
摘要翻译： “sombrero”桥传输处理器与一个或多个缓存存储器之间的信号通信。 该桥围绕处理器的周边，并且包括与处理器相对的孔，通过该孔可以从另一设备将功率和数据提供给处理器。 桥接器通过电容耦合的接近连接与高速缓冲存储器交换信号。 桥接器通过导电（例如导线）连接和可选的接近连接与处理器通信。 桥接器和高速缓冲存储器之间的接近连接的相对焊盘之间的间隔可以由高速缓冲存储器的表面中的凹槽，桥的相对表面中的对应的凹部和用于每个匹配的对相应的对的球提供 缓存和桥接凹槽。 球配合在匹配对中的凹槽之间。 凹陷深度和球直径约束邻近连接的相对焊盘之间的最小距离。
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公开(公告)号：US20090085233A1
公开(公告)日：2009-04-02
申请号：US11864347
申请日：2007-09-28
IPC分类号： H01L23/544 , H01L21/98
CPC分类号： H01L25/0657 , H01L23/48 , H01L23/544 , H01L25/50 , H01L29/0657 , H01L2223/5442 , H01L2223/54426 , H01L2223/5448 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2225/06593 , H01L2924/0002 , H01L2924/10157 , H01L2924/00
摘要： Embodiments of a semiconductor die that includes proximity connectors proximate to a first surface of the semiconductor die are described. This semiconductor die is configured to communicate signals with another semiconductor die via proximity communication through one or more of the proximity connectors. Moreover, the semiconductor die includes a positive feature coupled to a second surface of the semiconductor die that facilitates mechanical alignment of the semiconductor die with the other semiconductor die. Note that a first region around the positive feature defines a first plane, and the positive feature protrudes above the first plane.
摘要翻译： 描述了包括靠近半导体管芯的第一表面的接近连接器的半导体管芯的实施例。 该半导体管芯被配置为通过一个或多个接近连接器的接近通信与另一个半导体管芯通信信号。 此外，半导体管芯包括耦合到半导体管芯的第二表面的正特征，其有利于半导体管芯与其它半导体管芯的机械对准。 注意，正特征周围的第一区域限定第一平面，并且正特征突出在第一平面上方。
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公开(公告)号：US20090085183A1
公开(公告)日：2009-04-02
申请号：US11864408
申请日：2007-09-28
CPC分类号： H01L25/0652 , H01L23/10 , H01L23/48 , H01L24/02 , H01L24/16 , H01L24/72 , H01L24/81 , H01L24/95 , H01L25/50 , H01L2224/0401 , H01L2224/13099 , H01L2224/73251 , H01L2224/81136 , H01L2224/81801 , H01L2224/95136 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2225/06593 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01058 , H01L2924/01067 , H01L2924/01074 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10157 , H01L2924/10158 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H01L2924/00 , H01L2224/16 , H01L2224/72
摘要： Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die. Moreover, the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors. Furthermore, the MCM includes an alignment plate and a top plate coupled to the alignment plate. This alignment plate includes a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die, and the top plate includes a positive feature. Note that the positive feature is coupled to the first semiconductor die, and the positive feature facilitates mechanical positioning of the first semiconductor die.
摘要翻译： 描述了多芯片模块（MCM）的实施例。 该MCM包括第一半导体管芯和第二半导体管芯，其中可以是第一半导体管芯或第二半导体管芯的给定半导体管芯包括靠近给定半导体管芯的表面的接近连接器。 此外，给定的半导体管芯被配置为通过一个或多个接近连接器的接近通信与另一个半导体管芯通信信号。 此外，MCM包括对准板和联接到对准板的顶板。 该对准板包括被配置为容纳第一半导体管芯的第一负特性构件和被配置为容纳第二半导体管芯的第二负特征，并且顶板包括正特征。 注意，正特征耦合到第一半导体管芯，并且正特征有利于第一半导体管芯的机械定位。
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公开(公告)号：US5627383A
公开(公告)日：1997-05-06
申请号：US606509
申请日：1996-02-23
IPC分类号： G02F1/015 , G02F1/017 , H01L27/15 , H01L29/06 , H01L31/0352 , H01L31/10 , H01L31/105 , H01S5/042 , H01S5/183 , H01S5/30 , H01S5/34 , H01L31/0328 , H01L31/0336
CPC分类号： B82Y20/00 , G02F1/017 , H01L31/0352 , H01L31/105 , H01S5/0421 , H01S5/18341 , H01S5/305 , H01S5/3054 , H01S5/3428 , Y10S977/759
摘要： Optoelectronic devices such as photodetectors, modulators and lasers with improved optical properties are provided with an atomically smooth transition between the buried conductive layer and quantum-well-diode-containing intrinsic region of a p-i-n structure. The buried conductive layer is grown on an underlying substrate utilizing a surfactant-assisted growth technique. The dopant and dopant concentration are selected, as a function of the thickness of the conductive layer to be formed, so that a surface impurity concentration of from 0.1 to 1 monolayer of dopant atoms is provided. The presence of the impurities promotes atomic ordering at the interface between the conductive layer and the intrinsic region, and subsequently results in sharp barriers between the alternating layers comprising the quantum-well-diodes of the intrinsic layer.
摘要翻译： 具有改进的光学性质的诸如光电探测器，调制器和激光器的光电器件在掩埋导电层和含p-i-n结构的量子阱二极管的本征区域之间具有原子平滑的过渡。 使用表面活性剂辅助生长技术将掩埋的导电层生长在下面的衬底上。 选择掺杂剂和掺杂剂浓度作为要形成的导电层的厚度的函数，使得提供0.1至1个单层掺杂剂原子的表面杂质浓度。 杂质的存在促进在导电层和本征区之间的界面处的原子排序，并且随后在包含本征层的量子阱二极管的交替层之间产生尖锐的障碍。
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公开(公告)号：US5573975A
公开(公告)日：1996-11-12
申请号：US417878
申请日：1995-04-06
CPC分类号： H01L33/44 , G02F1/218 , H01L33/105 , H01S5/18361 , H01S5/0042
摘要： A semiconductor device is provided that includes an optical cavity that is designed to provide a prescribed resonant optical wavelength. The optical cavity includes a mirror structure deposited on top of a substrate and a multi-layer region such as an electroabsorptive region, for example, deposited over the mirror structure. A partial antireflective coating is deposited over the multi-layer region. The mirror structure and the multilayer region have a thickness variation sufficient to yield a resonant optical wavelength that deviates from the prescribed resonant wavelength. The partial antireflective coating has a non-uniform thickness variation that causes the resonant optical wavelength to shift substantially toward the prescribed resonant optical wavelength.
摘要翻译： 提供一种半导体器件，其包括设计成提供规定的谐振光波长的光腔。 光学腔包括沉积在基底顶部的反射镜结构和诸如沉积在反射镜结构上的诸如电吸收区的多层区域。 部分抗反射涂层沉积在多层区域上。 镜面结构和多层区域具有足以产生偏离规定谐振波长的谐振光波长的厚度变化。 部分抗反射涂层具有不均匀的厚度变化，其使谐振光波长基本上朝规定的共振光波长移动。
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公开(公告)号：US5518935A
公开(公告)日：1996-05-21
申请号：US261583
申请日：1994-06-17
IPC分类号： C30B33/12 , G02F1/015 , G02F1/017 , H01L31/14 , H01L31/18 , H01S5/00 , H01S5/026 , H01S5/042 , H01S5/50 , H01L21/324
CPC分类号： B82Y20/00 , G02F1/015 , H01L31/1864 , G02F1/017 , Y02E10/50 , Y02P70/521
摘要： Hydrogenation of an optical device that includes an intrinsic region and at least one associated doped region is effective to improve the photoresponsivity of the device. Subsequent annealing of the device substantially restores the conductivity of the doped region(s) while preserving in the intrinsic region a major part of the beneficial effects of hydrogenation.
摘要翻译： 包括本征区域和至少一个相关掺杂区域的光学器件的氢化对于改善器件的光响应性是有效的。 器件的后续退火基本上恢复了掺杂区域的导电性，同时在本征区域中保留了大部分氢化的有益效果。
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100.发明授权
公开(公告)号：US5450822A
公开(公告)日：1995-09-19
申请号：US190777
申请日：1994-02-01
申请人： John E. Cunningham
发明人： John E. Cunningham
CPC分类号： C25B9/06 , C25B1/04 , F02B51/04 , Y02E60/366 , Y02T10/126 , Y10S123/12
摘要： The present invention 10 comprises a hollow main canister 12 having a plurality of conductive plates 19 interposed therein each acting as both an anode and a cathode when electrolysis of an electrolytic fluid, such as potassium hydroxide, occurs in the main canister. The electrolysis reaction is powered by a current source 24 normally attached to an electrode 14 interposed in the main canister 12 seeking the grounded walls of the main canister 11. The current can also be attached to the walls of the main canister and the electrode 14 grounded. The voltage is divided between the conductive plates 19 in this circuit. The produced ionized hydrogen and oxygen from the electrolytic reaction is directed through the main canister to the combustion situs 23 of an internal combustion engine fuel/air mixture system through the use of a delivery fitting 21 and a delivery tube 22. The hydrogen and oxygen interposed within the combustion situs enhances combustion and the cleanliness of the same thereby producing a cleaner and more efficient fuel burn.
摘要翻译： 本发明10包括中空主罐12，其具有插入其中的多个导电板19，当在主罐中发生电解如氢氧化钾的电解液时，它们充当阳极和阴极两者。 电解反应由通常附着到插入主罐12中的电极14的电流源24供电，寻求主罐11的接地壁。电流也可以附着到主罐的壁和接地的电极14 。 在该电路中的导电板19之间分压电压。 通过使用输送配件21和输送管22，从电解反应产生的电离氢和氧通过主罐引导到内燃机燃料/空气混合系统的燃烧区23。 在燃烧区域内增强燃烧和其清洁度，从而产生更清洁和更有效的燃料燃烧。
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