DUAL UV-VIS REFLECTANCE ABSORBANCE AND PHOTOLUMINESCENCE MODULES

    公开(公告)号:US20240246075A1

    公开(公告)日:2024-07-25

    申请号:US18236226

    申请日:2023-08-21

    Abstract: Devices, systems, and methods for characterizing material samples. In one aspect, a device for characterizing a sample includes a substrate configured for receiving a sample thereon; an optical fiber probe comprising a first end positioned near the sample and a second end that is bifurcated to include one or more first fiber configured for connection to a first light emitting device and one or more second fiber configured for connection to a spectrometer; a reflectance module coupled to the substrate; and a second light emitting device positioned near the sample. The optical fiber probe is configured for selectively obtaining at the spectrometer both a reflectance absorbance measurement of the sample associated with the first light emitting device and a photoluminescence measurement of the sample associated with the second light emitting device.

    FINE PARTICLE CAPTURE DEVICE
    8.
    发明公开

    公开(公告)号:US20230364612A1

    公开(公告)日:2023-11-16

    申请号:US18029019

    申请日:2021-09-03

    Inventor: Takayuki KOMORI

    Abstract: A fine particle capture device, having a chip that has a plane part and projection parts, and is configured such that fine particle-containing liquid entering from an inlet port passes on the surface of the plane part in the chip and between a projection part and another projection part adjacent thereto and the liquid is discharged from an outlet port. The projection parts are disposed on the plane part in the form of layers. The layers each has a plurality of projection parts, and are configured such that the fine particle-containing liquid having passed through a layer on the inlet port side passes through a layer on the outlet port side adjacent thereto. Each layer has a capture part and a bypass part. The capture part is disposed on the outlet port side of the bypass part in a specific layer as a portion of another layer adjacent thereto.

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