SOUND RECOGNITION ELECTRONIC DEVICE
    2.
    发明申请

    公开(公告)号:US20180096688A1

    公开(公告)日:2018-04-05

    申请号:US15614001

    申请日:2017-06-05

    Abstract: A voice recognition electronic device is provided which includes a housing including a first face that faces a first direction, a second face that faces a second direction opposite to the first direction, a third face disposed between the first face and the second face, and a translucent cover that forms at least a portion of the third face, a voice reception unit disposed below the first face of the housing and including a plurality of microphones that receive a voice input from a user, a light source unit disposed inside the housing to emit light, a driving unit connected to the light source unit to control the light source unit to move according to a preset operation, and a control unit that controls the driving unit in response to the voice input of the user, which is delivered from the voice reception unit.

    SEMICONDUCTOR DEVICE
    3.
    发明申请

    公开(公告)号:US20220157955A1

    公开(公告)日:2022-05-19

    申请号:US17469361

    申请日:2021-09-08

    Abstract: Disclosed is a semiconductor device including a substrate including first and second active regions, a device isolation layer on the substrate and defining first and second active patterns, first and second gate electrodes running across the first and second active regions and aligned with each other, first and second source/drain patterns on the first and second active patterns, a first active contact connecting the first and second source/drain patterns to each other, and a gate cutting pattern between the first and second gate electrodes. An upper portion of the first active contact includes first and second upper dielectric patterns. The first active contact has a minimum width at a portion between the first and second upper dielectric patterns. A minimum width of the gate cutting pattern is a second width. A ratio of the first width to the second width is in a range of 0.8 to 1.2.

    SEMICONDUCTOR DEVICE
    4.
    发明申请

    公开(公告)号:US20190304972A1

    公开(公告)日:2019-10-03

    申请号:US16260275

    申请日:2019-01-29

    Abstract: A semiconductor device includes a substrate, an interlayer dielectric layer on the substrate and having a first opening and a second opening, a first gate pattern in the first opening and including a first work function pattern, a first conductive blocking pattern, a first blocking pattern, and a conductive pattern that are stacked, and a second gate pattern in the second opening. The second gate pattern includes a second work function pattern of a material the same as a material of the first work function pattern, and a second conductive blocking pattern on the second work function pattern and filling the second opening. The second conductive blocking pattern includes a material that is different from a material of the conductive pattern and is different from a material of the first blocking pattern.

    SEMICONDUCTOR DEVICE
    5.
    发明申请

    公开(公告)号:US20190131417A1

    公开(公告)日:2019-05-02

    申请号:US15958061

    申请日:2018-04-20

    Abstract: A semiconductor device includes a substrate having first and second active regions with a field insulating layer therebetween that contacts the first and second active regions, and a gate electrode on the substrate and traversing the first active region, the second active region, and the field insulating layer. The gate electrode includes a first portion over the first active region, a second portion over the second active region, and a third portion in contact with the first and second portions. The gate electrode includes an upper gate electrode having first through third thicknesses in the first through third portions, respectively, where the third thickness is greater than the first thickness, and smaller than the second thickness.

    SEMICONDUCTOR DEVICE
    6.
    发明申请

    公开(公告)号:US20220013649A1

    公开(公告)日:2022-01-13

    申请号:US17185466

    申请日:2021-02-25

    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, an active pattern extending in a first direction on the substrate, a gate electrode extending in a second direction intersecting the first direction on the active pattern, a gate spacer extending in the second direction along side walls of the gate electrode, an interlayer insulating layer contacting side walls of the gate spacer, a trench formed on the gate electrode in the interlayer insulating layer, a first capping pattern provided along side walls of the trench, at least one side wall of the first capping pattern having an inclined profile, and a second capping pattern provided on the first capping pattern in the trench.

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