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公开(公告)号：US20140102774A1
公开(公告)日：2014-04-17
申请号：US13651789
申请日：2012-10-15
Applicant: RAYTHEON COMPANY
Inventor： Andrew K. Brown , Thomas L. Obert , Michael J. Sotelo , Darin M. Gritters , Kenneth W. Brown
CPC classification number: H05K1/167 , H05K1/0234 , H05K1/0242 , H05K3/06 , H05K2201/0379 , H05K2201/09263 , H05K2201/09727 , H05K2201/09781
Abstract: An apparatus for conveying an electrical signal includes: a conductive pathway having a conductive material. The conductive material has a first edge and a second edge and is configured to convey the electrical signal. The apparatus also includes a resistive material in contact with at least a portion of the conductive pathway, covering an edge of the conductive pathway, and extending beyond the edge. The resistive material has a conductivity less than the conductivity of the conductive material.
Abstract translation: 用于传送电信号的装置包括：具有导电材料的导电路径。 导电材料具有第一边缘和第二边缘，并且被配置为传送电信号。 该装置还包括与导电路径的至少一部分接触的电阻材料，覆盖导电路径的边缘并且延伸超过边缘。 电阻材料的导电率小于导电材料的导电率。
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公开(公告)号：US11929556B2
公开(公告)日：2024-03-12
申请号：US17014151
申请日：2020-09-08
Applicant: Raytheon Company
Inventor： Andrew D. Gamalski , Andrew K. Brown
CPC classification number: H01Q21/065 , H01Q1/38 , H01Q3/36 , H01Q9/0457 , H01Q21/24
Abstract: An apparatus includes multiple patch antenna elements configured to transmit multiple electromagnetic beams in multiple beam directions. The apparatus also includes multiple inputs each configured to receive one of multiple input signals, where each input signal is associated with one of the electromagnetic beams. The apparatus further includes multiple phase-tapered splitters each configured to receive one of the input signals, divide the received input signal into a set of sub-signals, and provide a phase taper that adjusts phases of at least some of the sub-signals in the set of sub-signals. Different phase tapers are associated with different ones of the beam directions. In addition, the apparatus includes multiple 90° hybrid transformers each configured to receive sub-signals associated with different ones of the input signals, isolate the received sub-signals from each other, and provide the isolated sub-signals to one of the patch antenna elements.
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公开(公告)号：US09226385B2
公开(公告)日：2015-12-29
申请号：US13678993
申请日：2012-11-16
Applicant: Raytheon Company
Inventor： Andrew K. Brown , Shane A. O'Connor
CPC classification number: H05K1/0216 , H01P1/20363 , H01P3/081 , H01P11/002
Abstract: A radio frequency (RF) device includes a transmission line arranged on a substrate, the transmission line operative to propagate an RF signal having a wavelength (λ), and a first isolation portion arranged on the substrate proximate to the transmission line, the first isolation portion including an arrangement of stubs, where each stub of the arrangement of stubs has a length (y) where y=¼λ, the first isolation portion operative to substantially prevent electromagnetic interference caused by the propagation of the RF signal in the transmission line from passing through the first isolation portion.
Abstract translation: 射频（RF）装置包括布置在基板上的传输线，传输线可操作以传播具有波长（λ）的RF信号，以及布置在靠近传输线的基板上的第一隔离部分，第一隔离 部分，其包括短截线的布置，其中短截线布置的每个短截线具有y = 1 /λ的长度（y），第一隔离部分用于基本上防止由传输线中的RF信号传播引起的电磁干扰而不经过 通过第一隔离部分。
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公开(公告)号：US20140139300A1
公开(公告)日：2014-05-22
申请号：US13678993
申请日：2012-11-16
Applicant: RAYTHEON COMPANY
Inventor： Andrew K. Brown , Shane A. O'Connor
IPC: H01P3/08
CPC classification number: H05K1/0216 , H01P1/20363 , H01P3/081 , H01P11/002
Abstract: A radio frequency (RF) device includes a transmission line arranged on a substrate, the transmission line operative to propagate an RF signal having a wavelength (λ), and a first isolation portion arranged on the substrate proximate to the transmission line, the first isolation portion including an arrangement of stubs, where each stub of the arrangement of stubs has a length (y) where y=¼λ, the first isolation portion operative to substantially prevent electromagnetic interference caused by the propagation of the RF signal in the transmission line from passing through the first isolation portion.
Abstract translation: 射频（RF）装置包括布置在基板上的传输线，传输线可操作以传播具有波长（λ）的RF信号，以及布置在靠近传输线的基板上的第一隔离部分，第一隔离 部分，其包括短截线的布置，其中短截线布置的每个短截线具有y = 1 /λ的长度（y），第一隔离部分用于基本上防止由传输线中的RF信号传播引起的电磁干扰而不经过 通过第一隔离部分。
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公开(公告)号：US11917746B2
公开(公告)日：2024-02-27
申请号：US17660261
申请日：2022-04-22
Applicant: Raytheon Company
Inventor： Miroslav Micovic , Brandon W. Pillans , Andrew D. Gamalski , Andrew K. Brown
CPC classification number: H05K1/0209 , H05K1/023 , H05K1/0298 , H05K3/205 , H05K3/3436 , H05K2201/0195 , H05K2201/064 , H05K2203/043 , H05K2203/1453 , H05K2203/304
Abstract: A method of forming a heat spreader on a printed circuit board (PCB), having a power dissipating component operably coupled thereto, includes attaching a thermally and electrically conductive structure, to a first side of the PCB to define a first PCB region that includes the component and a second PCB region without. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating membrane is deposited to the first region, the second region, and to the structure. A second protective layer is applied over a portion of the conductive plating membrane that overlays the second region, leaving exposed the rest of the conductive plating membrane. An electrically and thermally conductive layer is electroplated over the exposed areas of the conductive plating membrane, to form a heat exchanger within the first region.
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Patent Agency Ranking
公开(公告)号：US20230345616A1
公开(公告)日：2023-10-26
申请号：US17660261
申请日：2022-04-22
Applicant: Raytheon Company
Inventor： Miroslav Micovic , Brandon W. Pillans , Andrew D. Gamalski , Andrew K. Brown
CPC classification number: H05K1/0209 , H05K1/023 , H05K1/0298 , H05K3/205 , H05K3/3436 , H05K2203/1453 , H05K2201/0195 , H05K2201/064 , H05K2203/043 , H05K2203/304
Abstract: A method of forming a heat spreader on a printed circuit board (PCB), having a power dissipating component operably coupled thereto, includes attaching a thermally and electrically conductive structure, to a first side of the PCB to define a first PCB region that includes the component and a second PCB region without. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating membrane is deposited to the first region, the second region, and to the structure. A second protective layer is applied over a portion of the conductive plating membrane that overlays the second region, leaving exposed the rest of the conductive plating membrane. An electrically and thermally conductive layer is electroplated over the exposed areas of the conductive plating membrane, to form a heat exchanger within the first region.
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公开(公告)号：US11424551B2
公开(公告)日：2022-08-23
申请号：US16446339
申请日：2019-06-19
Applicant: RAYTHEON COMPANY
Inventor： Andrew Gamalski , Andrew K. Brown , Darren Himbaza , Kenneth W. Brown
Abstract: A modular communications array includes: an antenna card including a patch antenna array for communicating RF signals; a chip carrier card including a plurality of monolithic microwave integrated circuits (MMICs), each with a power amplifier (PA) and positioned on a respective metal post of a plurality of metal posts, wherein; a phase shifter card including a plurality of phase shifter circuits for beam steering and gain control and a plurality of cavities. Each of the cavities corresponds to a location for the respective metal post on the chip carrier card; and a cooling block coupled to the chip carrier card by a thermally conductive epoxy for cooling, where the phase shifter card is replaceable without affecting the components of the antenna card and the chip carrier card.
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公开(公告)号：US20220077594A1
公开(公告)日：2022-03-10
申请号：US17014151
申请日：2020-09-08
Applicant: Raytheon Company
Inventor： Andrew D. Gamalski , Andrew K. Brown
Abstract: An apparatus includes multiple patch antenna elements configured to transmit multiple electromagnetic beams in multiple beam directions. The apparatus also includes multiple inputs each configured to receive one of multiple input signals, where each input signal is associated with one of the electromagnetic beams. The apparatus further includes multiple phase-tapered splitters each configured to receive one of the input signals, divide the received input signal into a set of sub-signals, and provide a phase taper that adjusts phases of at least some of the sub-signals in the set of sub-signals. Different phase tapers are associated with different ones of the beam directions. In addition, the apparatus includes multiple 90° hybrid transformers each configured to receive sub-signals associated with different ones of the input signals, isolate the received sub-signals from each other, and provide the isolated sub-signals to one of the patch antenna elements.
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公开(公告)号：US09362609B2
公开(公告)日：2016-06-07
申请号：US14230807
申请日：2014-03-31
Applicant: Raytheon Company
Inventor： Kenneth W. Brown , Darin M. Gritters , Michael J. Sotelo , Andrew K. Brown , Travis B. Feenstra
IPC: H01P5/20 , H03F3/19 , H01Q21/00 , H03F1/02 , H03F3/21 , H03F1/30 , H01P5/02 , H01P5/18 , H01P5/107 , H01P5/19 , H04B1/036
CPC classification number: H01P5/20 , H01P5/024 , H01P5/107 , H01P5/182 , H01P5/19 , H01Q21/0025 , H03F1/0205 , H03F1/30 , H03F3/19 , H03F3/21 , H03F2200/447 , H03F2200/451 , H04B1/036
Abstract: A power amplifier uses a modular architecture in which each of the one or more modules spatially combines the power from multiple amplified channels. The individual modules are configured to operate in the EHF band and above at low loss. This entails reconfiguring the input and output splitters, the end-launched transitions between the amplifier chips and the input and output splitters and the packaging of the DC power and control board. The input splitter uses a split-block technology. The output splitter maps each amplified channel into a two-dimensional aperture.
Abstract translation: 功率放大器使用模块化架构，其中一个或多个模块中的每一个空间地组合来自多个放大通道的功率。 各个模块配置为以低损耗在EHF频带和以上运行。 这需要重新配置输入和输出分路器，放大器芯片与输入和输出分路器之间的终端转换以及直流电源和控制板的封装。 输入分配器使用分割块技术。 输出分离器将每个放大的通道映射成二维孔径。
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公开(公告)号：US20150280650A1
公开(公告)日：2015-10-01
申请号：US14230807
申请日：2014-03-31
Applicant: Raytheon Company
Inventor： Kenneth W. Brown , Darin M. Gritters , Michael J. Sotelo , Andrew K. Brown , Travis B. Feenstra
CPC classification number: H01P5/20 , H01P5/024 , H01P5/107 , H01P5/182 , H01P5/19 , H01Q21/0025 , H03F1/0205 , H03F1/30 , H03F3/19 , H03F3/21 , H03F2200/447 , H03F2200/451 , H04B1/036
Abstract: A power amplifier uses a modular architecture in which each of the one or more modules spatially combines the power from multiple amplified channels. The individual modules are configured to operate in the EHF band and above at low loss. This entails reconfiguring the input and output splitters, the end-launched transitions between the amplifier chips and the input and output splitters and the packaging of the DC power and control board. The input splitter uses a split-block technology. The output splitter maps each amplified channel into a two-dimensional aperture.
Abstract translation: 功率放大器使用模块化架构，其中一个或多个模块中的每一个空间地组合来自多个放大通道的功率。 各个模块配置为以低损耗在EHF频带和以上运行。 这需要重新配置输入和输出分路器，放大器芯片与输入和输出分路器之间的终端转换以及直流电源和控制板的封装。 输入分配器使用分割块技术。 输出分离器将每个放大的通道映射成二维孔径。
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