公开(公告)号：US10930742B2

公开(公告)日：2021-02-23

申请号：US16821559

申请日：2020-03-17

Applicant: RAYTHEON COMPANY

Inventor： Hooman Kazemi ,  Mark Rosker ,  Thomas E. Kazior ,  Shane A. O'Connor ,  Emily Elswick

IPC: H01L23/482 ,  H01L23/552 ,  H01L23/538 ,  H01L29/20 ,  H01L23/29

Abstract: A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is enclosed in a space defined by the respective aperture and the second substrate. The module includes a lid and at least one mode suppression circuit disposed in the lid. The modules may include an invariant die where different technologies are stacked together.

公开(公告)号：US20190165108A1

公开(公告)日：2019-05-30

申请号：US15827349

申请日：2017-11-30

Applicant: RAYTHEON COMPANY

Inventor： Hooman Kazemi ,  Mark Rosker ,  Thomas E. Kazior ,  Shane A. O'Connor ,  Emily Elswick

IPC: H01L29/20 ,  H01L23/482 ,  H01L23/538 ,  H01L23/552 ,  H01L23/29

Abstract: A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is hermetically sealed in a space defined by the respective aperture and the second substrate. One or more vias are provided to access I/O signals at a surface of the first or second substrates. The modules may include an invariant die where different technologies are stacked together.

公开(公告)号：US20200219982A1

公开(公告)日：2020-07-09

申请号：US16821559

申请日：2020-03-17

Applicant: RAYTHEON COMPANY

Inventor： Hooman Kazemi ,  Mark Rosker ,  Thomas E. Kazior ,  Shane A. O'Connor ,  Emily Elswick

IPC: H01L29/20 ,  H01L23/482 ,  H01L23/29 ,  H01L23/552 ,  H01L23/538

Abstract: A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is enclosed in a space defined by the respective aperture and the second substrate. The module includes a lid and at least one mode suppression circuit disposed in the lid. The modules may include an invariant die where different technologies are stacked together.

公开(公告)号：US09226385B2

公开(公告)日：2015-12-29

申请号：US13678993

申请日：2012-11-16

Applicant: Raytheon Company

Inventor： Andrew K. Brown ,  Shane A. O'Connor

IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00 ,  H01P1/203

CPC classification number: H05K1/0216 ,  H01P1/20363 ,  H01P3/081 ,  H01P11/002

Abstract: A radio frequency (RF) device includes a transmission line arranged on a substrate, the transmission line operative to propagate an RF signal having a wavelength (λ), and a first isolation portion arranged on the substrate proximate to the transmission line, the first isolation portion including an arrangement of stubs, where each stub of the arrangement of stubs has a length (y) where y=¼λ, the first isolation portion operative to substantially prevent electromagnetic interference caused by the propagation of the RF signal in the transmission line from passing through the first isolation portion.

Abstract translation: 射频（RF）装置包括布置在基板上的传输线，传输线可操作以传播具有波长（λ）的RF信号，以及布置在靠近传输线的基板上的第一隔离部分，第一隔离 部分，其包括短截线的布置，其中短截线布置的每个短截线具有y = 1 /λ的长度（y），第一隔离部分用于基本上防止由传输线中的RF信号传播引起的电磁干扰而不经过 通过第一隔离部分。

公开(公告)号：US20140139300A1

公开(公告)日：2014-05-22

申请号：US13678993

申请日：2012-11-16

Applicant: RAYTHEON COMPANY

Inventor： Andrew K. Brown ,  Shane A. O'Connor

IPC: H01P3/08

CPC classification number: H05K1/0216 ,  H01P1/20363 ,  H01P3/081 ,  H01P11/002

Abstract: A radio frequency (RF) device includes a transmission line arranged on a substrate, the transmission line operative to propagate an RF signal having a wavelength (λ), and a first isolation portion arranged on the substrate proximate to the transmission line, the first isolation portion including an arrangement of stubs, where each stub of the arrangement of stubs has a length (y) where y=¼λ, the first isolation portion operative to substantially prevent electromagnetic interference caused by the propagation of the RF signal in the transmission line from passing through the first isolation portion.

Abstract translation: 射频（RF）装置包括布置在基板上的传输线，传输线可操作以传播具有波长（λ）的RF信号，以及布置在靠近传输线的基板上的第一隔离部分，第一隔离 部分，其包括短截线的布置，其中短截线布置的每个短截线具有y = 1 /λ的长度（y），第一隔离部分用于基本上防止由传输线中的RF信号传播引起的电磁干扰而不经过 通过第一隔离部分。