Invention Application
- Patent Title: MODULAR SPATIALLY COMBINED EHF POWER AMPLIFIER
- Patent Title (中): 模块化的空调EHF功率放大器
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Application No.: US14230807Application Date: 2014-03-31
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Publication No.: US20150280650A1Publication Date: 2015-10-01
- Inventor: Kenneth W. Brown , Darin M. Gritters , Michael J. Sotelo , Andrew K. Brown , Travis B. Feenstra
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Main IPC: H03F1/02
- IPC: H03F1/02 ; H01P5/12 ; H03F1/30 ; H03F3/19 ; H03F3/21 ; H05K7/20 ; H01P5/08

Abstract:
A power amplifier uses a modular architecture in which each of the one or more modules spatially combines the power from multiple amplified channels. The individual modules are configured to operate in the EHF band and above at low loss. This entails reconfiguring the input and output splitters, the end-launched transitions between the amplifier chips and the input and output splitters and the packaging of the DC power and control board. The input splitter uses a split-block technology. The output splitter maps each amplified channel into a two-dimensional aperture.
Public/Granted literature
- US09362609B2 Modular spatially combined EHF power amplifier Public/Granted day:2016-06-07
Information query
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