公开(公告)号：US11424551B2

公开(公告)日：2022-08-23

申请号：US16446339

申请日：2019-06-19

Applicant: RAYTHEON COMPANY

Inventor： Andrew Gamalski ,  Andrew K. Brown ,  Darren Himbaza ,  Kenneth W. Brown

IPC: H01Q21/00 ,  H01Q1/02 ,  H01Q1/22 ,  H04B1/04 ,  H05K7/20

Abstract: A modular communications array includes: an antenna card including a patch antenna array for communicating RF signals; a chip carrier card including a plurality of monolithic microwave integrated circuits (MMICs), each with a power amplifier (PA) and positioned on a respective metal post of a plurality of metal posts, wherein; a phase shifter card including a plurality of phase shifter circuits for beam steering and gain control and a plurality of cavities. Each of the cavities corresponds to a location for the respective metal post on the chip carrier card; and a cooling block coupled to the chip carrier card by a thermally conductive epoxy for cooling, where the phase shifter card is replaceable without affecting the components of the antenna card and the chip carrier card.