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公开(公告)号:US20140102774A1
公开(公告)日:2014-04-17
申请号:US13651789
申请日:2012-10-15
Applicant: RAYTHEON COMPANY
Inventor: Andrew K. Brown , Thomas L. Obert , Michael J. Sotelo , Darin M. Gritters , Kenneth W. Brown
CPC classification number: H05K1/167 , H05K1/0234 , H05K1/0242 , H05K3/06 , H05K2201/0379 , H05K2201/09263 , H05K2201/09727 , H05K2201/09781
Abstract: An apparatus for conveying an electrical signal includes: a conductive pathway having a conductive material. The conductive material has a first edge and a second edge and is configured to convey the electrical signal. The apparatus also includes a resistive material in contact with at least a portion of the conductive pathway, covering an edge of the conductive pathway, and extending beyond the edge. The resistive material has a conductivity less than the conductivity of the conductive material.
Abstract translation: 用于传送电信号的装置包括:具有导电材料的导电路径。 导电材料具有第一边缘和第二边缘,并且被配置为传送电信号。 该装置还包括与导电路径的至少一部分接触的电阻材料,覆盖导电路径的边缘并且延伸超过边缘。 电阻材料的导电率小于导电材料的导电率。
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公开(公告)号:US09196940B2
公开(公告)日:2015-11-24
申请号:US14201410
申请日:2014-03-07
Applicant: Raytheon Company
Inventor: Kenneth W. Brown , Darin M. Gritters , Andrew W. Chang
Abstract: A waveguide mechanical phase adjuster includes at least one pair of dielectric rods nominally spaced ¼ wavelength apart and inserted through a corresponding pair of holes in the wall of a waveguide. The holes are dimensioned so that they are in “cutoff” at the top end of the spectral band. An adjustment mechanism sets the insertion depth of the rods, which determines the amount of dielectric loading and, in turn, the insertion phase. Changing the insertion depth changes the dielectric loading, hence the insertion phase. The ¼ wavelength spacing of the rods serves to cancel reflected energy. Additional pairs of dielectric rods can be similarly configured and actuated to increase the range over which the insertion phase can be adjusted. The waveguide mechanical phase adjuster is well adapted for use with power combiners to maintain tight phase coherence between channels.
Abstract translation: 波导机械相位调节器包括至少一对标称间隔1/4波长的介电棒,并插入穿过波导壁中相应的一对孔。 这些孔的尺寸设计使得它们在光谱带的顶端处于“截止”状态。 调节机构设定棒的插入深度,这决定了介电负载的量,又决定了插入阶段。 改变插入深度会改变介电负载,因此会导致插入阶段。 棒的1/4波长间隔用于消除反射能量。 附加的介电棒对可以类似地配置和致动以增加可以调整插入相位的范围。 波导机械相位调节器很好地适用于功率组合器,以保持通道之间的紧密的相位相干性。
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公开(公告)号:US11034068B2
公开(公告)日:2021-06-15
申请号:US15966950
申请日:2018-04-30
Applicant: RAYTHEON COMPANY
Inventor: Paul A. Merems , Darin M. Gritters
IPC: B29C45/14 , H05K1/18 , B29C39/10 , G01D11/24 , B29K101/10 , B29K101/12 , B29L31/34
Abstract: An encapsulation for electronics is provided. The encapsulation includes a circuit card assembly (CCA) on which a component of the electronics is operably disposed, a compliant thermal buffer coating (TBC), thermoset material and high-performance thermoplastic materials. The compliant TBC is layered over the component and a first area of the CCA, which extends about a periphery of the component. The thermoset material is cast over the compliant TBC and a second area of the CCA, which extends about a periphery of the compliant TBC. The high-performance thermoplastic material is injection molded over the thermoset material and a third area of the CCA, which extends about a periphery of the thermoset material.
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公开(公告)号:US10153536B2
公开(公告)日:2018-12-11
申请号:US15388244
申请日:2016-12-22
Applicant: Raytheon Company
Inventor: Darin M. Gritters , Kenneth W. Brown , David D. Crouch
Abstract: In one aspect, a Y-splitter includes a first arm having a first port, a second arm having a second port, a third arm having a third port, a fourth arm having a fourth port and a Y-split portion having a first end coupled to the first arm, a second end coupled to the second arm, a third end coupled to the third arm and a fourth end coupled to the fourth arm. The Y-split portion splits a signal from a first signal path from the first port into a second signal on a second signal path and a third signal on a third signal path. A first angle between the second signal path and the first signal path is greater than 90 degrees and a second angle between the third signal path and the first signal path is greater than 90 degrees.
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公开(公告)号:US20150255843A1
公开(公告)日:2015-09-10
申请号:US14201410
申请日:2014-03-07
Applicant: Raytheon Company
Inventor: Kenneth W. Brown , Darin M. Gritters , Andrew W. Chang
IPC: H01P1/18
Abstract: A waveguide mechanical phase adjuster includes at least one pair of dielectric rods nominally spaced ¼ wavelength apart and inserted through a corresponding pair of holes in the wall of a waveguide. The holes are dimensioned so that they are in “cutoff” at the top end of the spectral band. An adjustment mechanism sets the insertion depth of the rods, which determines the amount of dielectric loading and, in turn, the insertion phase. Changing the insertion depth changes the dielectric loading, hence the insertion phase. The ¼ wavelength spacing of the rods serves to cancel reflected energy. Additional pairs of dielectric rods can be similarly configured and actuated to increase the range over which the insertion phase can be adjusted. The waveguide mechanical phase adjuster is well adapted for use with power combiners to maintain tight phase coherence between channels.
Abstract translation: 波导机械相位调节器包括至少一对标称间隔1/4波长的介电棒,并插入穿过波导壁中相应的一对孔。 这些孔的尺寸设计使得它们在光谱带的顶端处于“截止”状态。 调节机构设定棒的插入深度,这决定了介电负载的量,又决定了插入阶段。 改变插入深度会改变介电负载,因此会导致插入阶段。 棒的1/4波长间隔用于消除反射能量。 附加的介电棒对可以类似地配置和致动以增加可以调整插入相位的范围。 波导机械相位调节器很好地适用于功率组合器,以保持通道之间的紧密的相位相干性。
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公开(公告)号:US20190329468A1
公开(公告)日:2019-10-31
申请号:US15966950
申请日:2018-04-30
Applicant: RAYTHEON COMPANY
Inventor: Paul A. Merems , Darin M. Gritters
Abstract: An encapsulation for electronics is provided. The encapsulation includes a circuit card assembly (CCA) on which a component of the electronics is operably disposed, a compliant thermal buffer coating (TBC), thermoset material and high-performance thermoplastic materials. The compliant TBC is layered over the component and a first area of the CCA, which extends about a periphery of the component. The thermoset material is cast over the compliant TBC and a second area of the CCA, which extends about a periphery of the compliant TBC. The high-performance thermoplastic material is injection molded over the thermoset material and a third area of the CCA, which extends about a periphery of the thermoset material.
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公开(公告)号:US20180183129A1
公开(公告)日:2018-06-28
申请号:US15388244
申请日:2016-12-22
Applicant: Raytheon Company
Inventor: Darin M. Gritters , Kenneth W. Brown , David D. Crouch
IPC: H01P5/19
Abstract: In one aspect, a Y-splitter includes a first arm having a first port, a second arm having a second port, a third arm having a third port, a fourth arm having a fourth port and a Y-split portion having a first end coupled to the first arm, a second end coupled to the second arm, a third end coupled to the third arm and a fourth end coupled to the fourth arm. The Y-split portion splits a signal from a first signal path from the first port into a second signal on a second signal path and a third signal on a third signal path. A first angle between the second signal path and the first signal path is greater than 90 degrees and a second angle between the third signal path and the first signal path is greater than 90 degrees.
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公开(公告)号:US09362609B2
公开(公告)日:2016-06-07
申请号:US14230807
申请日:2014-03-31
Applicant: Raytheon Company
Inventor: Kenneth W. Brown , Darin M. Gritters , Michael J. Sotelo , Andrew K. Brown , Travis B. Feenstra
IPC: H01P5/20 , H03F3/19 , H01Q21/00 , H03F1/02 , H03F3/21 , H03F1/30 , H01P5/02 , H01P5/18 , H01P5/107 , H01P5/19 , H04B1/036
CPC classification number: H01P5/20 , H01P5/024 , H01P5/107 , H01P5/182 , H01P5/19 , H01Q21/0025 , H03F1/0205 , H03F1/30 , H03F3/19 , H03F3/21 , H03F2200/447 , H03F2200/451 , H04B1/036
Abstract: A power amplifier uses a modular architecture in which each of the one or more modules spatially combines the power from multiple amplified channels. The individual modules are configured to operate in the EHF band and above at low loss. This entails reconfiguring the input and output splitters, the end-launched transitions between the amplifier chips and the input and output splitters and the packaging of the DC power and control board. The input splitter uses a split-block technology. The output splitter maps each amplified channel into a two-dimensional aperture.
Abstract translation: 功率放大器使用模块化架构,其中一个或多个模块中的每一个空间地组合来自多个放大通道的功率。 各个模块配置为以低损耗在EHF频带和以上运行。 这需要重新配置输入和输出分路器,放大器芯片与输入和输出分路器之间的终端转换以及直流电源和控制板的封装。 输入分配器使用分割块技术。 输出分离器将每个放大的通道映射成二维孔径。
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公开(公告)号:US20150280650A1
公开(公告)日:2015-10-01
申请号:US14230807
申请日:2014-03-31
Applicant: Raytheon Company
Inventor: Kenneth W. Brown , Darin M. Gritters , Michael J. Sotelo , Andrew K. Brown , Travis B. Feenstra
CPC classification number: H01P5/20 , H01P5/024 , H01P5/107 , H01P5/182 , H01P5/19 , H01Q21/0025 , H03F1/0205 , H03F1/30 , H03F3/19 , H03F3/21 , H03F2200/447 , H03F2200/451 , H04B1/036
Abstract: A power amplifier uses a modular architecture in which each of the one or more modules spatially combines the power from multiple amplified channels. The individual modules are configured to operate in the EHF band and above at low loss. This entails reconfiguring the input and output splitters, the end-launched transitions between the amplifier chips and the input and output splitters and the packaging of the DC power and control board. The input splitter uses a split-block technology. The output splitter maps each amplified channel into a two-dimensional aperture.
Abstract translation: 功率放大器使用模块化架构,其中一个或多个模块中的每一个空间地组合来自多个放大通道的功率。 各个模块配置为以低损耗在EHF频带和以上运行。 这需要重新配置输入和输出分路器,放大器芯片与输入和输出分路器之间的终端转换以及直流电源和控制板的封装。 输入分配器使用分割块技术。 输出分离器将每个放大的通道映射成二维孔径。
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公开(公告)号:US09078371B2
公开(公告)日:2015-07-07
申请号:US13651789
申请日:2012-10-15
Applicant: Raytheon Company
Inventor: Andrew K. Brown , Thomas L. Obert , Michael J. Sotelo , Darin M. Gritters , Kenneth W. Brown
CPC classification number: H05K1/167 , H05K1/0234 , H05K1/0242 , H05K3/06 , H05K2201/0379 , H05K2201/09263 , H05K2201/09727 , H05K2201/09781
Abstract: An apparatus for conveying an electrical signal includes: a conductive pathway having a conductive material. The conductive material has a first edge and a second edge and is configured to convey the electrical signal. The apparatus also includes a resistive material in contact with at least a portion of the conductive pathway, covering an edge of the conductive pathway, and extending beyond the edge. The resistive material has a conductivity less than the conductivity of the conductive material.
Abstract translation: 用于传送电信号的装置包括:具有导电材料的导电路径。 导电材料具有第一边缘和第二边缘,并且被配置为传送电信号。 该装置还包括与导电路径的至少一部分接触的电阻材料,覆盖导电路径的边缘并且延伸超过边缘。 电阻材料的导电率小于导电材料的导电率。
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