Abstract:
Aspects for adjusting resistive memory write driver strength based on write error rate (WER) are disclosed. In one aspect, a write driver strength control circuit is provided to adjust a write current provided to a resistive memory based on a WER of the resistive memory. The write driver strength control circuit includes a tracking circuit configured to determine the WER of the resistive memory based on write operations performed on resistive memory elements. The write driver strength control circuit includes a write current calculator circuit configured to compare the WER to a target WER that represents the desired yield performance level of the resistive memory. A write current adjust circuit in the write driver strength control circuit is configured to adjust the write current based on this comparison. The write driver strength control circuit adjusts the write current to perform write operations while reducing write errors associated with breakdown voltage.
Abstract:
A one time programming (OTP) apparatus unit cell includes magnetic tunnel junctions (MTJs) with reversed connections for placing the MTJ in an anti-parallel resistance state during programming. Increased MTJ resistance in its anti-parallel resistance state causes a higher programming voltage which reduces programming time and programming current.
Abstract:
A circuit includes a first one-time programmable (OTP) element and a second OTP element. The circuit also includes error detection circuitry coupled to receive a first representation of data from the first OTP element. The circuit further includes output circuitry responsive to an output of the error detection circuitry to output an OTP read result based on the first representation of the data or based on a second representation of the data from the second OTP element.
Abstract:
A device includes a plurality of memory cells of a memory array, a sense amplifier of the memory array, and selection logic of the memory array. The sense amplifier is configured to sense at least one data value from at least one memory cell of the plurality of memory cells. The selection logic is configured to select between causing the sense amplifier to sense the at least one data value using a first sensing delay and causing the sense amplifier to sense the at least one data value using a second sensing delay. The second sensing delay is longer than the first sensing delay.
Abstract:
A particular device includes a resistance-based memory device, a tag random-access memory (RAM), and a bit recovery (BR) memory. The resistance-based memory device is configured to store a data value and error-correcting code (ECC) data associated with the data value. The tag RAM is configured to store information that maps memory addresses of a main memory to wordlines of a cache memory, where the cache memory includes the resistance-based memory device. The BR memory is configured to store additional error correction data associated with the data value, where the BR memory corresponds to a volatile memory device.
Abstract:
A circuit includes a first one-time programmable (OTP) element and a second OTP element. The circuit also includes error detection circuitry coupled to receive a first representation of data from the first OTP element. The circuit further includes output circuitry responsive to an output of the error detection circuitry to output an OTP read result based on the first representation of the data or based on a second representation of the data from the second OTP element.
Abstract:
A memory device is provided including a cell array and a volatile storage device. The cell array may include a plurality of word lines, a plurality of bit lines, wherein a selection of a word line and bit line defines a memory cell address, and a non-volatile reserved word line for storing configuration information for the cell array. The volatile storage device is coupled to the cell array. The configuration information from the non-volatile reserved word line is copied to the volatile storage device upon power-up or initialization of the memory device.
Abstract:
A resistance-based memory includes a two-diode access device. In a particular embodiment, a method includes biasing a bit line with a first voltage. The method further includes biasing the sense line with a second voltage. Biasing the bit line and biasing the sense line generates a current through a resistance-based memory element and through one of a first diode and a second diode. A cathode of the first diode is coupled to the bit line and an anode of the second diode is coupled to the sense line.
Abstract:
Error detection and correction decoding apparatus performs single error correction-double error detection (SEC-DED) or double error correction-triple error detection (DEC-TED) depending on whether the data input contains a single-bit error or a multiple-bit error, to reduce power consumption and latency in case of single-bit errors and to provide powerful error correction in case of multiple-bit errors.
Abstract:
Multi-step programming of heat-sensitive non-volatile memory (NVM) in processor-based systems, and related methods and systems are disclosed. To avoid relying on programmed instructions stored in heat-sensitive NVM during fabrication, wherein the programmed instructions can become corrupted during thermal packaging processes, the NVM is programmed in a multi-step programming process. In a first programming step, a boot loader comprising programming instructions is loaded into the NVM. The boot loader may be loaded into the NVM after the thermal processes during packaging are completed to avoid risking data corruption in the boot loader. Thereafter, the programmed image can be loaded quickly into a NV program memory over the peripheral interface using the boot loader to save programming time and associated costs, as opposed to loading the programmed image using lower transfer rate programming techniques. The processor can execute the program instructions to carry out tasks in the processor-based system.