Abstract:
Various embodiments include methods for implementing flexible ranks in a memory system. Embodiments may include receiving, at a memory controller, a first memory access command and a first address at which to implement the first memory access command in a logical rank, generating, by the memory controller, a first signal configured to indicate to a first memory device of the logical rank to implement the first memory access command via a first partial channel, sending, from the memory controller, the first signal to the first memory device, generating, by the memory controller, a second signal configured to indicate to a second memory device of the logical rank that is different from the first memory device to implement the first memory access command via a second partial channel, and sending, from the memory controller, the second signal to the second memory device.
Abstract:
Methods and apparatuses for to memories using dynamic voltage scaling are presented. The apparatus includes memory configured to communicate with a host. The memory includes a peripheral portion and a memory array. The memory is further configured to receive, from at least one power management circuit, a first supply voltage and a second supply voltage. The memory further includes a switch circuit. The switch circuit is configured to selectively provide the first supply voltage and the second supply voltage to the peripheral portion. The first supply voltage is static and has a first voltage range. The second supply voltage has a low second voltage range and a high second voltage range.
Abstract:
Errors can be introduced when data is transferred over a link between two entities such as between a host and a memory. Link error protection schemes can be implemented to detect and correct errors that occur on the link to enhance transmission reliability. However, these benefits are not without costs since such protection schemes increase both latency and power consumption. In one or more aspects, it is proposed to dynamically adjust the level of link error protection applied to match any change in the operating environment. For example, likelihood of link errors strongly correlates with the link speed. If the link speed is increased, a greater level of link error protection can be applied to counteract the increase in the link errors. If the link speed is decreased, the level of protection can be decreased so that latency and power consumption penalties can be minimized.
Abstract:
A memory having a redundancy area is operated in a normal mode and an error is detected. A selecting selects between in-line repair process and off-line repair. In-line repair applies a short term error correction, which remaps a fail address to a remapped memory area of the memory. An in-system repair is applied, for a one-time programmed remapping of the fail address to a redundancy area of the memory. In-system repair utilizes idle time of the memory to maintain valid memory content.
Abstract:
A clock is distributed to a processor-side base mode clocked transceiver and to a memory-side base mode clocked transceiver, interfacing respective ends of a data lane between a processor and the memory, for duplex communicating over the data lane. Concurrent with the duplex communicating, a bandwidth mode switches between a base bandwidth mode and a scale-up mode. The scale-up mode enables scale-up clock lines that distribute the clock to a processor-side scale-up transceiver and to a memory-side scale-up transceiver, interfacing respective ends of a scale-up data lane between the processor and the memory, for additional duplex communicating over the scale-up data lane. The base bandwidth mode disables the scale-up clock lines, which disables communicating over the scale-up data lane.
Abstract:
A memory controller coupled to a memory chip having a number of sub-arrays of memory cells is configured to determine a configuration of the memory chip. The memory controller is configured to read the sub-array configuration of the memory chip and to detect sub-array level conflicts between external commands and refresh operations. The memory controller keeps one or more non-conflicting pages open during the refresh operations.
Abstract:
Various embodiments include a computing device memory system having a memory device, a memory physical layer communicatively connected to the memory device, a first input/output (IO) voltage supply electrically connected to the memory device and to the memory physical layer, and a second TO voltage supply electrically connected to the memory device and to the memory physical layer, in which the memory device and the physical layer are configured to communicate data of a memory transaction using a 3 level pulse amplitude modulation (PAM) IO scheme.
Abstract:
A memory sub-system may include a memory controller having error correction code (ECC) encoder/decoder logic. The memory controller may be configured to embed link ECC parity bits in unused data mask bits and/or in a mask write data during a mask write operation. The memory controller may also be configured to protect at least a location of the link ECC parity bits during the mask write operation.
Abstract:
A method of reading from and writing to a resistive memory cache includes receiving a write command and dividing the write command into multiple write sub-commands. The method also includes receiving a read command and executing the read command before executing a next write sub-command.
Abstract:
A system for replacing a page stored in system memory when reading the page incurs a multiple-bit error. Upon reading a page in system memory for which a multiple-bit error is detected, backup data in flash memory is loaded into a redundant page in the system memory, and a re-mapper is configured so that future accesses to the page are redirected to the redundant page.