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公开(公告)号：CN102934243A
公开(公告)日：2013-02-13
申请号：CN201180028298.1
申请日：2011-05-27
申请人： 索尼化学&信息部件株式会社
IPC分类号： H01L33/62 , C09J9/02 , C09J11/04 , C09J163/00 , H01L21/60
CPC分类号： H01L24/29 , C08G59/687 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/60 , H01L33/62 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/29101 , H01L2224/2929 , H01L2224/29339 , H01L2224/29386 , H01L2224/29444 , H01L2224/2949 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/81444 , H01L2224/83192 , H01L2224/83203 , H01L2224/8359 , H01L2224/836 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/83664 , H01L2224/83687 , H01L2224/83744 , H01L2224/83755 , H01L2224/83851 , H01L2224/83862 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2224/29298 , H01L2924/00 , H01L2924/053 , H01L2924/00012 , H01L2924/05432 , H01L2224/29318 , H01L2224/29366 , H01L2924/05341 , H01L2924/049
摘要： 一种光反射性各向异性导电浆料，其作为在配线板上倒装芯片安装发光二极管元件(LED)等发光元件来制造发光装置时使用的各向异性导电浆料，在没有在LED上设置导致制造成本增加的光反射层、为了改善发光效率而混合光反射性绝缘颗粒的情况下，可以抑制高温环境下的发光元件与配线板的粘合强度的降低，而且在TCT后还可以抑制导通可靠性的降低，该光反射性各向异性导电浆料是将导电颗粒和光反射性绝缘颗粒分散在热固化性树脂组合物中形成的。热固化性树脂组合物含有环氧化合物和热催化型固化剂。
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公开(公告)号：CN102934243B
公开(公告)日：2018-08-31
申请号：CN201180028298.1
申请日：2011-05-27
申请人： 迪睿合电子材料有限公司
IPC分类号： H01L33/62 , C09J9/02 , C09J11/04 , C09J163/00 , H01L21/60
CPC分类号： H01L24/29 , C08G59/687 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L33/60 , H01L33/62 , H01L2224/13144 , H01L2224/16225 , H01L2224/16238 , H01L2224/29101 , H01L2224/2929 , H01L2224/29339 , H01L2224/29386 , H01L2224/29444 , H01L2224/2949 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/81444 , H01L2224/83192 , H01L2224/83203 , H01L2224/8359 , H01L2224/836 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/83664 , H01L2224/83687 , H01L2224/83744 , H01L2224/83755 , H01L2224/83851 , H01L2224/83862 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/181 , H01L2924/00014 , H01L2224/29298 , H01L2924/00 , H01L2924/053 , H01L2924/00012 , H01L2924/05432 , H01L2224/29318 , H01L2224/29366 , H01L2924/05341 , H01L2924/049
摘要： 一种光反射性各向异性导电浆料，其作为在配线板上倒装芯片安装发光二极管元件(LED)等发光元件来制造发光装置时使用的各向异性导电浆料，在没有在LED上设置导致制造成本增加的光反射层、为了改善发光效率而混合光反射性绝缘颗粒的情况下，可以抑制高温环境下的发光元件与配线板的粘合强度的降低，而且在TCT后还可以抑制导通可靠性的降低，该光反射性各向异性导电浆料是将导电颗粒和光反射性绝缘颗粒分散在热固化性树脂组合物中形成的。热固化性树脂组合物含有环氧化合物和热催化型固化剂。
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公开(公告)号：CN102474988A
公开(公告)日：2012-05-23
申请号：CN201080030708.1
申请日：2010-05-26
申请人： 松下电器产业株式会社
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/98 , H01L2224/0401 , H01L2224/06151 , H01L2224/06155 , H01L2224/131 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17135 , H01L2224/17179 , H01L2224/17505 , H01L2224/17517 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32052 , H01L2224/32225 , H01L2224/33179 , H01L2224/73203 , H01L2224/8114 , H01L2224/81191 , H01L2224/81193 , H01L2224/81194 , H01L2224/8121 , H01L2224/8159 , H01L2224/81599 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81616 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81815 , H01L2224/81855 , H01L2224/81905 , H01L2224/83104 , H01L2224/83136 , H01L2224/83192 , H01L2224/83194 , H01L2224/8321 , H01L2224/8359 , H01L2224/83599 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83616 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83855 , H01L2224/92125 , H01L2224/9221 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01048 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/225 , H05K3/3436 , H05K2203/0425 , H05K2203/176 , Y02P70/613 , Y10T29/49144 , Y10T29/49146 , H01L2924/00014 , H01L2924/01014 , H01L2924/00 , H01L2224/73204 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： 本发明公开了电子元件单元和加强粘合剂，其中电子元件和电路板之间的连接强度增加，并且可执行修理工作而不导致对电子元件或电路板的损坏。具体公开了电子元件单元(1)，其包括：电子元件(2)，在其下表面上提供有多个连接端子(12)；以及电路板(3)，在其上表面上对应于连接端子(12)提供有多个电极(22)，并且通过采用焊料块(23)连接该连接端子(12)到电极(22)并且通过采用树脂连接件(24)部分连接电子元件(2)到电路板(3)而形成，树脂连接件(24)包括由热硬化树脂形成的热硬化树脂材料，其中树脂连接件(24)内以分散的状态包含金属粉(25)。金属粉(25)的熔点低于执行从电路板(3)去除电子元件(2)的工作(修理工作)时加热树脂连接件(24)的温度。
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公开(公告)号：CN107278325A
公开(公告)日：2017-10-20
申请号：CN201580062500.0
申请日：2015-11-18
申请人： 高通技术国际有限公司
发明人： K·坎农
IPC分类号： H01L23/36 , H01L23/367 , H01L23/495 , H01L23/498 , H01L23/552 , H01L21/56 , H01L21/60 , H01L23/488 , H01L23/31
CPC分类号： H01L23/49568 , H01L21/32051 , H01L21/4817 , H01L21/56 , H01L21/568 , H01L23/043 , H01L23/3107 , H01L23/36 , H01L23/3675 , H01L23/3677 , H01L23/49503 , H01L23/49517 , H01L23/49541 , H01L23/49861 , H01L23/552 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/2919 , H01L2224/32245 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83005 , H01L2224/83192 , H01L2224/83439 , H01L2224/83447 , H01L2224/83639 , H01L2224/83647 , H01L2224/85005 , H01L2224/85439 , H01L2224/85447 , H01L2224/85639 , H01L2224/85647 , H01L2224/92247 , H01L2924/00014 , H01L2924/01047 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： 集成电路封装包括：半导体管芯；引线框架，其位于第一平面中；至少一个导电柱结构，其从所述第一平面向外延伸，其中所述引线框架和所述至少一个导电柱结构由烧结导电材料形成；封装材料，其封装所述半导体管芯、所述引线框架和所述至少一个导电柱结构；导电层，其位于所述封装的上表面上，所述导电层导电连接到所述至少一个导电柱。还公开了制造方法。
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公开(公告)号：CN102686021B
公开(公告)日：2014-12-31
申请号：CN201210016743.9
申请日：2012-01-18
申请人： 纳普拉有限公司
IPC分类号： H05K1/09 , H01L23/522 , H01L31/02 , H01L33/62
CPC分类号： H05K1/097 , H01L23/49866 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L31/022425 , H01L31/0682 , H01L33/62 , H01L2224/16145 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/81191 , H01L2224/81193 , H01L2224/81395 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/8359 , H01L2224/83605 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83618 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/8366 , H01L2224/83666 , H01L2224/83669 , H01L2224/83701 , H01L2224/83799 , H01L2224/83815 , H01L2224/83825 , H01L2224/83851 , H01L2224/83886 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/01327 , H01L2924/12041 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H05K1/111 , H05K2201/0338 , H05K2201/099 , Y02E10/547 , Y02P70/611 , H01L2924/00 , H01L2224/8159 , H01L2924/00014 , H01L2224/81799 , H01L2924/00012 , H01L2224/81639 , H01L2224/81647 , H01L2224/81644 , H01L2224/81669 , H01L2224/81666 , H01L2224/81624 , H01L2224/81618 , H01L2224/8166 , H01L2224/81655 , H01L2224/81611 , H01L2224/81609 , H01L2224/81613 , H01L2224/81605 , H01L2224/29075
摘要： 提供一种电子设备，具有导电性、电气化学的稳定性、耐氧化性、填充性、细致性、机械及物理强度良好，而且对基板的粘接力、粘附力高的高品质、高可靠性的金属化布线。基板(11)具备具有规定的图形的金属化布线(12)。金属化布线(12)包括金属化层(121)和绝缘层(122)。金属化层(121)包含高熔点金属成分和低熔点金属成分，高熔点金属成分以及低熔点金属成分相互扩散接合。绝缘层(122)与金属化层(121)同时形成，覆盖金属化层(121)的外面。电子部件(14)与金属化布线(12)的金属化层(121)电连接。
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公开(公告)号：CN102474988B
公开(公告)日：2015-01-14
申请号：CN201080030708.1
申请日：2010-05-26
申请人： 松下电器产业株式会社
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/98 , H01L2224/0401 , H01L2224/06151 , H01L2224/06155 , H01L2224/131 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17135 , H01L2224/17179 , H01L2224/17505 , H01L2224/17517 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32052 , H01L2224/32225 , H01L2224/33179 , H01L2224/73203 , H01L2224/8114 , H01L2224/81191 , H01L2224/81193 , H01L2224/81194 , H01L2224/8121 , H01L2224/8159 , H01L2224/81599 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81616 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81815 , H01L2224/81855 , H01L2224/81905 , H01L2224/83104 , H01L2224/83136 , H01L2224/83192 , H01L2224/83194 , H01L2224/8321 , H01L2224/8359 , H01L2224/83599 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83616 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83855 , H01L2224/92125 , H01L2224/9221 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01048 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/225 , H05K3/3436 , H05K2203/0425 , H05K2203/176 , Y02P70/613 , Y10T29/49144 , Y10T29/49146 , H01L2924/00014 , H01L2924/01014 , H01L2924/00 , H01L2224/73204 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： 本发明公开了电子元件单元和加强粘合剂，其中电子元件和电路板之间的连接强度增加，并且可执行修理工作而不导致对电子元件或电路板的损坏。具体公开了电子元件单元(1)，其包括：电子元件(2)，在其下表面上提供有多个连接端子(12)；以及电路板(3)，在其上表面上对应于连接端子(12)提供有多个电极(22)，并且通过采用焊料块(23)连接该连接端子(12)到电极(22)并且通过采用树脂连接件(24)部分连接电子元件(2)到电路板(3)而形成，树脂连接件(24)包括由热硬化树脂形成的热硬化树脂材料，其中树脂连接件(24)内以分散的状态包含金属粉(25)。金属粉(25)的熔点低于执行从电路板(3)去除电子元件(2)的工作(修理工作)时加热树脂连接件(24)的温度。
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公开(公告)号：CN102686021A
公开(公告)日：2012-09-19
申请号：CN201210016743.9
申请日：2012-01-18
申请人： 纳普拉有限公司
IPC分类号： H05K1/09 , H01L23/522 , H01L31/02 , H01L33/62
CPC分类号： H05K1/097 , H01L23/49866 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L31/022425 , H01L31/0682 , H01L33/62 , H01L2224/16145 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/81191 , H01L2224/81193 , H01L2224/81395 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/8359 , H01L2224/83605 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83618 , H01L2224/83624 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83655 , H01L2224/8366 , H01L2224/83666 , H01L2224/83669 , H01L2224/83701 , H01L2224/83799 , H01L2224/83815 , H01L2224/83825 , H01L2224/83851 , H01L2224/83886 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/00011 , H01L2924/01327 , H01L2924/12041 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H05K1/111 , H05K2201/0338 , H05K2201/099 , Y02E10/547 , Y02P70/611 , H01L2924/00 , H01L2224/8159 , H01L2924/00014 , H01L2224/81799 , H01L2924/00012 , H01L2224/81639 , H01L2224/81647 , H01L2224/81644 , H01L2224/81669 , H01L2224/81666 , H01L2224/81624 , H01L2224/81618 , H01L2224/8166 , H01L2224/81655 , H01L2224/81611 , H01L2224/81609 , H01L2224/81613 , H01L2224/81605 , H01L2224/29075
摘要： 提供一种电子设备，具有导电性、电气化学的稳定性、耐氧化性、填充性、细致性、机械及物理强度良好，而且对基板的粘接力、粘附力高的高品质、高可靠性的金属化布线。基板(11)具备具有规定的图形的金属化布线(12)。金属化布线(12)包括金属化层(121)和绝缘层(122)。金属化层(121)包含高熔点金属成分和低熔点金属成分，高熔点金属成分以及低熔点金属成分相互扩散接合。绝缘层(122)与金属化层(121)同时形成，覆盖金属化层(121)的外面。电子部件(14)与金属化布线(12)的金属化层(121)电连接。
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