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    POLYMER, RESIN COMPOSITION AND RESIN MOLDED PRODUCT
    6.
    发明申请
    POLYMER, RESIN COMPOSITION AND RESIN MOLDED PRODUCT 审中-公开

    公开(公告)号：US20180009938A1

    公开(公告)日：2018-01-11

    申请号：US15709544

    申请日：2017-09-20

    Applicant: JSR CORPORATION

    Inventor： Shoma ANABUKI ,  Ryoyu HIFUMI ,  Ryoji TATARA ,  Toshiaki KADOTA ,  Nobuyuki MIYAKI ,  Kazuki HATASE

    IPC: C08G63/19 ,  C08G63/199

    Abstract: The polymer includes a first structural unit represented by formula (1), a second structural unit represented by formula (2), and a third structural unit represented by formula (3). R1, R2, R10 and R11 each independently represent a halogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms, a nitro group or a cyano group; R3A, R3B R4A and R4B each independently represent a methylene group or an alkylene group having 2 to 4 carbon atoms; ZA to ZD each independently represent —O— or —S—; and L represents a divalent group represented by formula (3-1) or (3-2), wherein Ra represents a divalent alicyclic hydrocarbon group having 5 to 30 ring atoms or a divalent fluorinated alicyclic hydrocarbon group having 5 to 30 ring atoms.

    THERMOPLASTIC RESIN WITH HIGH THERMAL CONDUCTIVITY
    8.
    发明申请
    THERMOPLASTIC RESIN WITH HIGH THERMAL CONDUCTIVITY 有权
    具有高导热性的热塑性树脂

    公开(公告)号：US20130043425A1

    公开(公告)日：2013-02-21

    申请号：US13641964

    申请日：2011-04-14

    Applicant: Shusuke Yoshihara ,  Toshiaki Ezaki ,  Kazuaki Matsumoto

    Inventor： Shusuke Yoshihara ,  Toshiaki Ezaki ,  Kazuaki Matsumoto

    IPC: C08G63/16 ,  C09K5/00 ,  C08G63/181 ,  C08G63/19 ,  C08G63/02

    CPC classification number: C08G63/185 ,  C08K3/28 ,  C08L67/00

    Abstract: Provided is a thermoplastic resin which (A) remarkably improves thermal conductivity of a resin composition when a thermally conductive filler is added and (B) can be injection-molded even by use of a general injection-molding die.The thermoplastic resin is a resin wherein: a main chain which mainly has a specific repeating unit; and 60 mol % or more ends of molecular chains are carboxyl groups.

    Abstract translation: 本发明提供一种热塑性树脂，其特征在于，（A）在加入导热性填料时显着提高树脂组合物的导热性，（B）也可以通过使用一般的注塑成形模而进行注塑成型。 热塑性树脂是其中：主链主要具有特定重复单元的树脂; 并且分子链的60mol％以上的末端是羧基。

    AROMATIC POLYESTER
    9.
    发明申请
    AROMATIC POLYESTER 失效
    芳香聚酯

    公开(公告)号：US20110092662A1

    公开(公告)日：2011-04-21

    申请号：US12871213

    申请日：2010-08-30

    Applicant: Masayoshi TABATA ,  Takayoshi Yamazaki

    Inventor： Masayoshi TABATA ,  Takayoshi Yamazaki

    IPC: C08G63/19

    CPC classification number: C08G63/193 ,  C08G63/195 ,  Y10T428/31504 ,  Y10T428/31507

    Abstract: There is provided an aromatic polyester suitable for optical applications, which has not only high heat resistance and transparency, but also enhanced fluidity at a relatively low molding temperature of less than 300° C. despite its high molecular weight to be substantially colorless after the molding process. The aromatic polyester of the present invention comprises polyhydric phenol residues and residues of aromatic polycarboxylic acid, acid halide or acid anhydride thereof; wherein the polyhydric phenol residues comprise polyhydric phenol residues represented by Formula (I): —O—Ar—W1x—Ar—O— and/or Formula (II): —O—Ar—O—, and bulky polyhydric phenol residues represented by Formula (III): —O—Ar—W2—Ar—O—; wherein the molar ratio of the polyhydric phenol residues represented by Formula (I) and/or Formula (II) to the polyhydric phenol residues represented by Formula (III) is in the range of 100:0 to 30:70 (exclusive of 100:0).

    Abstract translation: 提供了适用于光学应用的芳族聚酯，其不仅具有高耐热性和透明性，而且在低于300℃的相对较低的成型温度下也提高了流动性，尽管其成型后其高分子量基本上无色 处理。 本发明的芳族聚酯包括多元酚残基和芳族多元羧酸，酰卤或其酸酐的残基; 其中所述多元酚残基包括由式（I）表示的多元酚残基：-O-Ar-W1x-Ar-O-和/或式（II）：-O-Ar-O-，和大体积多元酚残基 式（III）：-O-Ar-W2-Ar-O-; 其中由式（I）和/或式（II）表示的多元酚残基与由式（III）表示的多元酚残基的摩尔比在100:0至30:70（不包括100： 0）。

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