公开(公告)号：US20240092963A1

公开(公告)日：2024-03-21

申请号：US18091307

申请日：2022-12-29

申请人： AAC Technologies (Nanjing) Co., Ltd.

发明人： Hongyuan Wang ,  Yilan Zhang ,  Rui Pan ,  Hezhi Wang

IPC分类号： C08G14/06 ,  B32B7/12 ,  B32B15/01 ,  B32B15/20 ,  C08G59/24 ,  C08G59/28 ,  C08G73/10 ,  C08G73/12

CPC分类号： C08G14/06 ,  B32B7/12 ,  B32B15/01 ,  B32B15/20 ,  C08G59/245 ,  C08G59/28 ,  C08G73/1021 ,  C08G73/12 ,  B32B2311/12 ,  B32B2457/08

摘要： This application provides a resin composition and an adhesive. The resin composition is composed of benzoxazine and a resin. The benzoxazine is synthesized from a primary amine-capped flexible polyimide oligomer, an aldehyde and a monofunctional phenolic compound. The resin contains one or more of an epoxy resin, a maleimide resin, and a cyanate ester resin containing two or more functional groups. The resin is 0.1%-70% by weight of the benzoxazine.

公开(公告)号：US20240026067A1

公开(公告)日：2024-01-25

申请号：US18254759

申请日：2021-11-26

申请人： Paul JONES

发明人： Paul JONES

IPC分类号： C08G59/62 ,  C08G59/08 ,  C08G59/14 ,  C08G59/68 ,  C08G14/06

CPC分类号： C08G59/623 ,  C08G59/08 ,  C08G59/1438 ,  C08G59/1477 ,  C08G59/688 ,  C08G14/06

摘要： The present invention relates to a polymeric Mannich base useful as an epoxy curative and/or accelerator, which has an improved safety profile due to the avoidance of the use of phenol in its preparation. More specifically, the present invention provides a method for forming a polymeric Mannich base, as well polymeric Mannich bases preparable by the method, for use as an epoxy resin curative and/or accelerator, said method comprising: i) providing: a) a polymer comprising aromatic terminal groups linked by a hydrocarbyl polymeric backbone, wherein each of the aromatic terminal groups comprises a ring substituted with at least one activating group and at least one unsubstituted ring atom, wherein the one or more activating groups is capable of activating the aromatic terminal group to undergo electrophilic aromatic 15 substitution at the at least one unsubstituted ring atom; wherein the aromatic terminal groups are bonded to the hydrocarbyl polymeric backbone through an ether, ester, amine, amide, thioether, or thioester group; b) a primary or secondary monoamine and/or a polyamine comprising primary and/or secondary amino groups, and c) an aldehyde; and ii) performing a Mannich reaction using components a) to c), wherein each aromatic terminal group of the polymer is converted to a Mannich base.

公开(公告)号：US11566106B2

公开(公告)日：2023-01-31

申请号：US16891021

申请日：2020-06-02

申请人： Cytec Industries Inc.

发明人： Mark Edward Harriman ,  Paul Mark Cross ,  Ram B. Gupta

IPC分类号： B29C43/00 ,  C08K5/357 ,  C08G73/02 ,  C08J5/18 ,  C08J5/24 ,  C08L61/34 ,  C08G14/06 ,  C07D265/16 ,  C08J5/04 ,  B29C39/00

摘要： A curable composition containing more than 80% by weight of a blend of benzoxazines, wherein the blend includes (A) one or more multifunctional benzoxazines and (B) a liquid, non-halogenated monofunctional benzoxazine. This composition has been found to be stable at high temperatures, e.g. 180° C.-250° C., and suitable for making composite materials using conventional techniques such as prepregging and liquid resin infusion.

公开(公告)号：US11242427B2

公开(公告)日：2022-02-08

申请号：US14887353

申请日：2015-10-20

申请人： PPG Industries Ohio, Inc.

发明人： Masayuki Nakajima ,  Hongying Zhou ,  Tien-Chieh Chao ,  Shanti Swarup

IPC分类号： C08G8/10 ,  C09J161/06 ,  C08G8/28 ,  C08K5/17 ,  C08L61/14 ,  C08G14/06 ,  C08L61/34 ,  C09J161/14 ,  C09J161/34 ,  C09J163/00 ,  C08L63/00 ,  C08G59/62 ,  C08L9/00 ,  C08L61/06 ,  C09J5/06 ,  C09J109/00

摘要： An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.

公开(公告)号：US10882955B2

公开(公告)日：2021-01-05

申请号：US15574882

申请日：2016-05-13

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Gregory P. Sorenson ,  Ilya Gorodisher

IPC分类号： C08L79/04 ,  C08G73/00 ,  C08G73/06 ,  C08G73/02 ,  C08G14/06 ,  C08J5/18 ,  C08L63/00

摘要： A process of preparing polybenzoxazines using an alkylammonium salt of an acid having a pKa in acetonitrile of 9 or more as catalyst is described.

公开(公告)号：US10556991B2

公开(公告)日：2020-02-11

申请号：US15772108

申请日：2016-12-05

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Benjamin J. Anderson ,  Gregory P. Sorenson ,  Ilya Gorodisher

IPC分类号： C08K5/315 ,  C08G73/06 ,  C08G14/06 ,  C08L79/04 ,  C08L79/02

摘要： A resin blend is provided including a blend of a benzoxazine resin and a phthalonitrile resin. The benzoxazine/phthalonitrile resin blends prior to cure have more favorable processing and curing properties compared to the phthalonitrile resins alone, enabling greater ease in manufacturing.

公开(公告)号：US10189988B2

公开(公告)日：2019-01-29

申请号：US15511324

申请日：2014-12-10

申请人： ZHUHAI EPOXY BASE ELECTRONIC MATERIAL CO., LTD.

发明人： Yongguang Wu ,  Renzong Lin ,  Huangming Song

IPC分类号： B32B15/092 ,  C08L63/00 ,  C08L63/04 ,  B32B37/06 ,  B32B37/10 ,  B32B37/12 ,  C08G59/06 ,  C08G59/30 ,  C08G59/50 ,  C08G59/56 ,  C08G59/62 ,  C08G59/68 ,  C08J5/04 ,  C08J5/10 ,  C08J5/24 ,  H05K3/46 ,  B32B37/15 ,  C08L63/06 ,  H05K1/03 ,  B32B27/26 ,  B32B27/38 ,  C08L63/02 ,  C08L61/06 ,  C08G14/06 ,  C08L61/34 ,  B32B38/16

摘要： A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≥500V), high heat resistance (Tg≥150° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

公开(公告)号：US20180243938A1

公开(公告)日：2018-08-30

申请号：US15904811

申请日：2018-02-26

申请人： AVALON Industries AG

发明人： Francois BADOUX ,  Stefan KRAWIELITZKI ,  Mariangela MORTATO ,  Reto FREI ,  Marie-Christine LAGEL ,  Christopher HOLMES

IPC分类号： B27N3/00 ,  C08G14/06 ,  C08J5/04 ,  C08K5/21 ,  C08K5/3492 ,  C08K5/405 ,  C07D307/48

摘要： A process for the manufacture of wood composite materials includes the steps of: preparation of a thermally curable resin by reacting a polycondensation-capable phenolic compound and/or an amino plastic forming agent with 5-hydroxymethylfurfural (HMF) under conditions leading to the formation of polycondensation products, bringing the resin into contact with lignocellulose-containing material, and curing the resin with formation of the wood composite material. The 5-hydroxymethylfurfural includes at least one HMF oligomer. Further, wood composite materials are obtainable by the process.

公开(公告)号：US20180030264A1

公开(公告)日：2018-02-01

申请号：US15554858

申请日：2016-03-04

申请人： Huntsman Advanced Materials Americas LLC

发明人： Dong Wang ,  Bradley Rechichar ,  Derek S. Kincaid ,  Ronald C. Smith

IPC分类号： C08L61/34 ,  C08G14/06 ,  C09D161/34 ,  C08J5/24 ,  C07D265/16 ,  C09J161/34

CPC分类号： C08L61/34 ,  C07D265/14 ,  C07D265/16 ,  C07D413/14 ,  C08G14/06 ,  C08G73/22 ,  C08J5/04 ,  C08J5/043 ,  C08J5/24 ,  C08J2361/34 ,  C08J2379/00 ,  C08J2461/06 ,  C08J2463/04 ,  C08K5/34 ,  C08L61/06 ,  C08L2201/08 ,  C09D161/06 ,  C09D161/34 ,  C09J161/06 ,  C09J161/34 ,  C09J2461/00 ,  C09J2463/00

摘要： The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130°-140° C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.

公开(公告)号：US09878923B1

公开(公告)日：2018-01-30

申请号：US15712697

申请日：2017-09-22

申请人： King Fahd University of Petroleum and Minerals

发明人： Othman Charles Sadeq Al Hamouz ,  Tawfik Abdo Saleh Awadh

IPC分类号： C08G14/00 ,  C02F1/28 ,  C08G14/06 ,  B01J41/13 ,  C02F101/20

CPC分类号： C02F1/285 ,  B01J41/13 ,  C02F2101/20 ,  C08G14/00 ,  C08G14/06

摘要： A cross-linked terpolymer (BSDF) obtained by polycondensation of bisphenol-S, formaldehyde and 1,6-diammohexane. The terpolymer is highly efficient in eliminating lead ions from aqueous solutions. The adsorption of lead ions on BSDF was studied under different conditions such as: pH, contact time and temperature. The adsorption kinetics fits Lagergren second order kinetic model that are in agreement with the low surface area as a chemisorption process. Applying BSDF on non-spiked and spiked real wastewater samples under optimum conditions revealed the high efficiency of BSDF in removing toxic metal ions.