公开(公告)号：US10189988B2

公开(公告)日：2019-01-29

申请号：US15511324

申请日：2014-12-10

申请人： ZHUHAI EPOXY BASE ELECTRONIC MATERIAL CO., LTD.

发明人： Yongguang Wu ,  Renzong Lin ,  Huangming Song

IPC分类号： B32B15/092 ,  C08L63/00 ,  C08L63/04 ,  B32B37/06 ,  B32B37/10 ,  B32B37/12 ,  C08G59/06 ,  C08G59/30 ,  C08G59/50 ,  C08G59/56 ,  C08G59/62 ,  C08G59/68 ,  C08J5/04 ,  C08J5/10 ,  C08J5/24 ,  H05K3/46 ,  B32B37/15 ,  C08L63/06 ,  H05K1/03 ,  B32B27/26 ,  B32B27/38 ,  C08L63/02 ,  C08L61/06 ,  C08G14/06 ,  C08L61/34 ,  B32B38/16

摘要： A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≥500V), high heat resistance (Tg≥150° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.

公开(公告)号：US20170292018A1

公开(公告)日：2017-10-12

申请号：US15511324

申请日：2014-12-10

申请人： ZHUHAI EPOXY BASE ELECTRONIC MATERIAL CO., LTD.

发明人： YONGGUANG WU ,  Renzong Lin ,  Huangming Song

IPC分类号： C08L63/00 ,  C08G59/06 ,  C08G59/50 ,  C08G59/56 ,  C08G59/62 ,  H05K3/46 ,  C08J5/24 ,  C08J5/04 ,  C08J5/10 ,  B32B37/06 ,  B32B37/10 ,  B32B37/12 ,  C08G59/30 ,  C08G59/68

CPC分类号： C08L63/00 ,  B32B37/06 ,  B32B37/10 ,  B32B37/12 ,  B32B37/15 ,  B32B2038/168 ,  B32B2305/076 ,  B32B2305/18 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2457/08 ,  C08G14/06 ,  C08G59/063 ,  C08G59/304 ,  C08G59/5046 ,  C08G59/56 ,  C08G59/621 ,  C08G59/686 ,  C08G59/688 ,  C08J5/043 ,  C08J5/10 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2363/08 ,  C08J2363/10 ,  C08L61/06 ,  C08L61/34 ,  C08L63/04 ,  C08L63/06 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/05 ,  H05K1/0326 ,  H05K1/0353 ,  H05K3/4611 ,  H05K2201/012 ,  H05K2201/0209

摘要： A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on.