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公开(公告)号：US12119577B2
公开(公告)日：2024-10-15
申请号：US17708006
申请日：2022-03-30
Applicant: TE Connectivity Solutions GmbH
Inventor： Randall Robert Henry , Brandon Michael Matthews
CPC classification number: H01R12/714 , G06F1/183 , H01R12/53 , H01R13/512 , H05K1/119 , H05K1/18 , H05K2201/09027 , H05K2201/09063 , H05K2201/09081 , H05K2201/10356
Abstract: A cable connector module includes a cable card assembly including a circuit card, cables terminated to the circuit card, and a cable holder coupled to the circuit card and holding the cables relative to the circuit card. The cables include cable conductors electrically connected to corresponding cable contacts of the circuit card. The cable holder holds each of the contacts and includes a connecting tab coupled to the circuit card. The circuit card includes front and rear retaining tabs. The cable connector module includes a connector shell having a cavity that receives the cable card assembly. The connector shell includes a front retainer at the front receiving the front retaining tab to hold the front of the circuit card relative to the connector shell. The connector shell includes a rear retainer at the rear receiving the rear retaining tab to hold the rear of the circuit card relative to the connector shell.
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公开(公告)号：US20240222250A1
公开(公告)日：2024-07-04
申请号：US18310985
申请日：2023-05-02
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Jun-Hao FENG , You-Chen LIN
IPC: H01L23/498 , H01L21/48 , H05K1/11 , H05K3/46
CPC classification number: H01L23/49827 , H01L21/486 , H05K1/119 , H05K3/4602 , H01L25/0655
Abstract: An electronic package is provided, in which a conductive structure and a reinforced insulation portion are bonded to a dielectric layer, and the reinforced insulation portion is in contact with and abuts against the conductive structure, such that the reinforced insulation portion can support the conductive structure to prevent the conductive structure from cracking when an electronic structure is disposed on the dielectric layer and electrically connected to the conductive structure.
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3.发明公开公开(公告)号：US20240164024A1
公开(公告)日：2024-05-16
申请号：US18504725
申请日：2023-11-08
Applicant: NITTO DENKO CORPORATION
Inventor： Ikuya HASHIMOTO , Ryosuke SASAOKA , Naoki SHIBATA
Abstract: A method for producing a wiring circuit board includes a region setting step of setting a pattern forming region and an opening forming region in a support layer; an insulating layer forming step of forming a base insulating layer on the support layer in the pattern forming region; a pattern step of forming a conductive pattern having a first conductive layer and a second conductive layer on the base insulating layer; and an etching step of etching the support layer in the opening forming region, and in the pattern step, a dummy pattern is formed in the opening forming region.
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公开(公告)号：US11935681B2
公开(公告)日：2024-03-19
申请号：US18057692
申请日：2022-11-21
Applicant: Navitas Semiconductor Limited
IPC: H02J7/06 , B60L53/20 , B60L53/22 , H01F27/22 , H01F27/26 , H01F27/30 , H02M1/42 , H02M1/44 , H02M3/22 , H02M7/00 , H02M7/66 , H05K1/02 , H05K1/11 , H05K1/18
CPC classification number: H01F27/263 , B60L53/22 , H01F27/22 , H01F27/306 , H02M1/4208 , H02M1/44 , H02M3/22 , H02M7/003 , H02M7/66 , H05K1/0204 , H05K1/0207 , H05K1/119 , H05K1/181 , B60L2210/30 , B60L2210/40
Abstract: A power converter comprises a chassis and an AC connector, a low-voltage DC connector and a high-voltage DC connector at an exterior surface of the chassis. An AC-DC converter circuit is positioned at least partially within the chassis and is coupled to the AC connector. A first converter circuit is positioned at least partially within the chassis and is coupled to the AC-DC converter circuit and to a high-voltage DC bus. The high-voltage DC bus is connected to the high-voltage DC connector. A second converter circuit is positioned at least partially within the chassis and is coupled to the high-voltage DC bus to a low-voltage DC bus. The low-voltage DC bus is connected to the low-voltage DC connector.
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公开(公告)号：US20230328887A1
公开(公告)日：2023-10-12
申请号：US18131984
申请日：2023-04-07
Applicant: DONGWOO FINE-CHEM CO., LTD.
Inventor： Na Yeon KIM , Dae Kyu KIM , Han Sub RYU
Abstract: An antenna structure according to an embodiment includes an antenna device, a circuit board connected to the antenna device and including an inner insulation layer, and an outer insulation layer formed on the antenna device to cover the antenna unit and a portion of the circuit board. A portion of the inner insulation layer covered by the outer insulation layer may have a smaller thickness than a thickness of a portion of the inner insulation layer not covered by the outer insulation layer.
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Patent Agency Ranking
公开(公告)号：US20230319998A1
公开(公告)日：2023-10-05
申请号：US17981847
申请日：2022-11-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： SOOJAE PARK
CPC classification number: H05K1/186 , H01G4/01 , H01G4/012 , H01G4/28 , H01G4/38 , H01L24/16 , H01L25/16 , H05K1/119 , H05K1/181 , H05K1/183 , H01L23/3128 , H05K2201/09036 , H05K2201/09472 , H05K2201/10015 , H05K2201/10378 , H05K2201/10545 , H05K2201/10583
Abstract: A wiring board includes an insulating layer having a first surface and a second surface, which are opposite to each other, upper wiring patterns on the first surface of the insulating layer, lower wiring patterns on the second surface of the insulating layer, intermediate wiring patterns, which are disposed in the insulating layer and are electrically connected to the upper wiring patterns and the lower wiring patterns, and a capacitor wire connected to corresponding wiring patterns of the upper wiring patterns, the lower wiring patterns, and the intermediate wiring patterns. The capacitor wire includes a core electrode line having a wire shape, an outer electrode line covering at least a portion of the core electrode line, and a dielectric line interposed between the core electrode line and the outer electrode line.
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公开(公告)号：US11770896B2
公开(公告)日：2023-09-26
申请号：US17760259
申请日：2021-02-04
Applicant: HARTING AG
Inventor： Thomas Hess
CPC classification number: H05K1/119 , H05K1/141 , H05K3/341 , H05K2201/09118 , H05K2201/10568
Abstract: Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.
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公开(公告)号：US20230247767A1
公开(公告)日：2023-08-03
申请号：US17592452
申请日：2022-02-03
Inventor： Jinglin Xu , Paul Lambkin , Ramji Lakshmanan , Baoxing Chen
CPC classification number: H05K1/185 , H01L23/66 , H01L23/642 , H04L25/0266 , H05K1/119
Abstract: Isolators for high frequency signals transmitted between two circuits configured to operate at different voltage domains are provided. The isolators may include resonators capable of operating at high frequencies with high bandwidth, high transfer efficiency, high isolation rating, and a small substrate footprint. In some embodiments, the isolators may operate at a frequency not less than 30 GHz, not less than 60 GHz, or between 20 GHz and 200 GHz, including any value or range of values within such range. The isolators may include isolator components galvanically isolated from and capacitively coupled to each other. The sizes and shapes of the isolator components may be configured to control the values of equivalent inductances and capacitances of the isolators to facilitate resonance in operation. The isolators are compatible to different fabrication processes including, for example, micro-fabrication and PCB manufacture processes.
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公开(公告)号：US20230199961A1
公开(公告)日：2023-06-22
申请号：US17702814
申请日：2022-03-24
Applicant: Industrial Technology Research Institute
Inventor： Yu-Lin Hsu , Kuan-Chu Wu , Ting-Yu Ke , Min-Hsiung Liang , Yu-Ming Peng
IPC: H05K1/11 , H01L23/538 , H01L23/13 , H05K3/00 , H01L21/48
CPC classification number: H05K1/119 , H01L23/5386 , H01L23/13 , H05K3/0014 , H01L21/4846 , H05K2201/09018 , H05K2201/09118 , H01L23/3121
Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.
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公开(公告)号：US20230164919A1
公开(公告)日：2023-05-25
申请号：US18094506
申请日：2023-01-09
Applicant: QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD , Avary Holding (Shenzhen) Co., Limited.
Inventor： SHI-JIE ZHONG
CPC classification number: H05K1/147 , H05K1/119 , H05K3/36 , H05K2201/09063 , H05K2201/091
Abstract: A circuit board assembly includes a first circuit board and a second circuit board. The first circuit board includes a first contact pad and defines a stamped protrusion being correspondingly positioned relative to a position of the first contact pad, the first contact pad being outside the stamped protrusion. The second circuit board includes a second contact pad. The first contact pad on the stamping protrusion is in contact with the second contact pad to achieve electronic connections between the first circuit board and the second circuit board. A method for manufacturing the circuit board assembly is further disclosed.
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