公开(公告)号：US11923824B2

公开(公告)日：2024-03-05

申请号：US17930348

申请日：2022-09-07

申请人： Skyworks Solutions, Inc.

发明人： Joshua James Caron

IPC分类号： H03H9/02 ,  H03H3/08 ,  H03H9/25 ,  H03H9/64 ,  H03H9/72

CPC分类号： H03H9/02905 ,  H03H3/08 ,  H03H9/02559 ,  H03H9/02614 ,  H03H9/25 ,  H03H9/6483 ,  H03H9/725

摘要： Embodiments of this disclosure relate to reducing coupling between acoustic wave resonators. An isolation region of a substrate can be located between acoustic wave resonators. The isolation region can reduce capacitive coupling through the substrate between the acoustic wave resonators. In certain embodiments, the isolation region can be located between acoustic wave resonators of different filters to thereby increase isolation between the filters.

公开(公告)号：US11764752B2

公开(公告)日：2023-09-19

申请号：US16218526

申请日：2018-12-13

申请人： Murata Manufacturing Co., Ltd.

发明人： Masatoshi Nakagawa

IPC分类号： H03H9/02 ,  H03H9/10 ,  H03H9/05 ,  H01L23/00

CPC分类号： H03H9/02905 ,  H01L24/05 ,  H01L24/97 ,  H03H9/02834 ,  H03H9/02866 ,  H03H9/059 ,  H03H9/1085 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0568 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13101 ,  H01L2224/13144 ,  H01L2224/81444 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/10157 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05669 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05664 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/05671 ,  H01L2924/00014 ,  H01L2224/0568 ,  H01L2924/00014 ,  H01L2224/05684 ,  H01L2924/00014 ,  H01L2224/81444 ,  H01L2924/00014 ,  H01L2224/13144 ,  H01L2924/00014 ,  H01L2224/13101 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012

摘要： An elastic wave device includes an elastic wave element chip, a bump electrically connected to the elastic wave element chip, a package substrate including an electrode bonded to the bump, the elastic wave element chip mounted on the package substrate with the bump, and a sealing resin portion covering the elastic wave element chip on the package substrate. A space surrounded by the elastic wave element chip, the package substrate, and the sealing resin portion is provided. The elastic wave element chip includes a substrate having piezoelectricity, an interdigital transducer electrode, and a pad electrode. A first main surface of the substrate having piezoelectricity includes a first region and a second region closer to a second main surface than the first region. The interdigital transducer electrode is disposed in the first region. The pad electrode is disposed in the second region and bonded to the bump.

公开(公告)号：US20150270824A1

公开(公告)日：2015-09-24

申请号：US14434370

申请日：2013-11-06

申请人： EPCOS AG

发明人： Wolfgang Sauer ,  Thomas Kauschke ,  Thomas Bauer

IPC分类号： H03H9/02 ,  H03H3/02 ,  H03H3/08 ,  H03H9/25

CPC分类号： H03H9/02905 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02559 ,  H03H9/02818 ,  H03H9/14541 ,  H03H9/25 ,  H03H9/725 ,  Y10T29/42

摘要： An electroacoustic component is specified in which the disturbing contributions of undesired wave modes are reduced. For this purpose, a component comprises includes a piezo layer, an electrode layer and a separating layer. A main mode and a secondary mode are capable of propagation in the component. The separating layer has an opposite thickness dependence for the frequencies of the main mode and of the secondary mode.

摘要翻译： 规定了一种电声分量，其中不期望的波模的干扰贡献减小。 为此，组件包括压电层，电极层和分离层。 主模式和次模式能够在组件中传播。 分离层对于主模式和次模式的频率具有相反的厚度依赖性。

公开(公告)号：US20170149410A1

公开(公告)日：2017-05-25

申请号：US15290098

申请日：2016-10-11

申请人： Murata Manufacturing Co., Ltd.

发明人： Yohei KONAKA

IPC分类号： H03H9/56 ,  H03H9/70

CPC分类号： H03H9/6433 ,  H03H9/02905 ,  H03H9/02992 ,  H03H9/56 ,  H03H9/6473 ,  H03H9/6476 ,  H03H9/6489 ,  H03H9/70 ,  H03H9/725

摘要： An elastic wave device includes first and second longitudinally coupled resonator elastic wave elements aligned on a piezoelectric substrate. A second reflector of the first longitudinally coupled resonator elastic wave element and a third reflector of the second longitudinally coupled resonator elastic wave element are adjacent to each other in an elastic wave propagation direction. A ground interconnection extends in a direction intersecting with the elastic wave propagation direction and in a region between the second reflector and the third reflector. A gap in one portion of the ground interconnection includes a different acoustic velocity portion where an acoustic velocity is different from an acoustic velocity in another portion of the ground interconnection.

公开(公告)号：US09621127B2

公开(公告)日：2017-04-11

申请号：US14662285

申请日：2015-03-19

申请人： Murata Manufacturing Co., Ltd.

发明人： Kenji Inate

IPC分类号： H03H9/05 ,  H03H9/72 ,  H03H3/08 ,  H03H9/02 ,  H03H9/10 ,  H01L41/047 ,  H01L41/25 ,  H03H9/205

CPC分类号： H03H9/02905 ,  H01L41/0472 ,  H01L41/25 ,  H01L2224/16225 ,  H01L2924/181 ,  H03H3/08 ,  H03H9/02874 ,  H03H9/02913 ,  H03H9/02992 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/1085 ,  H03H9/205 ,  Y10T29/42 ,  H01L2924/00012

摘要： In an elastic wave device, a first electrode structure and a second electrode structure are provided on a piezoelectric substrate, first and second elastic wave element portions are configured by the first electrode structure and the second electrode structure, respectively, and a first bump that is configured of a conductive material to provide shielding is provided on an electrode formation surface of the piezoelectric substrate between the first elastic wave element portion and the second elastic wave element portion.

公开(公告)号：US09397633B2

公开(公告)日：2016-07-19

申请号：US13521816

申请日：2011-01-12

申请人： Hiroaki Ochiai ,  Junya Nishii ,  Tsuyoshi Nakai

发明人： Hiroaki Ochiai ,  Junya Nishii ,  Tsuyoshi Nakai

IPC分类号： H03H9/64 ,  H03H9/10 ,  H03H3/02 ,  H03H9/00 ,  H03H9/02

CPC分类号： H03H9/1092 ,  H01L41/081 ,  H03H3/02 ,  H03H9/0038 ,  H03H9/02905 ,  H03H9/02992 ,  H03H9/15 ,  H03H9/25 ,  H03H9/64 ,  H03H9/6489

摘要： A SAW device (1) comprises a substrate (3); SAW elements (10) on a first main surface (3a) of the substrate (3); first lines (intermediate lines (29) and output side lines (31)) that are disposed upon the first main face (3a) and connected to the SAW elements (10); an insulator (21) that is layered upon the first lines; second lines (a second ground line (33b) and a third ground line (33c)) that are layered upon the insulator (21) and configure three-dimensional wiring parts (39) with the first lines; and a cover (5) that seals the SAW elements (10) and the three-dimensional wiring parts (39). Wiring spaces (53), formed between the first main face (3a) and the cover (5), houses the three-dimensional wiring parts (39), without housing the SAW elements (10).

摘要翻译： SAW器件（1）包括衬底（3）; 在所述基板（3）的第一主表面（3a）上的SAW元件（10）; 布置在第一主面（3a）上并连接到SAW元件（10）的第一线（中间线（29）和输出侧线（31））; 绝缘体（21），其被层叠在第一线上; 第二线（第二接地线（33b）和第三接地线（33c）），其被层叠在绝缘体（21）上，并且构成具有第一线的三维布线部（39） 以及密封SAW元件（10）和三维布线部（39）的盖（5）。 形成在第一主面（3a）和盖（5）之间的接线空间（53）容纳三维布线部（39）而不包含SAW元件（10）。

公开(公告)号：US06911881B2

公开(公告)日：2005-06-28

申请号：US10460299

申请日：2003-06-13

申请人： Daisuke Tamazaki ,  Takeshi Nakao ,  Toshimaro Yoneda

发明人： Daisuke Tamazaki ,  Takeshi Nakao ,  Toshimaro Yoneda

IPC分类号： H03H9/25 ,  H03H9/00 ,  H03H9/02 ,  H03H9/145 ,  H03H9/64

CPC分类号： H03H9/0028 ,  H03H9/02889 ,  H03H9/02905 ,  H03H9/6459

摘要： A surface acoustic wave device has first and second surface acoustic wave filter elements which are arranged on a surface acoustic wave substrate so as to define a filter device having a two-stage configuration. A free surface portion is provided by forming a perforation in an inter-stage connecting portion connecting the first and second surface acoustic wave filter elements.

摘要翻译： 表面声波装置具有布置在表面声波基板上的第一和第二表面声波滤波器元件，以限定具有两级结构的滤波器装置。 通过在连接第一和第二表面声波滤波器元件的级间连接部分中形成穿孔来提供自由表面部分。

公开(公告)号：US5952899A

公开(公告)日：1999-09-14

申请号：US76531

申请日：1998-05-12

申请人： Michio Kadota ,  Takeshi Nadota ,  Toshimaro Yoneda ,  Junya Ago

发明人： Michio Kadota ,  Takeshi Nadota ,  Toshimaro Yoneda ,  Junya Ago

IPC分类号： H03H9/02 ,  H03H9/25 ,  H03H9/64

CPC分类号： H03H9/02905 ,  H03H9/02669 ,  H03H9/6483

摘要： A ladder filter includes a plurality of series arm resonators and a plurality of parallel arm resonators. The series arm resonators are connected in series to form a series arm of a ladder circuit and are located at a first integrated region. Each series arm resonator includes an edge-reflection surface acoustic wave (SAW) resonator which has a piezoelectric material portion and a pair of edges thereof and utilizes a shear horizontal surface acoustic wave to be excited on the piezoelectric material portion. Each of the parallel arm resonators is connected in parallel between the series arm and a ground potential to form a parallel arm of a ladder circuit. Each of the parallel arm resonators includes an edge reflection SAW resonator which has a piezoelectric material portion with a pair of edges thereof and utilizes a shear horizontal surface acoustic wave to be excited on the piezoelectric material portion. The parallel arm resonators include a first group of at least two parallel arm resonators which are located at a second integrated region which is physically isolated from the first integrated region such that the shear horizontal surface acoustic wave excited on the piezoelectric material portion in the first integrated region does not interfere with the shear horizontal type surface acoustic wave excited in the second integrated region.

摘要翻译： 梯形滤波器包括多个串联臂谐振器和多个并联臂谐振器。 串联臂谐振器串联连接形成梯形电路的串联臂并位于第一集成区域。 每个串联臂谐振器包括具有压电材料部分和一对边缘的边缘反射表面声波（SAW）谐振器，并利用剪切水平声波在压电材料部分上被激发。 每个并联臂谐振器并联连接在串联臂和地电位之间，以形成梯形电路的并联臂。 每个并联臂谐振器包括边缘反射SAW谐振器，该边缘反射SAW谐振器具有一个具有一对边缘的压电材料部分，并利用剪切水平声波在压电材料部分上被激发。 并联臂谐振器包括：第一组至少两个并联臂谐振器，其位于与第一集成区域物理隔离的第二集成区域，使得在第一集成区域中的压电材料部分上激发的剪切水平声表面波 区域不干扰在第二集成区域中激发的剪切水平型声表面波。

公开(公告)号：US4647881A

公开(公告)日：1987-03-03

申请号：US795857

申请日：1985-11-07

申请人： Syuichi Mitsutsuka

发明人： Syuichi Mitsutsuka

IPC分类号： H03H9/145 ,  H03H3/08 ,  H03H9/02 ,  H03H9/25

CPC分类号： H03H9/02976 ,  H03H9/02905

摘要： A surface acoustic wave device includes a plurality of surface acoustic wave elements provided on a piezoelectric substrate. The device further includes a metal electrode provided on the piezoelectric substrate between and around the respective elements, and a bias voltage is supplied to the metal electrode to cause local attenuation.

摘要翻译： 表面声波装置包括设置在压电基板上的多个表面声波元件。 该装置还包括在各个元件之间和周围设置在压电基板上的金属电极，并且向金属电极提供偏置电压以引起局部衰减。

公开(公告)号：US4166987A

公开(公告)日：1979-09-04

申请号：US877838

申请日：1978-02-15

申请人： Larry A. Coldren

发明人： Larry A. Coldren

IPC分类号： H03H9/02 ,  H03H9/64 ,  H01P5/18

CPC分类号： H03H9/02905 ,  H03H9/643

摘要： The fingers of a multistrip coupler for surface acoustic waves are weighted in at least one, i.e., input or output, track so as to match a predetermined energy profile for that track. In one embodiment, the weighting is achieved by apodizing the fingers of the multistrip coupler. In another embodiment, each finger is formed in a variable-amplitude zig-zag pattern. The invention is particularly advantageous when used to transversely couple surface acoustic wave resonators.

摘要翻译： 用于表面声波的多段耦合器的指状物在至少一个，即输入或输出轨道中加权，以便匹配该轨道的预定能量曲线。 在一个实施例中，通过对多段耦合器的指状物进行变迹来实现加权。 在另一个实施例中，每个手指形成为可变幅度Z字形图案。 当用于横向耦合表面声波谐振器时，本发明是特别有利的。