Surface emitting laser device and light emitting device including the same

    公开(公告)号:US12080991B2

    公开(公告)日:2024-09-03

    申请号:US17262839

    申请日:2019-07-26

    摘要: An embodiment relates to a surface emitting laser device and a light emitting device including the same. The surface emitting laser device according to an embodiment may comprise: a substrate; a first reflective layer arranged on the substrate; an active layer arranged on the first reflective layer; an aperture layer arranged on the active layer and comprising an opening; a second reflective layer arranged on the active layer; a transparent electrode layer arranged on the second reflective layer; and a metal electrode layer arranged on the transparent electrode layer. The transparent electrode layer may comprise a first area perpendicularly overlapping the opening and multiple second areas extending from the first area. The multiple second areas may be arranged outside the opening along the circumferential direction of the opening and spaced apart from each other. The multiple second areas may be arranged and spaced apart from each other so as to correspond to the circumference of the opening. The metal electrode layer may electrically contact the second reflective layer between the multiple second areas.

    SURFACE-EMITTING LASER DEVICE WITH CONDUCTIVE THIN FILM AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20240283217A1

    公开(公告)日:2024-08-22

    申请号:US18136923

    申请日:2023-04-20

    IPC分类号: H01S5/042 H01S5/183

    CPC分类号: H01S5/04253 H01S5/183

    摘要: A surface-emitting laser device with a conductive thin film includes a first mirror layer, an active layer, a P-type conductive layer, an insulating layer, a thin film structure and a second mirror layer. The active layer is located on the first mirror layer. The P-type conductive layer is located on a surface of a part of the active layer. The insulating layer is located on the first mirror layer and covers the P-type conductive layer, and the insulating layer is provided with a light-emitting hole corresponding to the P-type conductive layer. The thin film structure has conductivity and light transmission. The thin film structure includes a filling part and a covering part. The filling part fills the light-emitting hole and the covering part is located on the insulating layer. The second mirror layer is located on the thin film structure and corresponds to the light-emitting hole.

    Semiconductor laser diode
    8.
    发明授权

    公开(公告)号:US11695253B2

    公开(公告)日:2023-07-04

    申请号:US17720794

    申请日:2022-04-14

    申请人: OSRAM OLED GmbH

    摘要: A semiconductor laser diode is specified, the semiconductor laser diode includes a semiconductor layer sequence having an active layer having a main extension plane and which, in operation, is configured to generate light in an active region and emit light via a light-outcoupling surface, the active region extending from a back surface opposite the light-outcoupling surface to the light-outcoupling surface along a longitudinal direction in the main extension plane, the semiconductor layer sequence having a surface region on which a first cladding layer is applied in direct contact, the first cladding layer having a transparent material from a material system different from the semiconductor layer sequence, and the first cladding layer being structured and having a first structure.

    Semiconductor laser element and method for manufacturing the same

    公开(公告)号:US11881684B2

    公开(公告)日:2024-01-23

    申请号:US17685820

    申请日:2022-03-03

    发明人: Yoshitaka Nakatsu

    摘要: A semiconductor laser element includes: an n-side semiconductor layer formed of a nitride semiconductor; an active layer disposed on or above the n-side semiconductor layer and formed of a nitride semiconductor; a p-side semiconductor layer disposed on the active layer, formed of a nitride semiconductor, and including: an undoped first part disposed in contact with an upper face of the active layer and comprising at least one semiconductor layer, an electron barrier layer disposed in contact with an upper face of the first part, containing a p-type impurity, and having a band gap energy that is larger than a band gap energy of the first part, and a second part disposed in contact with the upper face of the electron barrier layer and comprising at least one p-type semiconductor layer containing a p-type impurity; and a p-electrode disposed in contact with the upper face of the second part.