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公开(公告)号：US09055700B2
公开(公告)日：2015-06-09
申请号：US13059602
申请日：2009-08-11
CPC分类号： H05K3/282 , H01H13/78 , H01H2215/004 , H01H2229/012 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/06 , H01L2224/45014 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45599 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48455 , H01L2224/48463 , H01L2224/48464 , H01L2224/48599 , H01L2224/48699 , H01L2224/8502 , H01L2224/85201 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85484 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/3011 , H05K3/222 , H05K3/284 , H05K3/328 , H05K2201/015 , H05K2201/0179 , H05K2201/0195 , H05K2203/049 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20758
摘要： In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
摘要翻译： 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB还包括附接到基板的至少一个表面的多个导电轨迹。 PCB还包括沉积在衬底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，（ii）包括由卤代烃聚合物形成的至少一层。 PCB还包括至少一个通过焊接接头连接到至少一个导电轨道的电气部件，其中焊接接头通过多层涂层焊接，使得焊接接头邻接多层涂层。
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公开(公告)号：US20110253429A1
公开(公告)日：2011-10-20
申请号：US13059602
申请日：2009-08-11
CPC分类号： H05K3/282 , H01H13/78 , H01H2215/004 , H01H2229/012 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/06 , H01L2224/45014 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45113 , H01L2224/45116 , H01L2224/4512 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/4517 , H01L2224/45171 , H01L2224/45173 , H01L2224/45178 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45599 , H01L2224/45644 , H01L2224/4569 , H01L2224/48091 , H01L2224/48455 , H01L2224/48463 , H01L2224/48464 , H01L2224/48599 , H01L2224/48699 , H01L2224/8502 , H01L2224/85201 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85484 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/3011 , H05K3/222 , H05K3/284 , H05K3/328 , H05K2201/015 , H05K2201/0179 , H05K2201/0195 , H05K2203/049 , Y10T29/49155 , H01L2924/00014 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20758
摘要： In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.
摘要翻译： 在一些实施例中，印刷电路板（PCB）包括包含绝缘材料的基板。 PCB还包括附接到基板的至少一个表面的多个导电轨迹。 PCB还包括沉积在衬底的至少一个表面上的多层涂层。 多层涂层（i）覆盖多个导电轨道的至少一部分，（ii）包括由卤代烃聚合物形成的至少一层。 PCB还包括至少一个通过焊接接头连接到至少一个导电轨道的电气部件，其中焊接接头通过多层涂层焊接，使得焊接接头邻接多层涂层。
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3.发明授权Semiconductor package including a semiconductor device, and method of manufacturing the same 有权包括半导体器件的半导体封装及其制造方法公开(公告)号：US07420129B2
公开(公告)日：2008-09-02
申请号：US11048870
申请日：2005-02-03
申请人： Hyeong-Seob Kim
发明人： Hyeong-Seob Kim
IPC分类号： H01R12/04
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/563 , H01L23/3128 , H01L23/49816 , H01L23/49894 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/13099 , H01L2224/16225 , H01L2224/16237 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/83951 , H01L2224/85444 , H01L2224/85455 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01016 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H05K3/28 , H05K3/385 , H05K2203/0315 , H01L2924/00014 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having one or more supporting layers, a plurality of metal wires that may be formed as a plurality of inner connection pads and a plurality of outer connection pads, an outermost resin layer pattern formed on the surface of the main body, and including a plurality of openings exposing the plurality of outer connection pads, and a metal oxide layer disposed between the plurality of metal wires and the outermost resin layer pattern. The plurality of inner and outer connection pads may be formed on a surface of the main body.
摘要翻译： 公开了半导体封装中使用的半导体器件和半导体器件的制造方法和装置。 半导体器件可以包括具有一个或多个支撑层的主体，可以形成为多个内部连接焊盘的多个金属线和多个外部连接焊盘，最外面的树脂层图案形成在 主体，并且包括暴露多个外连接焊盘的多个开口，以及设置在多个金属线和最外层树脂层图案之间的金属氧化物层。 多个内外连接垫可以形成在主体的表面上。
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4.发明申请Semiconductor package including a semiconductor device, and method of manufacturing the same 有权包括半导体器件的半导体封装及其制造方法公开(公告)号：US20050285230A1
公开(公告)日：2005-12-29
申请号：US11048870
申请日：2005-02-03
申请人： Hyeong-Seob Kim
发明人： Hyeong-Seob Kim
CPC分类号： H01L23/49822 , H01L21/4857 , H01L21/563 , H01L23/3128 , H01L23/49816 , H01L23/49894 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/13099 , H01L2224/16225 , H01L2224/16237 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/83951 , H01L2224/85444 , H01L2224/85455 , H01L2224/85611 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01016 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H05K3/28 , H05K3/385 , H05K2203/0315 , H01L2924/00014 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having one or more supporting layers, a plurality of metal wires that may be formed as a plurality of inner connection pads and a plurality of outer connection pads, an outermost resin layer pattern formed on the surface of the main body, and including a plurality of openings exposing the plurality of outer connection pads, and a metal oxide layer disposed between the plurality of metal wires and the outermost resin layer pattern. The plurality of inner and outer connection pads may be formed on a surface of the main body.
摘要翻译： 公开了半导体封装中使用的半导体器件和半导体器件的制造方法和装置。 半导体器件可以包括具有一个或多个支撑层的主体，可以形成为多个内部连接焊盘的多个金属线和多个外部连接焊盘，最外面的树脂层图案形成在 主体，并且包括暴露多个外连接焊盘的多个开口，以及设置在多个金属线和最外层树脂层图案之间的金属氧化物层。 多个内外连接垫可以形成在主体的表面上。
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