摘要:
A repair circuit includes a fuse set latch array including a plurality of fuse set latches, and configured to store fuse informations in target fuse latches selected among the plurality of fuse set latches in response to fuse latch select signals; a fuse information control unit configured to generate the fuse latch select signals by using boot-up source signals generated by differently combining boot-up mode region select informations according to a region determination signal; and a repair processing unit configured to compare an address inputted from an exterior and the fuse informations, and access a normal memory cell corresponding to the external address or a redundant memory cell.
摘要:
A system for implementing row redundancy in integrated circuit memory devices includes one or more main subarrays having word line, bit line and memory cell devices, each of the one or more main subarrays including a set of support circuitry associated therewith. A discrete, redundant subarray is associated with the main subarrays, and also includes a set of support circuitry associated therewith. A common global bit line is shared by the main subarrays and the redundant subarray, and redundancy steering control circuitry is associated with the main subarrays and the redundant subarray. The redundancy steering control circuitry is configured such that word line activation of the main subarrays and the redundant subarray is performed in parallel with address compare operations performed by the redundancy steering control circuitry.
摘要:
A semiconductor memory device formed on a semiconductor chip comprises a plurality of first memory arrays, a plurality of second memory arrays, a first voltage generator, and a plurality of first bonding pads. The semiconductor chip is divided into a first rectangle region, a second rectangle region, and a third rectangle region and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The plurality of first memory arrays are formed in the first rectangle region. The plurality of second memory arrays are formed in the second rectangle region. The voltage generator and the plurality of first bonding pads are arranged in the third rectangle region. The plurality of first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the plurality of second memory arrays.
摘要:
A semiconductor memory device formed on a semiconductor chip comprises a plurality of first memory arrays, a plurality of second memory arrays, a first voltage generator, and a plurality of first bonding pads. The semiconductor chip is divided into a first rectangle region, a second rectangle region, and a third rectangle region and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The plurality of first memory arrays are formed in the first rectangle region. The plurality of second memory arrays are formed in the second rectangle region. The voltage generator and the plurality of first bonding pads are arranged in the third rectangle region. The plurality of first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the plurality of second memory arrays.
摘要:
A semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. This structure in which the peripheral circuits are arranged at the center portion of the chip permits the longest signal transition paths to be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.
摘要:
A redundancy address decoder for a memory having at least one bank of memory segmented into a plurality of memory blocks. The redundancy address decoder includes a plurality of redundancy comparison circuitry coupled to a respective programmable element block storing addresses that are mapped to redundant memory of a memory plane. The redundancy address decoder further includes redundancy driver select logic coupled to each of the redundancy comparison circuitry to activate a selected one of the redundancy comparison circuitry for comparing a portion of a memory address corresponding to a memory location with the programmed addresses of the respective programmable element blocks, which leads to power reduction for column accesses to the memory device. The selection of the redundancy driver is based on the memory bank in which the memory location is located.
摘要:
The invention relates to a configuration for implementing redundancy for a memory chip, in which a fuse bank is connected to a comparator via a redundancy predecoder so that predecoded addresses can be compared with one another in the comparator and undecoded addresses can be stored in the fuse bank. This provides for a low-power and space-saving design.
摘要:
Herein disclosed is a semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. Thanks to this structure in which the peripheral circuits are arranged at the center portion of the chip, the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.
摘要:
A data register that stores the data corresponding to the selected memory cell in a memory cell array is provided near the memory cell array. A decoder that selects the data from the data register starts decoding in response to an address signal accessing the memory cells in synchronization with a clock signal determining the operation period. In the first half of an operation period of the clock signal, the decoder outputs a signal in response to a signal corresponding to the address signal determined in the preceding operation period. According to the output of the decoder, the data register is selected. In the latter half of the operation period, a signal corresponding to a new address signal for the next operation period is transferred to the decoder. By doing this, the output control signal in the decoder is caused to synchronize with a signal driving an address signal, enabling the proper address to be selected without fail.
摘要:
A semiconductor memory device for driving word lines at high speed has a word line signal generating circuit for receiving a predecoded signal of a row address, and power source supply circuit for supplying the output signal of the word line signal generating circuit to a word line as source power. The device includes a normal word line decoder for receiving the predecoded signal and the output signal of the power source supplying circuit, respectively and for selecting a normal word line; a spare word line decoder for receiving the predecoded signal and the output signal of the power source supply circuit, respectively and for selecting a spare word line; and a redundancy enabling circuit connected to the spare word line decoder and the normal word line decoder for determining whether the normal word line is selected.