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公开(公告)号：US11914308B2
公开(公告)日：2024-02-27
申请号：US18123620
申请日：2023-03-20
CPC分类号： G03F7/7085 , G03F7/70716 , G03F7/70725 , G03F7/70775 , G03F7/70808 , G03F9/70 , G03F9/7015 , G03F9/7019 , G03F9/7049 , G03F9/7084 , G03F9/7088 , G03F7/70633
摘要： A lithographic apparatus having a substrate table, a projection system, an encoder system, a measurement frame and a measurement system. The substrate table has a holding surface for holding a substrate. The projection system is for projecting an image on the substrate. The encoder system is for providing a signal representative of a position of the substrate table. The measurement system is for measuring a property of the lithographic apparatus. The holding surface is along a plane. The projection system is at a first side of the plane. The measurement frame is arranged to support at least part of the encoder system and at least part of the measurement system at a second side of the plane different from the first side.
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公开(公告)号：US11703771B2
公开(公告)日：2023-07-18
申请号：US17773003
申请日：2020-10-12
发明人： Ali Alsaqqa , Fadi El-Ghussein , Lambertus Gerardus Maria Kessels , Roxana Rezvani Naraghi , Krishanu Shome , Timothy Allan Brunner , Sergei Sokolov
CPC分类号： G03F9/7019 , G03F9/7076
摘要： A calibration system includes a plate, a fixed alignment mark, and a variable diffraction grating. The plate is adjacent to a wafer alignment mark disposed on a wafer. The fixed alignment mark is disposed on the plate and is configured to act as a reference mark for an initial calibration of the calibration system. The variable diffraction grating is disposed on the plate and includes a plurality of unit cells configured to form a plurality of variable alignment marks. The variable diffraction grating is configured to calibrate a shift-between-orders of one of the variable alignment marks and the fixed alignment mark.
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公开(公告)号：US20190187566A1
公开(公告)日：2019-06-20
申请号：US16099733
申请日：2017-04-20
IPC分类号： G03F7/20
CPC分类号： G03F7/7085 , G03F7/70633 , G03F7/70716 , G03F7/70725 , G03F7/70775 , G03F7/70808 , G03F9/70 , G03F9/7015 , G03F9/7019 , G03F9/7049 , G03F9/7084 , G03F9/7088
摘要： A lithographic apparatus having a substrate table, a projection system, an encoder system, a measurement frame and a measurement system. The substrate table has a holding surface for holding a substrate. The projection system is for projecting an image on the substrate. The encoder system is for providing a signal representative of a position of the substrate table. The measurement system is for measuring a property of the lithographic apparatus. The holding surface is along a plane. The projection system is at a first side of the plane. The measurement frame is arranged to support at least part of the encoder system and at least part of the measurement system at a second side of the plane different from the first side.
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公开(公告)号：US20190163072A1
公开(公告)日：2019-05-30
申请号：US16098350
申请日：2017-04-05
发明人： Carolus Johannes Catharina SCHOORMANS , Johannes Jacobus Matheus BASELMANS , Engelbertus Antonius Fransiscus VAN DER PASCH , Johannes Aidegonda Theodorus Marie VAN DEN HOMBERG , Maksym Yurllovych SLADKOV , Andreas Johannes Antonius BROUNS , Alexander Viktorovych PADIY
CPC分类号： G03F7/70516 , G03F1/42 , G03F7/70725 , G03F7/70775 , G03F7/7085 , G03F9/7019 , G03F9/7088
摘要： A lithographic method for measuring a position of a target grating with a mask sensor apparatus which comprises a plurality of detector modules each comprising a diffraction grating located at a mask side of a projection system of a lithographic apparatus and an associated detector, the method comprising a first step of measuring first intensities of a combination of diffraction orders diffracted from the target grating while the mask sensor apparatus is moved relatively to the target grating along a first direction; a second step of displacing the mask sensor apparatus relative to the target grating in a second direction, wherein a size of the relative displacement is proportional to a spatial frequency of a potential error; and a third step of measuring second intensities of the combination of diffraction orders diffracted from the target grating while the mask sensor apparatus is moved relatively to the target grating along the first direction.
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5.发明申请公开(公告)号：US20180239851A1
公开(公告)日：2018-08-23
申请号：US15900735
申请日：2018-02-20
发明人： Alexander YPMA , Maurits VAN DER SCHAAR , Georgios TSIROGIANNIS , Leendert Jan KARSSEMEIJER , Chi-Hsiang FAN
CPC分类号： G06F17/5009 , G03F7/70516 , G03F7/70616 , G03F7/70625 , G03F7/70633 , G03F9/7019 , G06N7/005
摘要： A process of calibrating parameters of a stack model used to simulate the performance of measurement structures in a patterning process, the process including: obtaining a stack model used in a simulation of performance of measurement structures; obtaining calibration data indicative of performance of the measurement structures; calibrating parameters of the model by, until a termination condition occurs, repeatedly: simulating performance of the measurement structures with the simulation using a candidate model; approximating the simulation, based on a result of the simulation, with a surrogate function; and selecting a new candidate model based on the approximation.
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6.发明申请公开(公告)号：US20180239267A1
公开(公告)日：2018-08-23
申请号：US15752658
申请日：2016-08-23
发明人： Rene Marinus Gerardus Johan QUEENS , Arend Johannes DONKERBROEK , Pietro ANDRICCIOLA , Ewoud Frank VAN WEST
IPC分类号： G03F9/00
CPC分类号： G03F9/7026 , G03F9/7019 , G03F9/7034 , G03F9/7049 , G03F9/7057 , G03F9/7088 , G03F9/7092
摘要： A lithographic apparatus uses a height sensor to obtain height sensor data representing a topographical variation across a substrate. The height sensor data is used to control focusing of a device pattern at multiple locations across the substrate. A controller identifies one or more first areas where height sensor data is judged to be reliable and one or more second areas where the height sensor data is judged to be less reliable. Substitute height data is calculated for the second areas using height sensor data for the first areas together with prior knowledge of expected device-specific topography. The focusing of the lithographic apparatus is controlled using a combination of the height data from the sensor and the substitute height data.
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公开(公告)号：US20180231900A1
公开(公告)日：2018-08-16
申请号：US15749209
申请日：2016-07-27
CPC分类号： G03F9/7046 , G03F7/70633 , G03F7/70691 , G03F9/7019 , G03F9/7023 , G03F9/7088
摘要： An initialization method including estimating a characteristic of a property of an object based on a plurality of measurements by the sensor of the property using a respective plurality of different measurement parameters, different ones of the measurements using different measurement parameters, the characteristic including a combination of respective outcomes of respective ones of the measurements weighted by a respective weighting coefficient; performing, for each of a plurality of models of the object, each model configured to enable respective simulation of the performing of the measurements, a respective simulation, the respective simulation including simulating the measurements under control of a respective plurality of different simulation parameters to obtain a respective plurality of simulated characteristics of the property, the different simulation parameters being indicative of the different measurement parameters; determining, for each of the models, a respective bias representative of a respective difference between a respective theoretical characteristic of the property in accordance with the respective model and a respective further combination of the simulated characteristics of the property in the respective model, the respective further combination of the simulated characteristics including the weight coefficients, each particular one of the weight coefficients associated with a particular one of the different simulation parameters; using a cost function configured to optimize a correspondence between the simulated characteristic of the property and the theoretical characteristic of the property, the cost function being a function of the respective biases of the models; and optimizing the cost function to derive the weight coefficients from the cost function; and using the weight coefficients and the associated simulation parameters in a controller associated with the sensor.
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8.发明申请公开(公告)号：US20180149981A1
公开(公告)日：2018-05-31
申请号：US15578312
申请日：2016-06-27
发明人： Paul Cornelis Hubertus ABEN , Sanjaysingh LALBAHADOERSING , Jurgen Johnnes Henderikus Maria SCHOONUS
CPC分类号： G03F7/70516 , G03F7/70466 , G03F7/70633 , G03F7/70683 , G03F7/707 , G03F9/7019 , G03F9/708
摘要： A method including: providing a reference substrate with a first mark pattern; providing the reference substrate with a first resist layer on the reference substrate, wherein the first resist layer has a minimal radiation dose needed for development of the first resist; using a reference patterning device to impart a radiation beam with a second mark pattern in its cross-section to form a patterned radiation beam; and exposing a target portion of the first resist layer of the reference substrate n times to said patterned radiation beam to create exposed areas in the target portion of the first resist layer in accordance with the second mark pattern that have been subjected to an accumulated radiation dose above the minimal radiation dose of the first resist layer, wherein n is an integer with a value of at least two.
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公开(公告)号：US20170160647A1
公开(公告)日：2017-06-08
申请号：US15325406
申请日：2015-06-11
IPC分类号： G03F7/20
CPC分类号： G03F7/70516 , G03F1/42 , G03F7/70191 , G03F7/70775 , G03F9/7019 , G03F9/7049 , G03F9/7088
摘要： A measurement method including using multiple radiation poles to illuminate a diffraction grating on a mask at a mask side of a projection system of a lithographic apparatus, coupling at least two different resulting diffraction orders per illumination pole through the projection system, using the projection system to project the diffraction orders onto a grating on a wafer such that a pair of combination diffraction orders is formed by diffraction of the diffraction orders, coupling the combination diffraction orders back through the projection system to detectors configured to measure the intensity of the combination diffraction orders, and using the measured intensity of the combination diffraction orders to measure the position of the wafer grating.
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公开(公告)号：US09442392B2
公开(公告)日：2016-09-13
申请号：US14585457
申请日：2014-12-30
发明人： Yen-Di Tsen , Yi-Ping Hsieh , Chen-Yen Huang , Shin-Rung Lu , Jong-I Mou
IPC分类号： G03F7/20 , G03F9/00 , H01L21/00 , H01L21/027 , H01L21/66
CPC分类号： G03F7/70633 , G03F9/7003 , G03F9/7019 , H01L21/0274 , H01L22/12 , H01L22/20
摘要： A method of processing first and second semiconductor wafers is provided. Each of the first and second semiconductor wafers has a first layer and a second layer over the first layer. A first lithographic process is performed on the first layer over the first semiconductor wafer using a first inter-field correction and a first intra-field correction. An overlay error of the first lithographic process is determined. A second inter-field correction and a second intra-field correction are computed based on the first inter-field correction, the first intra-field correction, and the measured overlay error. A second lithographic process is performed on the second layer over the second semiconductor wafer, based on the second inter-field correction and the second intra-field correction.
摘要翻译： 提供了一种处理第一和第二半导体晶片的方法。 第一和第二半导体晶片中的每一个在第一层上具有第一层和第二层。 使用第一场间校正和第一场内校正在第一半导体晶片上的第一层上执行第一光刻处理。 确定第一光刻工艺的覆盖误差。 基于第一场间校正，第一场校正和测量的重叠误差来计算第二场校正和第二场校正。 基于第二场间校正和第二场内校正，在第二半导体晶片上的第二层上执行第二光刻处理。
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