公开(公告)号：US09745410B2

公开(公告)日：2017-08-29

申请号：US14404560

申请日：2013-05-17

Applicant: Mitsubishi Gas Chemical Company, Inc.

Inventor： Mitsuharu Kitamura ,  Yutaka Matsuura ,  Hisayuki Kuwahara ,  Tomotaka Wada ,  Yuiga Asai

IPC: C08G59/56 ,  C08G59/40 ,  C07C45/50 ,  C07C47/228 ,  C07C45/49 ,  C07C47/542 ,  C09D163/00 ,  C08G59/58 ,  C08G59/42 ,  B01J27/12

CPC classification number: C08G59/56 ,  B01J27/12 ,  C07C45/49 ,  C07C45/50 ,  C07C47/228 ,  C07C47/542 ,  C08G59/4007 ,  C08G59/4223 ,  C08G59/58 ,  C09D163/00

Abstract: There are provided a novel aromatic aldehyde compound capable of providing an epoxy resin coating film and an epoxy resin cured material satisfying all of the excellent surface property (smoothness, gloss), drying property, water resistance, transparency and adhesion, and an epoxy resin curing agent and an epoxy resin composition containing the aromatic aldehyde compound. The aromatic aldehyde has a branched alkyl group having 10 to 14 carbon atoms.

公开(公告)号：US20100210793A1

公开(公告)日：2010-08-19

申请号：US12682052

申请日：2008-09-30

Applicant: Ryo Ogawa ,  Mitsunori Ide ,  Shinsuke Yamada

Inventor： Ryo Ogawa ,  Mitsunori Ide ,  Shinsuke Yamada

IPC: C08L63/00

CPC classification number: H01L23/293 ,  C08G59/184 ,  C08G59/4007 ,  C08G59/58 ,  C09D163/00 ,  C09J163/00 ,  C09K2200/0647 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention is a cyanate-epoxy composite resin composition comprised of a cyanate ester resin (A), an epoxy resin (B), and a latent curing agent (C), characterized in that the latent curing agent (C) is composed of a modified polyamine (c1), a phenol resin (c2) and one or more kind of polycarboxylic acid (c3). The above modified polyamine (c1) is a modified polyamine, which is obtained by the reaction of polyamine compound (c1-1) with epoxy compound (c1-2), containing one or more amino group having an active hydrogen within a molecule.

Abstract translation: 本发明是一种由氰酸酯树脂（A），环氧树脂（B）和潜在性固化剂（C）组成的氰酸酯 - 环氧复合树脂组合物，其特征在于潜在性固化剂（C）由 改性聚胺（c1），酚醛树脂（c2）和一种或多种多元羧酸（c3）。 上述改性多胺（c1）是通过在分子内含有一个以上具有活性氢的氨基的多胺化合物（c1-1）与环氧化合物（c1-2）反应得到的改性多胺。

公开(公告)号：US07282543B2

公开(公告)日：2007-10-16

申请号：US10666358

申请日：2003-09-19

Applicant: William Edward Starner ,  John Phillip Cech

Inventor： William Edward Starner ,  John Phillip Cech

IPC: C08L63/00 ,  B65D85/00

CPC classification number: C09D163/00 ,  C07D303/36 ,  C08G59/28 ,  C08G59/3227 ,  C08G59/50 ,  C08G59/58

Abstract: The present invention relates to polyepoxy resins, methods for making polyepoxy resins water soluble, curable coating compositions, and kits useful in their preparation.

Abstract translation: 本发明涉及聚环氧树脂，制备聚环氧树脂水溶性方法，可固化涂料组合物和用于制备的试剂盒。

公开(公告)号：US20070185244A1

公开(公告)日：2007-08-09

申请号：US11710427

申请日：2007-02-26

Applicant: Martin Spitzer ,  Philip Willis ,  Gunnar Reitmajer

Inventor： Martin Spitzer ,  Philip Willis ,  Gunnar Reitmajer

IPC: C08L63/00 ,  B32B27/38

CPC classification number: H01M8/0226 ,  C08G59/5093 ,  C08G59/58 ,  H01M8/0213 ,  H01M8/0221 ,  Y10T428/25 ,  Y10T428/26

Abstract: Compositions comprising (a) an epoxy resin, (b) a hardener for the epoxy resin, (c) a product of the reaction of a microgel containing carboxylic acid groups and a nitrogen-containing base, and (d) an electrically conducting filler combination comprising, based on the total amount of filler, at least 75% by weight of graphite, are particularly suitable for producing biopolar plates.

Abstract translation: 组合物，其包含（a）环氧树脂，（b）用于环氧树脂的硬化剂，（c）含有羧酸基团的微凝胶和含氮碱的反应产物和（d）导电填料组合 基于填料的总量，包含至少75重量％的石墨，特别适用于生产生物极板。

公开(公告)号：US06916865B2

公开(公告)日：2005-07-12

申请号：US10451977

申请日：2002-08-27

Applicant: Masashi Kumagai ,  Takashi Ouchi ,  Katsuyuki Tsuchida

Inventor： Masashi Kumagai ,  Takashi Ouchi ,  Katsuyuki Tsuchida

IPC: C07B61/00 ,  C07F7/18 ,  C08G59/40 ,  C08G59/42 ,  C08G59/58 ,  C09D5/03 ,  C09D163/00 ,  H05K3/28 ,  C07D213/69 ,  C07D233/72 ,  C07D235/12 ,  C07F7/10 ,  C08K5/11

CPC classification number: C08G59/58 ,  C07F7/1804 ,  C08G59/4238 ,  H05K3/287

Abstract: The present invention provides an organic carboxylate composition that has long working life, cures epoxy resins, and improves adhesive properties, and also provides a method for producing the same. An organic carboxylate composition, obtained by heating and mixing a basic silane coupling agent and an amine compound with a softening point or melting point of 40° C. or greater together with an organic carboxylic acid; a method for producing the same; an additive for epoxy resin that contains this as the active ingredient thereof; and an epoxy resin composition containing the same. The basic silane coupling agent should preferably be a specific imidazole-group containing silane coupling agent, amino group-containing silane coupling agent, dialkylamino group-containing silane coupling agent, monomethylamino group-containing silane coupling agent, benzimidazole group-containing silane coupling agent, benzotriazole group-containing silane coupling agent, and pyridine ring-containing silane coupling agent.

Abstract translation: 本发明提供一种具有长的使用寿命，固化环氧树脂和改善粘合性能的有机羧酸盐组合物，并且还提供了一种制备该组合物的方法。 通过将碱性硅烷偶联剂和软化点或熔点为40℃以上的胺化合物与有机羧酸一起加热混合而获得的有机羧酸盐组合物; 其制造方法; 含有作为其活性成分的环氧树脂添加剂; 和含有该环氧树脂组合物的环氧树脂组合物。 碱性硅烷偶联剂优选为特定的含咪唑基的硅烷偶联剂，含氨基的硅烷偶联剂，含二烷基氨基的硅烷偶联剂，含单甲基氨基的硅烷偶联剂，含苯并咪唑基的硅烷偶联剂， 含有苯并三唑基的硅烷偶联剂和含吡啶环的硅烷偶联剂。

公开(公告)号：US20050065317A1

公开(公告)日：2005-03-24

申请号：US10666358

申请日：2003-09-19

Applicant: William Starner ,  John Cech

Inventor： William Starner ,  John Cech

IPC: C07D303/36 ,  C08G59/28 ,  C08G59/32 ,  C08G59/50 ,  C08G59/58 ,  C08G63/00 ,  C09D163/00

CPC classification number: C09D163/00 ,  C07D303/36 ,  C08G59/28 ,  C08G59/3227 ,  C08G59/50 ,  C08G59/58

Abstract: The present invention relates to polyepoxy resins, methods for making polyepoxy resins water soluble, curable coating compositions, and kits useful in their preparation.

Abstract translation: 本发明涉及聚环氧树脂，制备聚环氧树脂水溶性方法，可固化涂料组合物和用于制备的试剂盒。

公开(公告)号：US20020077421A1

公开(公告)日：2002-06-20

申请号：US09955930

申请日：2001-09-20

Inventor： Kazuaki Sumita ,  Toshio Shiobara

IPC: C08F008/00

CPC classification number: C08G59/4284 ,  C08G59/4215 ,  C08G59/58 ,  H01L21/563 ,  H01L23/293 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  Y10T428/12528 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler is provided, the curing agent (B) comprising 5 to 75 parts by weight of a mixture of 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid and 1-isopropyl-4-methyl-bicyclonull2.2.2nulloct-5-ene-2,3-dicarboxylic acid per 100 parts by weight of the entire curing agent. The composition is adherent to the surface of silicon chips, and especially to polyimide resins and nitride films and has high thermal shock resistance. A semiconductor device sealed with the cured epoxy resin composition remains reliable.

Abstract translation: 提供了包含（A）液体环氧树脂，（B）固化剂，（C）固化促进剂和（D）无机填料）的液体环氧树脂组合物，所述固化剂（B）包含5至75份 重量的3,4-二甲基-6-（2-甲基-1-丙烯基）-1,2,3,6-四氢邻苯二甲酸和1-异丙基-4-甲基 - 双环[2.2.2] 5-烯-2,3-二羧酸/ 100重量份的整个固化剂。 该组合物附着在硅片的表面上，特别是与聚酰亚胺树脂和氮化物膜相粘合，并具有高耐热冲击性。 用固化的环氧树脂组合物密封的半导体器件保持可靠。

公开(公告)号：US5997953A

公开(公告)日：1999-12-07

申请号：US923665

申请日：1997-09-04

Applicant: Leonid Rappoport

Inventor： Leonid Rappoport

IPC: B05D7/24 ,  B05D3/02 ,  B32B9/00 ,  B32B9/04 ,  B32B15/08 ,  C08G59/50 ,  C08G59/58 ,  C09D115/00 ,  C09D163/08 ,  C23C26/00 ,  B50D3/02

CPC classification number: C09D115/00 ,  C08G59/50 ,  C08G59/58 ,  C09D163/08

Abstract: In a protective coating formulation requiring the use of polyamine molecules, oleic acid is used as a very effective additive to remove any excess polyamines. The carboxyl groups of the oleic acid molecules react with the amine groups of the polyamines to form a harmless amide molecule. The oleic acid thus removes excess pollutants from the final coating. In addition, the oleic acid reduces the viscosity of the coating before curing, making it easier to apply to surfaces, and decreases the curing time necessary. However, the addition of oleic acid does not affect the beneficial characteristics of the coating in any way.

Abstract translation: 在需要使用多胺分子的保护性涂料配方中，油酸被用作非常有效的添加剂以除去任何多余的多胺。 油酸分子的羧基与多胺的胺基反应形成无害的酰胺分子。 因此油酸从最终的涂层中除去过量的污染物。 此外，油酸在固化前降低了涂层的粘度，使其更易于涂覆于表面，并降低了固化时间。 然而，油酸的添加不会以任何方式影响涂层的有益特性。

公开(公告)号：US5322864A

公开(公告)日：1994-06-21

申请号：US12466

申请日：1993-02-02

Applicant: Toshio Sugimoto ,  Sadahiko Kawaguchi ,  Akira Esaki

Inventor： Toshio Sugimoto ,  Sadahiko Kawaguchi ,  Akira Esaki

IPC: C08G59/20 ,  C08G59/00 ,  C08G59/50 ,  C08G59/58 ,  C08K3/00 ,  C08K3/08 ,  C08L63/00 ,  C08L63/02

CPC classification number: C08G59/58 ,  C08G59/5073 ,  C08K3/08 ,  Y10T428/2993

Abstract: An epoxy resin composition comprising (a) a low-viscosity epoxy resin having a viscosity of not more than 100 poise at 25.degree. C. which contains a tri- or tetrafunctional liquid aromatic epoxy resin, (b) a liquid curing agent selected from the group consisting of an imidazole compound, the combination of a liquid alicyclic acid anhydride and an imidazole compound, the combination of a liquid alicyclic amine and an imidazole compound, (c) a metal powder having an average particle size of not more than 125 .mu.m or an inorganic powder consisted of 50 parts or more by weight of a metal powder having an average particle size of not more than 125 3/4m and less than 50 parts by weight of an inorganic filler other than a metal powder, whose average particle size is smaller than that of the metal powder, based on the total amount of the metal powder and the inorganic filler. The composition has satisfactory fluidity and provides a cured product having high strength, a small thermal expansion coefficient, excellent heat-resistance and satisfactory surface characteristics. The composition is useful for the production of a resin mold, etc.

Abstract translation: 一种环氧树脂组合物，其包含（a）在25℃下具有不大于100泊的粘度的低粘度环氧树脂，其含有三官能或四官能的液体芳族环氧树脂，（b）液体固化剂，其选自 由咪唑化合物，液体脂环酸酐和咪唑化合物的组合组成的组，液体脂环族胺和咪唑化合物的组合，（c）平均粒径不大于125μm的金属粉末 或由50重量份以上的平均粒径为125 3 /4μm以下且小于50重量份的金属粉末以外的无机填料组成的无机粉末，其平均粒径 基于金属粉末和无机填料的总量小于金属粉末。 该组合物具有令人满意的流动性，并提供具有高强度，小的热膨胀系数，优异的耐热性和令人满意的表面特性的固化产物。 该组合物可用于生产树脂模具等

公开(公告)号：US5057348A

公开(公告)日：1991-10-15

申请号：US558273

申请日：1990-07-25

Applicant: Kieran F. Drain ,  Larry A. Nativi

Inventor： Kieran F. Drain ,  Larry A. Nativi

IPC: B29C35/02 ,  B29C35/08 ,  B29C39/10 ,  B29C70/72 ,  C08F283/10 ,  C08G59/58 ,  C08G59/68 ,  C08L63/00 ,  G01F15/00 ,  G03F7/039 ,  H01B3/30 ,  H01B3/40 ,  H01B3/44 ,  H01C1/028 ,  H01C1/034 ,  H01G2/12 ,  H01G9/08 ,  H05K3/28 ,  H05K5/00

CPC classification number: H01G2/12 ,  B29C35/02 ,  B29C39/10 ,  B29C70/72 ,  C08F283/10 ,  C08G59/58 ,  C08G59/68 ,  C08L63/00 ,  G01F15/006 ,  G03F7/039 ,  H01B3/302 ,  H01B3/40 ,  H01B3/44 ,  H01C1/028 ,  H01C1/034 ,  H01G9/08 ,  H05K5/0095 ,  B29C2035/0827 ,  B29C2035/0833 ,  B29C2791/001 ,  B29C35/08 ,  B29K2033/08 ,  B29K2063/00 ,  B29K2105/0088 ,  B29L2031/3406 ,  H05K3/284 ,  H05K3/287 ,  Y10S428/901 ,  Y10S428/913 ,  Y10T428/239 ,  Y10T428/24917 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31678 ,  Y10T428/31692 ,  Y10T428/31786

Abstract: A device e.g., an electrical or electromechanical assembly (62), comprising a housing (64) with a mechanism (66) disposed therein which is potted by a cured mass of self-leveling liquid composition. The composition comprises an actinic radiation cured first resin component (102) preferably (methacrylate resins, which immobilize the partially cured mass, and a subsequently cured second resin component (100), preferably epoxy resins, which is non-cured under the actinic radiation but curable at ambient or elevated temperature. Depending on the depth of the composition which is to be cured in the housing, it may be desirable to utilize the self-leveling liquid composition as either a single homogeneous mixture of the first and second resin components, or, where the depth of the housing is greater than the depth of UV penetration, as cured mass wherein the first resin component is in a separate and discrete resin layer overlying a lower resin layer containing the second resin component but not the first resin component.

Abstract translation: 一种例如电气或机电组件（62）的装置，包括具有设置在其中的机构（66）的壳体（64），其被自流平液体组合物的固化物料包住。 组合物包含光化辐射固化的第一树脂组分（102），优选（甲基丙烯酸酯树脂，其固定部分固化的物质）和随后固化的第二树脂组分（100），优选环氧树脂，其在光化辐射下未固化，但是 根据要在壳体中固化的组合物的深度，可能希望将自流平液体组合物用作第一和第二树脂组分的单一均匀混合物，或 其中壳体的深度大于紫外线穿透的深度，作为固化物质，其中第一树脂组分位于包含含有第二树脂组分而不是第一树脂组分的下树脂层的分离和分散的树脂层中。