公开(公告)号：US07824534B2

公开(公告)日：2010-11-02

申请号：US10588686

申请日：2005-12-09

Applicant: Katsuyuki Tsuchida ,  Hironori Kobayashi ,  Masashi Kumagai

Inventor： Katsuyuki Tsuchida ,  Hironori Kobayashi ,  Masashi Kumagai

IPC: C25D3/38

CPC classification number: C25D1/04 ,  C25D3/38

Abstract: The object of the present invention is to obtain a low profile electrolytic copper foil with a low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum and, particularly, to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution contains, as an additive, a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.

Abstract translation: 本发明的目的是在使用阴极鼓的电解铜箔制造中，在粗糙表面侧（与光面相反的一侧）获得具有低表面粗糙度的薄型电解铜箔，特别是获得 电解铜箔具有优异的伸长率和拉伸强度，可以进行精细图案化。 另一个目的是获得一种铜电解溶液，其允许在2层柔性基板上均匀镀铜而没有针孔。 该铜电解液含有作为添加剂的具有下述通式（1）表示的特定骨架的化合物，其通过加成反应获得，其中将水加入到分子中具有一个或多个环氧基的化合物：其中 A是环氧化合物残基，n是1以上的整数。

公开(公告)号：US08568856B2

公开(公告)日：2013-10-29

申请号：US11992209

申请日：2006-08-22

Applicant: Katsuyuki Tsuchida ,  Hironori Kobayashi ,  Ryu Murakami ,  Masashi Kumagai

Inventor： Katsuyuki Tsuchida ,  Hironori Kobayashi ,  Ryu Murakami ,  Masashi Kumagai

IPC: D06N7/04

CPC classification number: H05K1/09 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2307/206 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/108 ,  H05K3/28 ,  H05K3/382 ,  H05K3/388 ,  H05K2201/0355 ,  H05K2201/098 ,  H05K2203/0723 ,  Y10T428/24355

Abstract: The invention provides a two-layer flexible substrate free of surface defects and having excellent etching characteristics and adherence to a resist.The two-layer flexible substrate has a copper layer provided on one or both faces of an insulator film without using an adhesive, wherein the surface roughness (Ra) of the copper layer is 0.10 to 0.25 μm, and wherein the average crystal grain size [of copper] is no greater than 0.8 μm at 1 μm from the insulator film in the cross-section of the copper layer. Preferably, the insulator film is a polyimide film.

Abstract translation: 本发明提供一种没有表面缺陷且具有优异的蚀刻特性和对抗蚀剂的粘附性的双层柔性基材。 双层柔性基板在不使用粘合剂的情况下，在绝缘膜的一面或两面上具有铜层，其中铜层的表面粗糙度（Ra）为0.10〜0.25μm，平均结晶粒径[ 的铜]在铜层的截面中距离绝缘体膜1m时不大于0.8μm。 优选地，绝缘膜是聚酰亚胺膜。

公开(公告)号：US07432335B2

公开(公告)日：2008-10-07

申请号：US11444728

申请日：2006-06-01

Applicant: Masashi Kumagai ,  Takashi Ouchi ,  Katsuyuki Tsuchida

Inventor： Masashi Kumagai ,  Takashi Ouchi ,  Katsuyuki Tsuchida

IPC: C08L61/06 ,  C08L63/02

CPC classification number: C08G59/4238 ,  C07F7/1804

Abstract: There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.

Abstract translation: 提供了用作在室温下为固体并具有高储存稳定性的环氧树脂的有效添加剂的组合物及其方法。 本发明的组合物是通过使碱性硅烷偶联剂与有机羧酸反应，首先合成碱性硅烷偶联剂的有机羧酸酯，然后将 所述碱性硅烷偶联剂与对所述碱性硅烷偶联剂或有机羧酸具有良好亲和性且软化点或熔点为40℃以上的化合物。

公开(公告)号：US20070170069A1

公开(公告)日：2007-07-26

申请号：US10588686

申请日：2005-12-09

Applicant: Katsuyuki Tsuchida ,  Hironori Kobayashi ,  Masashi Kumagai

Inventor： Katsuyuki Tsuchida ,  Hironori Kobayashi ,  Masashi Kumagai

IPC: C25D3/38

CPC classification number: C25D1/04 ,  C25D3/38

Abstract: The object of the present invention is to obtain a low profile electrolytic copper foil with low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum, and particularly to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution comprises as an additive a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups: wherein A is an epoxy compound residue and n is an integer of 1 or more.

Abstract translation: 本发明的目的是在使用阴极鼓的电解铜箔制造中，在粗糙表面侧（与光泽面相反侧）获得具有低表面粗糙度的低剖面电解铜箔，特别是获得电解铜 箔具有优异的伸长率和拉伸强度，允许精细图案化。 另一个目的是获得一种铜电解溶液，其允许在2层柔性基板上均匀镀铜而没有针孔。 该铜电解液包含作为添加剂的具有下述通式（1）表示的特定骨架的化合物，其通过加成反应获得，其中将水加入到分子中具有一个或多个环氧基的化合物：其中A为 环氧化合物残基，n为1以上的整数。

公开(公告)号：US20070123681A1

公开(公告)日：2007-05-31

申请号：US10575336

申请日：2004-09-30

Applicant: Hironori Kobayashi ,  Katsuyuki Tsuchida ,  Masashi Kumagai

Inventor： Hironori Kobayashi ,  Katsuyuki Tsuchida ,  Masashi Kumagai

IPC: C08G18/40 ,  C08G18/48

CPC classification number: C08G18/7831 ,  C08G18/289 ,  C08G18/6225 ,  C08K5/5442 ,  C08L75/04 ,  C09D175/04

Abstract: As a resin composition that solves the problems such as unpleasant odor encountered when a tertiary amine compound is used as a catalyst in a reaction of a polyol and a polyisocyanate, and that promotes the curing of these resins and improves adhesion to metals, inorganic materials, and organic materials, the present invention provides a resin composition containing the following components as essential components, (A) a polyol (B) a polyisocyanate (C) a silane coupling agent containing an imidazole group (here, the ratio NCO/OH of the number of isocyanate groups in the polyisocyanate (B) to the number of hydroxyl groups in the polyol (A) in the above composition is from 0.6 to 4.0, and the weight ratio of {(A)+(B)}:(C) is from 100:0.01 to 100:10).

Abstract translation: 作为解决在多元醇与多异氰酸酯的反应中使用叔胺化合物作为催化剂时遇到的令人不愉快的气味，促进这些树脂的固化，提高与金属，无机材料的粘合性等问题的树脂组合物， 和有机材料，本发明提供了含有以下成分作为必要成分的树脂组合物，（A）多元醇（B），多异氰酸酯（C），含有咪唑基的硅烷偶联剂（这里，NCO / 多异氰酸酯（B）中的异氰酸酯基数与上述组成中的多元醇（A）中的羟基数为0.6〜4.0，{（A）+（B：（C））的重量比为 100：0.01〜100：10）。

公开(公告)号：US06916865B2

公开(公告)日：2005-07-12

申请号：US10451977

申请日：2002-08-27

Applicant: Masashi Kumagai ,  Takashi Ouchi ,  Katsuyuki Tsuchida

Inventor： Masashi Kumagai ,  Takashi Ouchi ,  Katsuyuki Tsuchida

IPC: C07B61/00 ,  C07F7/18 ,  C08G59/40 ,  C08G59/42 ,  C08G59/58 ,  C09D5/03 ,  C09D163/00 ,  H05K3/28 ,  C07D213/69 ,  C07D233/72 ,  C07D235/12 ,  C07F7/10 ,  C08K5/11

CPC classification number: C08G59/58 ,  C07F7/1804 ,  C08G59/4238 ,  H05K3/287

Abstract: The present invention provides an organic carboxylate composition that has long working life, cures epoxy resins, and improves adhesive properties, and also provides a method for producing the same. An organic carboxylate composition, obtained by heating and mixing a basic silane coupling agent and an amine compound with a softening point or melting point of 40° C. or greater together with an organic carboxylic acid; a method for producing the same; an additive for epoxy resin that contains this as the active ingredient thereof; and an epoxy resin composition containing the same. The basic silane coupling agent should preferably be a specific imidazole-group containing silane coupling agent, amino group-containing silane coupling agent, dialkylamino group-containing silane coupling agent, monomethylamino group-containing silane coupling agent, benzimidazole group-containing silane coupling agent, benzotriazole group-containing silane coupling agent, and pyridine ring-containing silane coupling agent.

Abstract translation: 本发明提供一种具有长的使用寿命，固化环氧树脂和改善粘合性能的有机羧酸盐组合物，并且还提供了一种制备该组合物的方法。 通过将碱性硅烷偶联剂和软化点或熔点为40℃以上的胺化合物与有机羧酸一起加热混合而获得的有机羧酸盐组合物; 其制造方法; 含有作为其活性成分的环氧树脂添加剂; 和含有该环氧树脂组合物的环氧树脂组合物。 碱性硅烷偶联剂优选为特定的含咪唑基的硅烷偶联剂，含氨基的硅烷偶联剂，含二烷基氨基的硅烷偶联剂，含单甲基氨基的硅烷偶联剂，含苯并咪唑基的硅烷偶联剂， 含有苯并三唑基的硅烷偶联剂和含吡啶环的硅烷偶联剂。

公开(公告)号：US07109273B2

公开(公告)日：2006-09-19

申请号：US10480712

申请日：2003-08-05

Applicant: Katsuyuki Tsuchida ,  Masashi Kumagai

Inventor： Katsuyuki Tsuchida ,  Masashi Kumagai

IPC: C08G65/48

CPC classification number: C09J183/14 ,  C08K5/13 ,  C08L2666/14 ,  C09D7/63 ,  C09K3/10 ,  H01L23/293 ,  H01L23/3142 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: It is an object of the present invention to provide a non-gelling solid silane coupling agent which enhances adhesion of a resin composition to metals and so forth when added to the resin composition, and which has excellent storage stability and molten fluidity.The present invention is a non-gelling, pulverizable, solid silane coupling agent composition composed of a reaction product of the following components. (A) 1 to 40 wt % of a silane coupling agent containing one or more functional groups from among a vinyl group, glycidyl group, styryl group, methacryl group, acryl group, ureido group, chloro alkyl group, mercapto group, and isocyanate group (B) 1 to 40 wt % of a silane coupling agent containing one or more functional groups from among an amino group, dimethylamino group, and imidazole group (C) 50 to 90 wt % of a phenol compound

Abstract translation: 本发明的一个目的是提供一种非胶凝固体硅烷偶联剂，其在添加到树脂组合物中时增强树脂组合物与金属等的粘附性，并且具有优异的储存稳定性和熔融流动性。 本发明是由以下组分的反应产物组成的非凝胶化可粉化固体硅烷偶联剂组合物。 （A）1〜40重量％的乙烯基，缩水甘油基，苯乙烯基，甲基丙烯酰基，丙烯酰基，脲基，氯代烷基，巯基，异氰酸酯基中含有1个以上官能团的硅烷偶联剂 （B）1〜40重量％的含有氨基，二甲基氨基和咪唑基中的一个以上官能团的硅烷偶联剂（C）50〜90重量％的酚化合物

公开(公告)号：US07094845B2

公开(公告)日：2006-08-22

申请号：US10450421

申请日：2002-08-27

Applicant: Masashi Kumagai ,  Takashi Ouchi ,  Katsuyuki Tsuchida

Inventor： Masashi Kumagai ,  Takashi Ouchi ,  Katsuyuki Tsuchida

IPC: C08L61/06 ,  C08L63/02

CPC classification number: C08G59/4238 ,  C07F7/1804

Abstract: There is provided a composition for functioning as an effective additive for an epoxy resin that is a solid at room temperature and has a high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting a good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.

Abstract translation: 提供了用作环氧树脂在室温下为固体并具有高储存稳定性的有效添加剂的组合物及其方法。 本发明的组合物是通过使碱性硅烷偶联剂与有机羧酸反应，首先合成碱性硅烷偶联剂的有机羧酸酯，然后将 碱性硅烷偶联剂与对碱性硅烷偶联剂或有机羧酸具有良好亲和性且软化点或熔点为40℃以上的化合物。

公开(公告)号：US20050165195A1

公开(公告)日：2005-07-28

申请号：US10480712

申请日：2003-08-05

Applicant: Katsuyuki Tsuchida ,  Masashi Kumagai

Inventor： Katsuyuki Tsuchida ,  Masashi Kumagai

IPC: C07F7/04 ,  C07F7/10 ,  C08G8/28 ,  C08K3/00 ,  C08L61/14 ,  C08L101/00 ,  C09D7/12 ,  C09J183/14 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31

CPC classification number: C09J183/14 ,  C08K5/13 ,  C08L2666/14 ,  C09D7/63 ,  C09K3/10 ,  H01L23/293 ,  H01L23/3142 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: It is an object of the present invention to provide a non-gelling solid silane coupling agent which enhances adhesion of a resin composition to metals and so forth when added to the resin composition, and which has excellent storage stability and molten fluidity. The present invention is a non-gelling, pulverizable, solid silane coupling agent composition composed of a reaction product of the following components. (A) 1 to 40 wt % of a silane coupling agent containing one or more functional groups from among a vinyl group, glycidyl group, styryl group, methacryl group, acryl group, ureido group, chloro alkyl group, mercapto group, and isocyanate group (B) 1 to 40 wt % of a silane coupling agent containing one or more functional groups from among an amino group, dimethylamino group, and imidazole group (C) 50 to 90 wt % of a phenol compound

Abstract translation: 本发明的一个目的是提供一种非胶凝固体硅烷偶联剂，其在添加到树脂组合物中时增强树脂组合物与金属等的粘附性，并且具有优异的储存稳定性和熔融流动性。 本发明是由以下组分的反应产物组成的非凝胶化可粉化固体硅烷偶联剂组合物。 （A）1〜40重量％的乙烯基，缩水甘油基，苯乙烯基，甲基丙烯酰基，丙烯酰基，脲基，氯代烷基，巯基，异氰酸酯基中含有1个以上官能团的硅烷偶联剂 （B）1〜40重量％的含有氨基，二甲基氨基和咪唑基中的一个以上官能团的硅烷偶联剂（C）50〜90重量％的酚化合物

公开(公告)号：US06921577B2

公开(公告)日：2005-07-26

申请号：US10169893

申请日：2002-02-19

Applicant: Takashi Ouchi ,  Katsuyuki Tsuchida ,  Masashi Kumagai

Inventor： Takashi Ouchi ,  Katsuyuki Tsuchida ,  Masashi Kumagai

IPC: C08L33/14 ,  C08L63/00 ,  C09D133/14 ,  C09D163/00 ,  C23C26/00 ,  C23F11/173 ,  B32B15/08

CPC classification number: C23C26/00 ,  Y10T428/31511 ,  Y10T428/31529

Abstract: A water-based metal surface treatment agent for the surface treatment of metals including aluminum products such as pre-coated aluminum sheets gives excellent coating film adhesion, flexibility and acid resistance.The water-based metal surface treatment agent contains the following components (1) to (3): (1) A copolymer, containing in a side chain, a diketene or ketoester capable of switching between keto and enol tautomeric forms, and containing at least one hydrophilic side chain containing a cationic group, an anionic group, or a nonionic group; (2) An epoxy resin modified with a phosphoric acid type compound; and (3) A water-soluble curing agent.

Abstract translation: 用于表面处理金属的水性金属表面处理剂，包括铝制品如预涂铝片，提供了优异的涂膜粘附性，柔韧性和耐酸性。 水性金属表面处理剂含有以下成分（1）〜（3）：（1）在侧链中含有能够在酮和烯醇互变异构体之间切换的双烯酮或酮酯的共聚物，至少含有 一个含有阳离子基团，阴离子基团或非离子基团的亲水侧链; （2）用磷酸型化合物改性的环氧树脂; 和（3）水溶性固化剂。