LIGHT CURABLE RESIN COMPOSITION
    9.
    发明申请
    LIGHT CURABLE RESIN COMPOSITION 审中-公开
    光固化树脂组合物

    公开(公告)号:US20170029671A1

    公开(公告)日:2017-02-02

    申请号:US15293957

    申请日:2016-10-14

    摘要: The present application relates to a resin composition and in particular to a light-curable resin composition.It is known to achieve a thixotropic behavior of an adhesive composition by adding an inorganic additive like fumed silica. Adding inorganic additives results in significant particle problems as fumed silica is a solid particle and affects the optical performance of the adhesive composition.In accordance with the invention a particle free resin composition with a thixotropic behavior is provided. The inventive composition comprises a) 30 to 90 wt % of a urethane acrylate oligomer with a molecular weight greater than 15000, b) 2 to 40 wt % of a (meth)acrylate monomer having a benzene ring, and c) 0.2 to 10 wt % of a photo initiator.

    摘要翻译: 本申请涉及树脂组合物,特别涉及光固化树脂组合物。 已知通过添加无机添加剂如热解法二氧化硅来实现粘合剂组合物的触变性能。 添加无机添加剂导致显着的颗粒问题,因为气相二氧化硅是固体颗粒并影响粘合剂组合物的光学性能。 根据本发明,提供了具有触变性能的无颗粒树脂组合物。 本发明的组合物包含a)30-90重量%的分子量大于15000的氨基甲酸酯丙烯酸酯低聚物,b)2-40重量%的具有苯环的(甲基)丙烯酸酯单体,和c)0.2至 10重量%的光引发剂。