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    SURFACE PROCESSING DEVICE
    1.
    发明公开
    SURFACE PROCESSING DEVICE 审中-公开

    公开(公告)号：US20230211458A1

    公开(公告)日：2023-07-06

    申请号：US18085909

    申请日：2022-12-21

    申请人： Fulian Yuzhan Precision Technology Co., Ltd.

    发明人： FENG ZHANG ,  MIN LI ,  XIAO-MING XU ,  BO LONG ,  WEN-CHAO HUANG

    IPC分类号： B24B41/04 ,  B24B47/00

    CPC分类号： B24B41/04 ,  B24B47/00

    摘要： A surface processing device includes a machining mechanism and a driving mechanism driving the machining mechanism to polish a workpiece. The machining mechanism includes a machining assembly and a first transmission shaft eccentrically coupled with the machining assembly at a first end. The first transmission shaft rotates to bring the machining assembly into revolving around the first transmission shaft. The driving mechanism includes a motor connected to a second end of the first transmission shaft for outputting power to the machining mechanism. The surface processing device provides smooth machining without the noise of a pneumatically-powered tool.

    Method and device for the technique of cold microforging any freely formed 3-D surfaces
    3.
    发明授权
    Method and device for the technique of cold microforging any freely formed 3-D surfaces 有权
    任何自由形成的三维表面的冷锻造技术的方法和装置

    公开(公告)号：US08166793B2

    公开(公告)日：2012-05-01

    申请号：US11996756

    申请日：2006-08-09

    申请人： Christian Loecker

    发明人： Christian Loecker

    IPC分类号： B21J15/24

    CPC分类号： B23P9/04 ,  B24B39/00 ,  B24B39/006 ,  B24B47/00 ,  C21D1/02 ,  C21D7/02 ,  C21D7/04 ,  C21D11/00 ,  H01F7/066 ,  H01F7/121 ,  H01F7/16 ,  H02K33/16 ,  H02K33/18 ,  H02P25/024 ,  H02P25/032

    摘要： An electromechanical knocking activated device and method for working and cold-hardening the surface of tools, machine parts, etc. is disclosed. The electromechanical apparatus may include: an impact head which is secured to a support, wherein at least one part of the support is composed of a ferromagnetic material; and at least one coil which is also secured to the support. A magnetic field holds the impact head in a defined position of rest. The coil is may be positioned in the same magnetic field or a second magnetic field, through which an alternating or pulsed current may flow. As a result, the impact head is made to oscillate with a defined impact frequency, impact altitude and zero crossing. The device may be used in combination with a computer aided manufacturing system.

    摘要翻译： 公开了一种用于对工具，机器部件等的表面进行加工和冷硬化的机电爆震激活装置和方法。 机电装置可以包括：冲击头，其被固定到支撑件，其中支撑件的至少一部分由铁磁材料构成; 以及至少一个也固定到支撑件上的线圈。 磁场将冲击头保持在限定的静止位置。 线圈可以位于相同的磁场或第二磁场中，交替或脉冲电流可以通过该磁场流动。 结果，冲击头被制成以规定的冲击频率，冲击高度和过零点振荡。 该装置可以与计算机辅助制造系统结合使用。

    Polishing apparatus and method of reconditioning polishing pad
    4.
    发明授权
    Polishing apparatus and method of reconditioning polishing pad 有权
    抛光装置和修补抛光垫的方法

    公开(公告)号：US07708621B2

    公开(公告)日：2010-05-04

    申请号：US12051156

    申请日：2008-03-19

    申请人： Toshiya Saito

    发明人： Toshiya Saito

    IPC分类号： B24B1/00

    CPC分类号： B24B53/017 ,  B24B47/00

    摘要： This polishing apparatus includes a head that holds a semiconductor wafer, a polishing pad that polishes a surface to be polished of the semiconductor wafer held by the head, and a dresser that reconditions the polishing pad by cutting the polishing pad. The polishing apparatus polishes a surface to be polished of the semiconductor wafer while causing the head and the polishing pad to rotate and reconditions the polishing pad by use of the dresser before and after polishing the surface to be polished. The polishing apparatus of the present invention supports at least two dressers so that the dressers can rotate on their own axes and further includes a dresser oscillator that causes the dressers to oscillate simultaneously on the polishing pad.

    摘要翻译： 该抛光装置包括保持半导体晶片的头部，抛光由头部保持的半导体晶片抛光的表面的抛光垫，以及通过切割抛光垫来重新研磨抛光垫的修整器。 抛光装置在抛光抛光表面之前和之后，通过使用修整器使头部和抛光垫旋转并重新调整抛光垫，抛光半导体晶片的待抛光表面。 本发明的抛光装置支撑至少两个修整器，使得修整器可以在其自身的轴线上旋转，并且还包括修整器振荡器，其使修整器同时在抛光垫上摆动。

    POLISHING APPARATUS AND POLISHING METHOD
    8.
    发明申请
    POLISHING APPARATUS AND POLISHING METHOD 审中-公开

    公开(公告)号：US20170239784A1

    公开(公告)日：2017-08-24

    申请号：US15431062

    申请日：2017-02-13

    申请人： EBARA CORPORATION

    发明人： Kenji KAMIMURA ,  Kenichi KOBAYASHI

    IPC分类号： B24B51/00 ,  B24B41/06 ,  B24B47/00

    CPC分类号： B24B51/00 ,  B24B41/06 ,  B24B47/00

    摘要： A polishing apparatus and a polishing method capable of detecting whether a polishing tool has been brought into contact with a substrate, such as a wafer, and further capable of detecting a position of the polishing tool are disclosed. The polishing apparatus includes a substrate holder configured to hold a substrate, a pressing member configured to press a polishing tool against a surface of the substrate, an actuator configured to apply a pressing force to the pressing member, a motor-drive moving device configured to move the pressing member along the surface of the substrate, and a monitoring device configured to emit an alarm if a motor current supplied to the motor-drive moving device is smaller than a threshold value.

    POLISHING APPARATUS AND METHOD OF RECONDITIONING POLISHING PAD
    9.
    发明申请
    POLISHING APPARATUS AND METHOD OF RECONDITIONING POLISHING PAD 有权
    抛光装置和抛光抛光垫的方法

    公开(公告)号：US20080242199A1

    公开(公告)日：2008-10-02

    申请号：US12051156

    申请日：2008-03-19

    申请人： Toshiya SAITO

    发明人： Toshiya SAITO

    IPC分类号： B24B53/12 ,  B24B29/02

    CPC分类号： B24B53/017 ,  B24B47/00

    摘要： This polishing apparatus includes a head that holds a semiconductor wafer, a polishing pad that polishes a surface to be polished of the semiconductor wafer held by the head, and a dresser that reconditions the polishing pad by cutting the polishing pad. The polishing apparatus polishes a surface to be polished of the semiconductor wafer while causing the head and the polishing pad to rotate and reconditions the polishing pad by use of the dresser before and after polishing the surface to be polished. The polishing apparatus of the present invention supports at least two said dressers so that the dressers can rotate on their own axes and further includes a dresser oscillator that causes the dressers to oscillate simultaneously on the polishing pad.

    摘要翻译： 该抛光装置包括保持半导体晶片的头部，抛光由头部保持的半导体晶片抛光的表面的抛光垫，以及通过切割抛光垫来重新研磨抛光垫的修整器。 抛光装置在抛光抛光表面之前和之后，通过使用修整器使头部和抛光垫旋转并重新调整抛光垫，抛光半导体晶片的待抛光表面。 本发明的抛光装置支撑至少两个所述修整器，使得修整器可以在其自身的轴线上旋转，并且还包括修整器振荡器，其使修整器同时在抛光垫上摆动。

    Grinding-band swaying device for a band grinding machine
    10.
    发明授权
    Grinding-band swaying device for a band grinding machine 失效
    带磨床的磨带摇摆装置

    公开(公告)号：US06881136B1

    公开(公告)日：2005-04-19

    申请号：US10697292

    申请日：2003-10-31

    申请人： Po Chang Chuang

    发明人： Po Chang Chuang

    IPC分类号： B24B21/04 ,  B24B47/00 ,  B24B21/00

    CPC分类号： B24B21/04 ,  B24B47/00

    摘要： A grinding-band swaying device for a band grinding machine includes a motor pivotally connected with a machine base and driving an endless grinding band around two rollers and forming a fulcrum for swaying, a speed-reducing unit and an eccentric wheel. The speed-reducing unit is positioned under the motor, having a shaft connected with the eccentric wheel. An elastic compressing unit is provided between the speed-reducing unit or the motor and the machine base, and then the eccentric wheel is kept to elastically urge the machine base. When the motor together with the speed-reducing unit rotates the eccentric wheel, the speed-reducing unit, the motor and the roller sway regularly with the fulcrum and then the endless grinding band moves forward and also sways regularly synchronously to perform grinding against a work with grinding angles constantly altered to achieve balanced grinding result.

    摘要翻译： 用于带磨床的磨带摇摆装置包括与机座枢转连接的马达，并围绕两个滚筒驱动环形研磨带，并形成摆动支点，减速单元和偏心轮。 减速单元位于马达下方，具有与偏心轮连接的轴。 在减速单元或马达与机座之间设置弹性压缩单元，然后使偏心轮弹性推动机座。 当电动机与减速单元一起旋转偏心轮时，减速单元，电动机和滚子与支点规则地摇摆，然后环形研磨带向前移动，并且同步地同步地摆动以对工作进行研磨 研磨角度不断变化，实现平衡磨削效果。