Polishing mechanism, polishing device, and polishing method

    公开(公告)号:US11883928B2

    公开(公告)日:2024-01-30

    申请号:US17322247

    申请日:2021-05-17

    IPC分类号: B24B9/00 B24B51/00

    CPC分类号: B24B9/00 B24B51/00

    摘要: A mechanism for polishing includes a polishing member, an eccentric member coupled to the polishing member, and a driving member coupled to the eccentric member. The driving member drives the eccentric member to rotate to move the polishing member to reciprocate in the one-dimensional direction, so that when a relative position between the polishing mechanism and the workpiece is fixed, the polishing member polishes a workpiece by translating a polishing surface. A method for the polishing process, applied by a polishing device, is also disclosed. By using the polishing mechanism, the entirety of the polishable surface of the workpiece can be covered, and collapsed edges of the workpiece are avoided.

    LASER PROCESSING DEVICE
    5.
    发明公开

    公开(公告)号:US20240207972A1

    公开(公告)日:2024-06-27

    申请号:US18544809

    申请日:2023-12-19

    IPC分类号: B23K26/06 B23K26/082

    摘要: A laser processing device includes a laser source, a zoom assembly for converging a laser light emitted by the laser source, a scanning galvanometer assembly for receiving the converged laser light exiting from the zoom assembly and emitting the laser light at a preset angle, and a reflection assembly arranged between the scanning galvanometer assembly and a workpiece. The zoom assembly includes a plurality of lens groups, the reflection assembly includes a plurality of reflectors for reflecting the laser light emitted by the scanning galvanometer assembly to the workpiece. A distance between any two lens groups of the plurality of lens groups is adjustable to adjust a position of a principle plane of the zoom assembly, thereby adjusting a focus position reflected to the workpiece.